Transceivers. SN75HVD3082E Datasheet

SN75HVD3082E Datasheet PDF


Part

SN75HVD3082E

Description

Low-Power RS-485 Transceivers

Manufacture

etcTI

Page 30 Pages
Datasheet
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SN75HVD3082E Datasheet
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SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
SNx5HVD308xE Low-Power RS-485 Transceivers, Available in a Small MSOP-8 Package
1 Features
1 Available in a Small MSOP-8 Package
• Meets or Exceeds the Requirements of the
TIA/EIA-485A Standard
• Low Quiescent Power
– 0.3-mA Active Mode
– 1-nA Shutdown Mode
• 1/8 Unit Load up to 256 Nodes on a Bus
• Bus-Pin ESD Protection up to 15 kV
• Industry-Standard SN75176 Footprint
• Failsafe Receiver (Bus Open, Bus Shorted,
Bus Idle)
• Glitch-Free Power-Up and Power-Down Bus
Inputs and Outputs
2 Applications
• Energy Meter Networks
• Motor Control
• Power Inverters
• Industrial Automation
• Building Automation Networks
• Battery-Powered Applications
• Telecommunications Equipment
3 Description
The SNx5HVD308xE devices are half-duplex
transceivers designed for RS-485 data bus networks.
Powered by a 5-V supply, they are fully compliant
with TIA/EIA-485A standard. With controlled transition
times, these devices are suitable for transmitting data
over long twisted-pair cables. SN65HVD3082E and
SN75HVD3082E devices are optimized for signaling
rates up to 200 kbps. The SN65HVD3085E device is
suitable for data transmission up to 1 Mbps, whereas
the SN65HVD3088E device is suitable for
applications that require signaling rates up to
20 Mbps.
These devices are designed to operate with very low
supply current, typically 0.3 mA, exclusive of the load.
When in the inactive-shutdown mode, the supply
current drops to a few nanoamps, which makes these
devices ideal for power-sensitive applications.
The wide common-mode range and high ESD-
protection levels of these devices makes them
suitable for demanding applications such as energy
meter networks, electrical inverters, status and
command signals across telecom racks, cabled
chassis interconnects, and industrial automation
networks where noise tolerance is essential. These
devices match the industry-standard footprint of the
SN75176 device. Power-on-reset circuits keep the
outputs in a high-impedance state until the supply
voltage has stabilized. A thermal-shutdown function
protects the device from damage due to system fault
conditions. The SN75HVD3082E is characterized for
operation from 0°C to 70°C and SN65HVD308xE are
characterized for operation from –40°C to 85°C air
temperature. The D package version of the
SN65HVD3082E has been characterized for
operation from –40°C to 105°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN65HVD3082E
SN65HVD3088E
SOIC (8)
VSSOP (8)
PDIP (8)
4.90 mm × 3.91 mm
3.00 mm × 3.00 mm
9.81 mm × 6.35 mm
SN75HVD3082E
SN65HVD3085E
SOIC (8)
VSSOP (8)
4.90 mm × 3.91 mm
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
RR
RE
DE
DD
A
B RT
AB
AB
A
RT B
RR
RE
DE
DD
R
D
R
D
R RE DE D
R RE DE D
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN75HVD3082E Datasheet
SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics: Driver ............................... 5
6.6 Electrical Characteristics: Receiver ......................... 5
6.7 Power Characteristics ............................................... 6
6.8 Switching Characteristics: Driver .............................. 6
6.9 Switching Characteristics: Receiver.......................... 7
6.10 Typical Characteristics ............................................ 8
7 Parameter Measurement Information ................ 10
8 Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 14
9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application ................................................. 16
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 20
11.1 Layout Guidelines ................................................. 20
11.2 Layout Example .................................................... 20
11.3 Thermal Considerations for IC Packages ............. 21
12 Device and Documentation Support ................. 22
12.1 Device Support...................................................... 22
12.2 Related Links ........................................................ 22
12.3 Receiving Notification of Documentation Updates 22
12.4 Community Resources.......................................... 22
12.5 Trademarks ........................................................... 22
12.6 Electrostatic Discharge Caution ............................ 22
12.7 Glossary ................................................................ 22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (September 2016) to Revision J
Page
• Changed 3.3 V to 5 V on the VCC pin in Figure 25............................................................................................................... 18
Changes from Revision H (August 2015) to Revision I
Page
• Added text to the Description, "The D package version of the SN65HVD3082E has been characterized for operation
from -40°C to 105°C."............................................................................................................................................................. 1
• Changed the Operating free-air temperature for SN65HVD3082E (D package) From: MAX = 85°C To: 105°C in
Recommended Operating Conditions ................................................................................................................................... 4
Changes from Revision G (May 2009) to Revision H
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
• Deleted Dissipation Ratings table .......................................................................................................................................... 1
• Added storage temperature Tstg to Absolute Maximum Ratings table ................................................................................... 3
• Deleted Package Thermal Information table ......................................................................................................................... 6
Changes from Revision F (March 2009) to Revision G
Page
• Added Graph - Driver Rise and Fall Time vs Temperature.................................................................................................... 8
• Added IDLE Bus to the Function Table ................................................................................................................................ 14
• Added Receiver Failsafe section .......................................................................................................................................... 18
2 Submit Documentation Feedback
Copyright © 2009–2017, Texas Instruments Incorporated
Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E


Features Datasheet pdf Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity Reference Design SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD308 8E SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017 SNx5HVD308xE Low-Power RS -485 Transceivers, Available in a Small MSOP-8 Package 1 Features •1 Availa ble in a Small MSOP-8 Package • Meets or Exceeds the Requirements of the TIA /EIA-485A Standard • Low Quiescent Po wer – 0.3-mA Active Mode – 1-nA Shu tdown Mode • 1/8 Unit Load up to 256 Nodes on a Bus • Bus-Pin ESD Protecti on up to 15 kV • Industry-Standard SN 75176 Footprint • Failsafe Receiver ( Bus Open, Bus Shorted, Bus Idle) • Gl itch-Free Power-Up and Power-Down Bus I nputs and Outputs 2 Applications • En ergy Meter Networks • Motor Control Power Inverters • Industrial Autom ation • Building Automation Networks • Battery-Powered Applications • Te lecommunications Equipment 3 Descriptio n The SNx5HVD308xE devices are half-duplex transceivers designed for RS-485 data bus networks. Powere.
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