DRIVER. UC1709 Datasheet

UC1709 Datasheet PDF


Part

UC1709

Description

DUAL HIGH- SPEED FET DRIVER

Manufacture

etcTI

Page 16 Pages
Datasheet
Download UC1709 Datasheet


UC1709 Datasheet
UC1709, UC2709, UC3709
DUAL HIGH- SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
D 1.5 Amp Source/Sink Drive
D Pin Compatible with 0026 Products
D 40 ns Rise and Fall into 1000pF
D Low Quiescent Current
D 5 V to 40 V Operation
D Thermal Protection
description
simplified schematic (only one driver shown)
VCC
5 VOLT
REGULATOR
THERMAL
SENSE
The UC3709 family of power drivers is an
effective low-cost solution to the problem of
providing fast turn-on and off for the
capacitive gates of power MOSFETs. Made
with a high-speed Schottky process, these
devices will provide up to 1.5 A of either
source or sink current from a totem--pole
output stage configured for minimal
cross-conduction current spike.
The UC3709 is pin compatible with the
MMH0026 or DS0026, and while the delay
times are longer, the supply current is much
less than these older devices.
INPUT
A OR B
6k
5.6 V
INPUT
A OR B
GND
UDG--00068
With inverting logic, these units feature complete TTL compatibility at the inputs with an output stage that can
swing over 30 V. This design also includes thermal shutdown protection.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)}
Parameter
DW PACKAGE J PACKAGE
L PACKAGE N PACKAGE
UNIT
Supply Voltage, VCC
Output Current (Source or Sink)
40 40 40 40 V
. . . . . . . . Steady--State
±500
±500
±500
±500
mA
. . . . . . . . Peak Transient
±1.5 ±1.0 ±1.0 ±1.5 A
. . . . . . . . Capacitive Discharge Energy
20 15 15 20 mJ
Digital Inputs}
5.5 5.5 5.5 5.5 V
Power Dissipation at TA = 25°C
Power Dissipation at TC = 25°C
Operating Junction Temperature Range (TJ)
Storage Temperature Range
1
3
--55 to 125
--65 to 150
1
2
--55 to 125
--65 to 150
1
2
--55 to 125
--65 to 150
1
3
--55 to 125
--65 to 150
W
W
°C
°C
Lead Temperature (Soldering, 10 Seconds)
300 300 300 300 °C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All currents are positive into and negative out of the specified terminals. Digital drive can exceed 5.5V if input is limited to 10mA. Consult the
Packaging Section of the Databook for thermal limitations and considerations of the package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
Copyright © 2004 -- 2008, Texas Instruments Incorporated
1

UC1709 Datasheet
UC1709, UC2709, UC3709
DUAL HIGH- SPEED FET DRIVER
SLUS196C -- NOVEMBER 1996 -- REVISED FEBRUARY 2008
THERMAL RESISTANCE TABLE
PACKAGE
θjc(°C/W)
θja(°C/W)
SOIC--16 (DW)
20 (1)
35 to 58 (3)
DIL--16 (J)
28 (2)
125 to 160
LCC--16 (L)
20 (2)
70 to 80
DIL--16 (N)
45
90 (3)
NOTES: (1) Specified thermal resistance is θjl (junction to lead)where noted.
(2) θjc data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states, “The baseline values
shown are worst case (mean +2s) for a 60x60 mil microcircuit device silicon die and applicable for devices
with die sizes up to 14400 square mils. For device die sizes greater than 14400 square mils use the
following values; dual-in-line, 11°C/W; flat pack, .10°C/W; pin grid array, 10°C/W”.
(3) Specified θja (junction to ambient) is for devices mounted to 5-inch2 FR4 PC board with one ounce copper
where noted. When resistance range is given, lower values are for 5 inch2 aluminum PC board. Test PWB
was 0.062 inch thick and typically used 0.635-mm trace widths for power packages and 1.3-mm trace
widths for non-power packages with a 100-mil x 100-mil probe land area at the end of each trace.
LCC--20 (TOP VIEW)
L PACKAGES
8 PIN DIL N OR J PACKAGE
(TOP VIEW)
SOIC--16 (TOP VIEW)
DW PACKAGE
3 2 1 20 19
N/C 4
18 N/C
N/C 5
17 N/C
GROUND 6
N/C 7
16 VCC
15 N/C
N/C 8
14 N/C
9 10 11 12 13
N/C
INPUT A
GROUND
INPUT B
1
2
3
4
8 N/C
7 OUTPUT A
6 VCC
5 OUTPUT B
N/C 1
N/C 2
N/C 3
N/C -- No internal connection
OUTPUT A 4
N/C 5
INPUT A 6
N/C 7
GROUND 8
16 VCC
15 N/C
14 N/C
13 OUTPUT B
12 N/C
11 INPUT B
10 N/C
9 N/C
2 www.ti.com


Features Datasheet pdf UC1709, UC2709, UC3709 DUAL HIGH- SPEED FET DRIVER SLUS196C -- NOVEMBER 1996 - - REVISED FEBRUARY 2008 D 1.5 Amp Sour ce/Sink Drive D Pin Compatible with 002 6 Products D 40 ns Rise and Fall into 1 000pF D Low Quiescent Current D 5 V to 40 V Operation D Thermal Protection des cription simplified schematic (only on e driver shown) VCC 5 VOLT REGULATOR THERMAL SENSE The UC3709 family of pow er drivers is an effective low-cost sol ution to the problem of providing fast turn-on and off for the capacitive gate s of power MOSFETs. Made with a high-sp eed Schottky process, these devices wil l provide up to 1.5 A of either source or sink current from a totem--pole outp ut stage configured for minimal cross-c onduction current spike. The UC3709 is pin compatible with the MMH0026 or DS00 26, and while the delay times are longe r, the supply current is much less than these older devices. INPUT A OR B 6k 5.6 V INPUT A OR B GND UDG--00068 Wi th inverting logic, these units feature complete TTL compatibil.
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