Humidity Sensor. HDC1000 Datasheet

HDC1000 Sensor. Datasheet pdf. Equivalent

Part HDC1000
Description High Accuracy Digital Humidity Sensor
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HDC1000
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
HDC1000
SNAS643C – JULY 2014 – REVISED JANUARY 2016
HDC1000 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features
1 Relative Humidity (RH) Operating Range 0% to
100%
• 14 Bit Measurement Resolution
• Relative Humidity Accuracy ±3%
• Temperature Accuracy ±0.2 °C
• 200 nA Sleep Mode Current
• Average Supply Current:
– 820 nA @ 1sps, 11 bit RH Measurement
– 1.2 µA @ 1sps, 11 bit RH and Temperature
Measurement
• Supply Voltage 3 V to 5 V
• Tiny 2 mm x 1.6 mm Device Footprint
• I2C Interface
2 Applications
• HVAC
• Smart Thermostats and Room Monitors
• White Goods
• Printers
• Handheld Meters
• Medical Devices
• Cargo Shipping
• Automotive Windshield Defog
• Wearable Devices
• Mobile Devices
3 Description
The HDC1000 is a digital humidity sensor with
integrated temperature sensor that provides excellent
measurement accuracy at very low power. The
device measures humidity based on a novel
capacitive sensor. The humidity and temperature
sensors are factory calibrated. The innovative
WLCSP (Wafer Level Chip Scale Package) simplifies
board design with the use of an ultra-compact
package. The sensing element of the HDC1000 is
placed on the bottom part of the device, which makes
the HDC1000 more robust against dirt, dust, and
other environmental contaminants. The HDC1000 is
functional within the full -40°C to +125°C temperature
range.
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
HDC1000
DSBGA (8-bump)
YPA
2.04 mm x 1.59 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Typical Application
3.3V
3.3V
3.3V
RH
TEMPERATURE
HDC1000
ADC
Registers
+
Logic
VDD
SDA
SCL
I2C
DRDYn
ADR0
ADR1
OTP
Calibration Coefficients
GND
GPIO
MCU
I2C
Peripheral
VDD
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



HDC1000
HDC1000
SNAS643C – JULY 2014 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Typical Application ................................................ 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 I2C Interface Electrical Characteristics ..................... 7
7.7 I2C Interface Timing Requirements ........................ 7
7.8 Typical Characteristics .............................................. 8
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 10
8.5 Programming........................................................... 11
8.6 Register Map .......................................................... 15
9 Application and Implementation ........................ 18
9.1 Application Information............................................ 18
9.2 Typical Application ................................................. 18
9.3 Do's and Don'ts ...................................................... 19
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 20
11.1 Layout Guidelines ................................................. 20
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 23
12.1 Documentation Support ........................................ 23
12.2 Community Resources.......................................... 23
12.3 Trademarks ........................................................... 23
12.4 Electrostatic Discharge Caution ............................ 23
12.5 Glossary ................................................................ 23
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
5 Revision History
Changes from Revision B (September 2015) to Revision C
Page
• Deleted soldering recovery procedure and added hydration procedure ............................................................................. 20
Changes from Revision A (November 2014) to Revision B
Page
• Deleted references to operational and functional temperature range. .................................................................................. 1
• Added YPA package name ................................................................................................................................................... 1
• Added Storage Temperature to Absolute Maximum Ratings table. ....................................................................................... 5
• Changed Handling Ratings table title to ESD Ratings .......................................................................................................... 5
• Changed temperature range for the humidity sensor ............................................................................................................ 5
• Added RH to standard conditions .......................................................................................................................................... 6
• Changed RH accuracy .......................................................................................................................................................... 6
• Added reference to Figure 2 for RH accuracy ....................................................................................................................... 6
• Added condition for hysteresis spec ...................................................................................................................................... 6
• Changed the recommended operating range ........................................................................................................................ 6
• Changed Figure 2 .................................................................................................................................................................. 8
• Changed : register reference for battery monitoring was corrected .................................................................................... 10
• Added alternative recovery procedure for soldering ............................................................................................................ 20
• Added Community Resources Section................................................................................................................................. 23
Changes from Original (JULY 2014) to Revision A
Page
• Changed Datasheet's title ...................................................................................................................................................... 1
• Changed description .............................................................................................................................................................. 1
• Changed package description ............................................................................................................................................... 4
• Added heater consumption .................................................................................................................................................... 6
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