HD3SS3212 Mux/Demux Datasheet

HD3SS3212 Datasheet PDF, Equivalent


Part Number

HD3SS3212

Description

Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux

Manufacture

etcTI

Total Page 27 Pages
Datasheet
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HD3SS3212
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HD3SS3212, HD3SS3212I
SLASE74F – MAY 2015 – REVISED SEPTEMBER 2016
HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux
1 Features
1 Provides MUX/DEMUX Solution for USB Type-
C™ Ecosystem for USB 3.1 Gen 1 and Gen 2
Data Rates
• Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS,
and PCIE Gen II, III
• Operates up to 10 Gbps
• Wide –3-dB Differential BW of over 8 GHz
• Excellent Dynamic Characteristics (at 5 GHz)
– Crosstalk = –32 dB
– Off Isolation = –19 dB
– Insertion Loss = –1.6 dB
– Return Loss = –12 dB
• Bidirectional "Mux/De-Mux" Differential Switch
• Supports Common Mode Voltage 0 to 2 V
• Single Supply Voltage VCC of 3.3 V
• Commercial Temperature Range of 0°C to 70°C
(HD3SS3212RKS)
• Industrial Temperature Range of –40°C to 85°C
(HD3SS3212IRKS)
2 Applications
• USB Type-C™ Ecosystem
• Desktop and Notebook PCs
• Server/Storage Area Networks
• PCI Express Backplanes
• Shared I/O Ports
• FPDLinkII and FPDLinkIII Switching
SPACE
Simplified Schematic
3 Description
The HD3SS3212 is a high-speed bidirectional
passive switch in mux or demux configurations suited
for USB Type-C™ application supporting USB 3.1
Gen 1 and Gen 2 data rates. Based on control pin
SEL, the device provides switching on differential
channels between Port B or Port C to Port A.
The HD3SS3212 is a generic analog differential
passive switch that can work for any high-speed
interface applications requiring a common mode
voltage range of 0 to 2 V and differential signaling
with differential amplitude up to 1800 mVpp. It
employs adaptive tracking that ensures the channel
remains unchanged for the entire common mode
voltage range.
Excellent dynamic characteristics of the device allow
high-speed switching with minimum attenuation to the
signal eye diagram with very little added jitter. It
consumes <2 mW of power when operational and
has a shutdown mode exercisable by OEn pin
resulting <20 µW.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
HD3SS3212
HD3SS3212I
VQFN (20)
2.50 mm × 4.50 mm ×
0.5-mm pitch
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Pinout
B0+
B0±
A0+
A0±
C0+
C0±
SEL
B1+
B1±
A1+
A1±
C1+
C1±
OEn 2
A0p 3
A0n 4
GND 5
VCC 6
A1p 7
A1n 8
SEL 9
1
20
19 B0p
18 B0n
17 B1p
16 B1n
15 C0p
14 C0n
13 C1p
12 C1n
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

HD3SS3212
HD3SS3212, HD3SS3212I
SLASE74F – MAY 2015 – REVISED SEPTEMBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions ......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 High-Speed Performance Parameters ...................... 6
7.7 Switching Characteristics .......................................... 7
8 Parameter Measurement Information .................. 7
9 Detailed Description .............................................. 9
9.1 Overview ................................................................... 9
9.2 Functional Block Diagram ......................................... 9
9.3 Feature Description................................................... 9
9.4 Device Functional Modes........................................ 10
10 Application and Implementation........................ 11
10.1 Application Information.......................................... 11
10.2 Typical Applications .............................................. 14
10.3 Systems Examples................................................ 15
11 Power Supply Recommendations ..................... 18
12 Layout................................................................... 18
12.1 Layout Guidelines ................................................. 18
12.2 Layout Example .................................................... 18
13 Device and Documentation Support ................. 19
13.1 Related Links ........................................................ 19
13.2 Receiving Notification of Documentation Updates 19
13.3 Community Resources.......................................... 19
13.4 Trademarks ........................................................... 19
13.5 Electrostatic Discharge Caution ............................ 19
13.6 Glossary ................................................................ 19
14 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (May 2016) to Revision F
Page
• Deleted text "Internally tied to GND via 100-kresistor." from the SEL pin in the Pin Functions table ................................ 4
Changes from Revision D (March 2016) to Revision E
Page
• Changed Features From: Single Supply Voltage VCC of 3.3 V ±10% To: Single Supply Voltage VCC of 3.3 V .................... 1
• Changed text "HD3SS3212 requires 3.3-V ±10%" To: "HD3SS3212 requires 3.3-V" in the Design Requirements
section .................................................................................................................................................................................. 14
• Changed Figure 11, moved 0.1 µF capacitors From: pins 7 and 8 To: pins 3 and 4........................................................... 15
Changes from Revision C (January 2016) to Revision D
Page
• Changed the VCC MIN value From: 3 V To: 2.7 V in Recommended Operating Conditions ................................................. 5
Changes from Revision B (January 2016) to Revision C
Page
• Changed the PINOUT image - pin 1 From: NC To: RSVD1 and pin 10 From: NC To: RSVD2 ........................................... 1
• Changed pin 1 From: NC To: RSVD1 , changed pin 10 From: NC To: RSVD2, and updated the Description in the
Pin Functions table ................................................................................................................................................................. 5
Changes from Revision A (August 2015) to Revision B
Page
• Changed the Vih MIN value From: 2 V To: 1.7 V in Recommended Operating Conditions .................................................. 5
2 Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HD3SS3212 HD3SS3212I


Features Product Folder Sample & Buy Technical Documents Tools & Software Support & Community HD3SS3212, HD3SS3212I SLASE7 4F – MAY 2015 – REVISED SEPTEMBER 2 016 HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux 1 Features 1 Provides MUX/DEMUX Solution for USB TypeC™ Ecosystem for USB 3.1 Gen 1 a nd Gen 2 Data Rates • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PC IE Gen II, III • Operates up to 10 Gb ps • Wide –3-dB Differential BW of over 8 GHz • Excellent Dynamic Charac teristics (at 5 GHz) – Crosstalk = 32 dB – Off Isolation = –19 dB – Insertion Loss = –1.6 dB – Return Loss = –12 dB • Bidirectional "Mux/ De-Mux" Differential Switch • Support s Common Mode Voltage 0 to 2 V • Sing le Supply Voltage VCC of 3.3 V • Comm ercial Temperature Range of 0°C to 70 C (HD3SS3212RKS) • Industrial Temper ature Range of –40°C to 85°C (HD3SS 3212IRKS) 2 Applications • USB Type -C™ Ecosystem • Desktop and Notebook PCs • Server/Storage Area Networks • PCI Express Backplanes • Shared I/O Ports.
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