DC/DC CONVERTER. bq25011 Datasheet

bq25011 CONVERTER. Datasheet pdf. Equivalent

bq25011 Datasheet
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Part bq25011
Description SINGLE-CHIP CHARGER AND DC/DC CONVERTER
Feature bq25011; www.ti.com bq25010 bq25011 bq25012 SLUS615B – DECEMBER 2004 – REVISED JULY 2007 SINGLE-CHIP CHARGE.
Manufacture etcTI
Datasheet
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Texas Instruments bq25011
www.ti.com
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR PORTABLE APPLICATIONS
(bq2501x)
FEATURES
1
2 Li-Ion Or Li-Pol Charge Management and
Synchronous DC-DC Power Conversion In a
Single Chip
Optimized for Powering Bluetooth™ Headsets
and Accessories
Charges and Powers the System from Either
the AC Adapter or USB with Autonomous
Power Source Selection
Integrated USB Charge Control with
Selectable 100 mA and 500 mA Charge Rates
Integrated Power FET and Current Sensor for
Up to 500 mA Charge Applications AND
100 mA DC-DC Controller with Integrated
FETs
Reverse Leakage Protection Prevents Battery
Drainage
Automatic Power Save Mode For High
Efficiency at Low Current, or Forced PWM for
Frequency Sensitive Applications
3.5 mm × 4.5 mm QFN Package
APPLICATIONS
Bluetooth™ Headsets
Bluetooth™ Accessories
Low-Power Handheld Devices
DESCRIPTION
The bq2501x series are highly integrated charge and
power management devices targeted at space-limited
bluetooth applications. The bq2501x series offer
integrated power FET and current sensor for charge
control, reverse blocking protection, high accuracy
current and voltage regulation, charge status, charge
termination, and a highly efficient and low-power
dc-dc converter in a small package.
The bq2501x charges the battery in three phases:
conditioning, constant current and constant voltage.
Charge is terminated based on minimum current. An
internal charge timer provides a backup safety feature
for charge termination. The bq2501x automatically
re-starts the charge if the battery voltage falls below
an internal threshold. The bq2501x automatically
enters sleep mode when VCC supply is removed.
The integrated low-power high-efficiency dc-dc
converter is designed to operate directly from a
single-cell Li-Ion or Li-Pol battery pack. The output
voltage is either adjustable from 0.7 V to VBAT
(bq25010), fixed at 3.3 V (bq25011), or fixed at 1.8 V
(bq25012), and is capable of delivering up to 150-mA
of load current. The dc-dc converter operates at a
synchronized 1 MHz switching frequency allowing for
the use of small inductors.
AC Adapter
VDC
TYPICAL APPLICATION
bq25012RHL PG 14
5 AC
SW 19
1.8 V
Bluetooth Chipset
DSP
GND
3 VSS
FB 2
D+
D−
VBUS
GND
USB Port
9 VSS
CE 15
18 VSS BAT/OUT 17
6 USB BAT/OUT 16
7 STAT1
ISET1 12
8 STAT2
ISET2 13
4 EN
FPWM 20
RSET
Battery
Pack
PACK+
+
PACK−
Processor
UDG−04070
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
2
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2007, Texas Instruments Incorporated



Texas Instruments bq25011
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
TA
-40°C to 125°C
OUTPUT VOLTAGE (V)
Adjustable
3.3
1.8
PART NUMBER(2)(3)
bq25010RHLR
bq25011RHLR (4)
bq25012RHLR
PACKAGE
MARKING
ANC
ANE
ANF
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com
(2) The RHL package is available taped and reeled only in quantities of 3,000 devices per reel.
(3) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including
bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(4) Advanced Information, contact factory for availability.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
Supply voltage
AC, USB (wrt VSS)
Input voltage
PG, OUT, ISET1, ISET2, STAT1, STAT2, TS (wrt VSS)
EN, FB, FPWM, SW (wrt VSS)
Output sink/source current
PG, STAT1, STAT2
TS
Output source current
OUT
Storage temperature range, Tstg
Junction temperature range, TJ
Lead temperature (soldering, 10 seconds)
ESD rating (human body model, HBM)
bq25010
bq25011
bq25012
–0.3 V to 7 V
–0.3 V to 7 V
VOUT + 0.3 V
15 mA
200 μA
1.5 A
–65°C to 150°C
0°C to 125°C
260°C
1500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
RECOMMENDED OPERATING CONDITIONS
VCC Supply voltage (from AC input)
VCC Supply voltage (from USB input)
TJ Operating junction temperature range
MIN MAX UNIT
4.5 6.5
V
4.35 6.5
–40 125 °C
DISSIPATION RATINGS
PACKAGE
20-pin RHL(1)
TA < 40°C
POWER RATING
1.81 W
DERATING FACTOR
ABOVE TA = 40°C
21 mW/°C
θJA
46.87°C/W
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2׳ via matrix.
2 Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012



