Linear Regulator. TPS720 Datasheet

TPS720 Regulator. Datasheet pdf. Equivalent


Part TPS720
Description RF Low-Dropout Linear Regulator
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TPS720
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Now
Technical
Documents
Tools &
Software
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TPS720
SBVS100E – JUNE 2008 – REVISED SEPTEMBER 2015
TPS720 350 mA, Ultra-Low VIN, RF Low-Dropout Linear Regulator With Bias Pin
1 Features
1 350-mA High-Performance LDO
• Low Quiescent Current: 38 μA
• Excellent Load Transient Response:
±15 mV for ILOAD = 0 mA to 350 mA in 1 μs
• Excellent Line Transient Response:
ΔVOUT = ±2 mV for ΔVBIAS = ±600 mV in 1 μs
ΔVOUT = ±200 μV for ΔVIN = ±400 mV in 1 μs
• Low Noise: 48 μVRMS (10 Hz to 100 kHz)
• 80 dB VIN PSRR (10 Hz to 10 kHz)
• 70 dB VBIAS PSRR (10 Hz to 10 kHz)
• Fast Start-Up Time: 140 μs
• Built-In Soft-Start With Monotonic VOUT Rise and
Start-Up Current Limited to 100 mA + ILOAD
• Overcurrent and Thermal Protection
• Low Dropout: 110 mV at ILOAD = 350 mA
• Stable with 2.2-μF Output Capacitor
• Available in 1.33 mm × 0.96 mm DSBGA-5 and 2
mm × 2 mm SON-6 Packages
2 Applications
• Digital Cameras
• Cellular Camera Phones
• Wireless LAN
• Handheld Products
3 Description
The TPS720 family of dual rail, low-dropout linear
regulators (LDOs) offers outstanding ac performance
(PSRR, load and line transient response), while
consuming a very low quiescent current of 38 μA.
The VBIAS rail that powers the control circuit of the
LDO draws very low current (on the order of the
quiescent current of the LDO) and can be connected
to any power supply that is equal to or greater than
1.4 V above the output voltage. The main power path
is through VIN, which can be a lower voltage than
VBIAS; it can be as low as VOUT + VDO, increasing the
efficiency of the solution in many power-sensitive
applications. For example, VIN can be an output of a
high-efficiency, DC-DC step-down regulator.
The TPS720 supports a novel feature in which the
output of the LDO regulates under light loads when
the IN pin is left floating. The light-load drive current
is sourced from VBIAS under this condition. This
feature is particularly useful in power-saving
applications where the DC-DC converter connected
to the IN pin is disabled but the LDO is still required
to regulate the voltage to a light load.
The TPS720 is stable with ceramic capacitors and
uses an advanced BICMOS fabrication process that
yields a dropout of 110 mV at a 350-mA output load.
The TPS720 has the unique feature of providing a
monotonic VOUT rise (overshoot limited to 3%) with
VIN inrush current limited to 100 mA + ILOAD with an
output capacitor of 2.2 μF.
The TPS720 uses a precision voltage reference and
feedback loop to achieve overall accuracy of 2% over
load, line, process, and temperature extremes. An
ultra-small DSBGA package makes the TPS720 ideal
for handheld applications. The TPS720 is also
available in a SON-8 package. This family of devices
is fully specified over the temperature range of
TJ = –40°C to 125°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS720
DSBGA (5)
SON (6)
1.36 mm × 0.96 mm
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
VBATT
CBIAS
Standalone
dc/dc
Converter
or PMU
1.8 V
CIN
BIAS
IN OUT
TPS720xx
EN GND
1.3 V
VEN
VCORE
COUT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



TPS720
TPS720
SBVS100E – JUNE 2008 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application .................................................. 15
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
10.3 Thermal Considerations ........................................ 17
10.4 Power Dissipation ................................................. 18
11 Device and Documentation Support ................. 19
11.1 Device Support .................................................... 19
11.2 Documentation Support ........................................ 19
11.3 Community Resources.......................................... 19
11.4 Trademarks ........................................................... 19
11.5 Electrostatic Discharge Caution ............................ 19
11.6 Glossary ................................................................ 19
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
12.1 Package Mounting ................................................ 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (August 2009) to Revision E
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changes from Revision C (September, 2008) to Revision D
Page
• Added electrical specifications for DRV package ................................................................................................................... 5
• Noted electrical specifications for YZU package .................................................................................................................... 5
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