Humidity Sensor. HDC1050 Datasheet

HDC1050 Sensor. Datasheet pdf. Equivalent

HDC1050 Datasheet
Recommendation HDC1050 Datasheet
Part HDC1050
Description High Accuracy Digital Humidity Sensor
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Texas Instruments HDC1050
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
HDC1050
SNAS658C – MAY 2015 – REVISED DECEMBER 2015
HDC1050 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features
1 Relative Humidity Accuracy ±3% (typical)
• Temperature Accuracy ±0.2°C (typical)
• 14 Bit Measurement Resolution
• 100 nA Sleep Mode Current
• Average Supply Current:
– 710 nA @ 1sps, 11 bit RH Measurement
– 1.3 µA @ 1sps, 11 bit RH and Temperature
Measurement
• Supply Voltage 2.7 V to 5.5 V
• Small 3 mm x 3 mm Device Footprint
• I2C Interface
2 Applications
• HVAC
• Smart Thermostats and Room Monitors
• White Goods
• Printers
• Handheld Meters
• Medical Devices
• Wireless Sensor (TIDA-00374)
3 Description
The HDC1050 is a digital humidity sensor with
integrated temperature sensor that provides excellent
measurement accuracy at very low power. The
HDC1050 operates over a wide supply range, and is
a low cost, low power alternative to competitive
solutions in a wide range of common applications.
The humidity and temperature sensors are factory
calibrated.
PART
NUMBER
HDC1050
Device Information (1)
PACKAGE
BODY SIZE (NOM)
PWSON (6-pin) DMB
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Typical Application
3.3V
3.3V
3.3V
RH
TEMPERATURE
HDC1050
ADC
Registers
+
Logic
VDD
SDA
SCL
I2C
OTP
Calibration Coefficients
GND
MCU
I2C
Peripheral
VDD
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments HDC1050
HDC1050
SNAS658C – MAY 2015 – REVISED DECEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Typical Application ................................................ 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 I2C Interface Electrical Characteristics ..................... 6
7.7 I2C Interface Timing Requirements ........................ 6
7.8 Typical Characteristics .............................................. 7
8 Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes.......................................... 9
8.5 Programming........................................................... 10
8.6 Register Map .......................................................... 14
9 Application and Implementation ........................ 17
9.1 Application Information............................................ 17
9.2 Typical Application ................................................. 17
9.3 Do's and Don'ts ...................................................... 18
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................ 19
11.2 Layout Example .................................................... 19
12 Device and Documentation Support ................. 20
12.1 Documentation Support ........................................ 20
12.2 Community Resources.......................................... 20
12.3 Trademarks ........................................................... 20
12.4 Electrostatic Discharge Caution ............................ 20
12.5 Glossary ................................................................ 20
13 Mechanical, Packaging, and Orderable
Information ........................................................... 20
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (July 2015) to Revision C
Page
• Changed Recovery From Soldering section to Hydration Procedure section. ..................................................................... 18
Changes from Revision A (July 2015) to Revision B
Page
• Added range for Temp sensor only ........................................................................................................................................ 4
• Added operating range for RH sensor ................................................................................................................................... 4
• Added RH condition ............................................................................................................................................................... 5
• Added RH range condition .................................................................................................................................................... 5
• Added long term drift spec .................................................................................................................................................... 5
• Changed recommended operating range. ............................................................................................................................. 5
• Changed Figure 2 .................................................................................................................................................................. 7
• Changed soldering recovery temperature ........................................................................................................................... 18
Changes from Original (July 2015) to Revision A
Page
• Added product preview to full datasheet ............................................................................................................................... 1
2 Submit Documentation Feedback
Product Folder Links: HDC1050
Copyright © 2015, Texas Instruments Incorporated



Texas Instruments HDC1050
www.ti.com
6 Pin Configuration and Functions
HDC1050
SNAS658C – MAY 2015 – REVISED DECEMBER 2015
DMB Package
6 Pin PWSON
Top View
Top View
SDA 1
6 SCL
GND 2
NC 3
RH
SENSOR
5 VDD
4 NC
NAME
SDA
GND
NC
VDD
SCL
DAP
PIN
NO.
1
2
3,4
5
6
DAP
Pin Functions
I/O TYPE(1) DESCRIPTION
I/O Serial data line for I2C, open-drain; requires a pull-up resistor to VDD
G Ground
- These pins may be left floating, or connected to GND
P Supply Voltage
I Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD
G Die Attach Pad. Should be left floating. (On bottom of the device, not shown in the figure)
(1) P=Power, G=Ground, I=Input, O=Output
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: HDC1050
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