Inductance-to-Digital Converter. LDC1051 Datasheet

LDC1051 Converter. Datasheet pdf. Equivalent

LDC1051 Datasheet
Recommendation LDC1051 Datasheet
Part LDC1051
Description 8-bit Rp only Inductance-to-Digital Converter
Feature LDC1051; Product Folder Sample & Buy Technical Documents Tools & Software Support & Community LDC1051 SN.
Manufacture etcTI
Datasheet
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Texas Instruments LDC1051
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
LDC1051
SNOSCY0 – MARCH 2014
LDC1051: 8-bit Rp only Inductance-to-Digital Converter with SPI
1 Features
1 Remote Sensor Placement (Decoupling The LDC
From Harsh Environments)
• High Durability (By Virtue Of Contactless
Operation)
• Higher Flexibility For System Design (Using Coils
Or Springs As Sensors)
• Insensitive to Non-conductive Environmental
Interferers (such As Dirt, Dust, Oil etc.)
• Magnet-free Operation
• Supply Voltage: 5 V, typ
• Supply Voltage, IO: 1.8V to 5.5V
• Stand-by Current: 250uA, typ
• Rp Resolution: 8-bit
• LC Frequency Range: 5kHz to 5MHz
Axial Distance Sensing Application
Application Schematic
2 Applications
5V
LDO
VIO
5V
• Proximity Sensing
• Level Sensing
VIO
MOSI
VIO VDD
SDI INA
• Lateral Position Sensing
MCU
MISO
SCLK
GPIO
SDO
SCLK
CSB LDC1051
INB
Sensor
3 Description
INT/GPIO
INTB
CFA
CFB
Inductive sensing is a contactless, short-range
DGND
GND
sensing technology enabling high-resolution and low-
DGND CLDO
DAP
cost position sensing of conductive targets, even in
harsh environments. Using a coil or spring as a
sensor, the LDC1051 inductance-to-digital converter
DGND
DGND
AGND
provides system designers a way to achieve high
performance and reliability at a lower system cost
than other competing solutions.
Rp vs Distance With 14mm PCB Coil
14
The LDC1051 is pin compatible with the LDC1000
(16-bit Rp/24-bit L) and the LDC1041 (8-bit Rp/24-bit
L). This family of devices offers system designers
different resolution options based on their application
and system requirements.
The LDC1051 is available in a 5mm x 4mm WSON-
16 package. Device programming via SPI allows for
easy configuration using a microcontroller.
12
10
8
6
4
2
Device Information
ORDER NUMBER
PACKAGE
BODY SIZE
LDC1051NHRT
WSON (16)
5 mm × 4 mm
LDC1051NHRR
WSON (16)
5 mm × 4 mm
LDC1051NHRJ
WSON (16)
5 mm × 4 mm
0
012345678
Distance (mm)
C002
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LDC1051
LDC1051
SNOSCY0 – MARCH 2014
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Terminal Configuration and Functions................ 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 Handling Ratings....................................................... 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ................................................ 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes........................................ 11
7.5 Programming........................................................... 14
7.6 Register Map and Description................................. 15
8 Applications and Implementation ...................... 20
8.1 Application Information............................................ 20
8.2 Typical Applications ................................................ 21
9 Power Supply Recommendations...................... 25
10 Layout................................................................... 25
10.1 Layout Guidelines ................................................. 25
10.2 Layout Example .................................................... 26
11 Device and Documentation Support ................. 27
11.1 Trademarks ........................................................... 27
11.2 Electrostatic Discharge Caution ............................ 27
11.3 Glossary ................................................................ 27
12 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
DATE
March 2014
REVISION
*
NOTES
Initial release.
2 Submit Documentation Feedback
Product Folder Links: LDC1051
Copyright © 2014, Texas Instruments Incorporated



Texas Instruments LDC1051
www.ti.com
5 Terminal Configuration and Functions
WSON-16
Top View
SCLK
CSB
SDI
VIO
SDO
DGND
CFB
CFA
1
2
3
4
5
6
7
8
DAP
(GND)
16 INTB
15 N/C
14 N/C
13 CLDO
12 VDD
11 GND
10 INB
9 INA
LDC1051
SNOSCY0 – MARCH 2014
TERMINAL
NAME
SCLK
CSB
SDI
VIO
SDO
DGND
CFB
CFA
INA
INB
GND
VDD
CLDO
N/C
N/C
INTB
DAP
TERMINAL
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
TERMINAL
TYPE
DO
DI
DI
P
DO
P
A
A
A
A
P
P
A
N/C
N/C
DO
P
Terminal Functions
DESCRIPTION
SPI clock input. SCLK is used to clock-out/clock-in the data from/into the chip
SPI CSB(Chip Select Bar). Multiple devices can be connected on the same SPI bus and CSB
can be used to select the device to be communicated with
SPI Slave Data In (Master Out Slave In). This should be connected to the Master Out Slave In
of the master
Digital IO Supply
SPI Slave Data Out (Master In Slave Out).It is high impedance when CSB is high
Digital ground
LDC filter capacitor
LDC filter capacitor
External LC Tank. Connect to external LC tank
External LC Tank. Connect to external LC tank
Analog ground
Analog supply
LDO bypass capacitor. A 56nF capacitor should be connected from this Terminal to GND
No Connection
No Connection
Configurable interrupt. This Terminal can be configured to behave in 3 different ways by
programing the INT Terminal mode register. Either threshold detect, wakeup, or DRDYB
Connect to GND
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: LDC1051
Submit Documentation Feedback
3





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