Texas Instruments bq25011
www.ti.com
bq25010
bq25011
bq25012
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS
over junction temperature range (0°C TJ 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
INPUT CURRENT
ICC(VCC)
Supply current 1, VCC
VVCC > VVCC(min)
ICC(SLP)
Sleep current
Sum of currents into OUT/BAT,
VVCC < V(SLP)
ICC(STDBY)
Stand by current
CE = High, 0°C TJ 85°C
IIB(OUT)
Input current, OUT
Charge DONE, VVCC > VVCC(min),
IOUT(SW) = 0 mA, Converter not switching
IIB(CE)
Input current, CE
CHARGE VOLTAGE REGULATION (VBAT(REG) + V(DO-MAX) VVCC, I(TERM) < IOUT(BAT) 0.5 A)
VREG(BAT)
Charger regulation voltage
Charge voltage regulation
accuracy
TA = 25°C
–0.35%
–1%
1.2 2 mA
25
150
μA
15 35
1
4.2 V
0.35%
1%
(V(AC) – V(OUT)) AC dropout voltage
(V(USB) – V(OUT)) USB dropout voltage
CHARGE CURRENT REGULATION
VOUT (BAT) = VREG (BAT), IOUT(BAT) = 0.5 A
VOUT (BAT) = VREG (BAT), ISET2 = High
VOUT (BAT) = VREG (BAT), ISET2 = Low
175 250
350 500 mV
60 100
IOUT (BAT)
AC output current range
VVCC 4.5 V, VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX),
IOUT(BAT) = (K(SET) × V(SET) / RSET)
IOUT (BAT)
USB output current range
VVCC(min) 4.5 V, VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX), ISET2 = Low
VVCC(min)4.5 V, VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX), ISET2 = High
V(SET)
Output current set voltage
Voltage on ISET1, VVCC 4.5 V,
VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX), ISET2 = High
50 mA IOUT(OUT) 500 mA
K(SET)
Output current set factor
10 mA IOUT(OUT) 50 mA
10 mA IOUT(OUT) 10 mA
PRECHARGE and SHORT-CIRCUIT CURRENT REGULATION
50
80
400
2.436
307
296
246
2.500
322
320
320
500
100 mA
500
2.538 V
337
346
416
V(LOWV)
Precharge to fast-charge
transition threshold
Voltage on OUT/BAT
2.8 3 3.2 V
tPRECHG_DG
Deglitch time for fast-charge to
precharge transition
VVCC(min) 4.5 V, tFALL = 100 ns,
10 mV overdrive,
VIN(BAT) decreasing below threshold
IOUT(PRECHG)
Precharge range
0 V < VIN(BAT) < V(LOWV), t < t(PRECHG),
IOUT(PRECHG) = (K(SET) נV(PRECHG))/ RSET
V(PRECHG)
Precharge set voltage
Voltage on ISET1, VREG(BAT) = 4.2 V,
0 V < VIN(BAT) < V(LOWV),
t < t(PRECHG)
CHARGE TAPER and TERMINATION DETECTION
250 375
5
240 255
500 ms
100 mA
270 mV
I(TAPER)
V(TAPER)
V(TERM)
Charge taper detection range
Charge taper detection set
voltage
Charge termination detection
set voltage
VIN(BAT) > V(RCH), t < t(PRECHG),
I(TAPER) = (K(SET) נV(TAPER))/ RSET
Voltage on ISET1, VREG(BAT) = 4.2 V,
VIN(BAT) > V(RCH), t < t(PRECHG)
Voltage on ISET1, VREG(BAT) = 4.2 V,
VIN(BAT) > V(RCH), t < t(PRECHG),
I(TERM) = (K(SET) נV(TERM))/ RSET
5
235 250
11 18
100 mA
265
mV
25
Copyright © 2004–2007, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): bq25010 bq25011 bq25012
3





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