LDC1000 Converter Datasheet

LDC1000 Datasheet, PDF, Equivalent


Part Number

LDC1000

Description

Inductance to Digital Converter

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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LDC1000
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LDC1000
SNOSCX2C – SEPTEMBER 2013 – REVISED SEPTEMBER 2015
LDC1000 Inductance-to-Digital Converter
1 Features
1 Magnet-Free Operation
• Sub-Micron Precision
• Adjustable Sensing Range (Through Coil Design)
• Lower System Cost
• Remote Sensor Placement (Decoupling the LDC
From Harsh Environments)
• High Durability (by Virtue of Contact-Less
Operation)
• Insensitivity to Environmental Interference (Such
as Dirt, Dust, Water, Oil)
• Supply Voltage, Analog: 4.75 V to 5.25 V
• Supply Voltage, I/O: 1.8 V to 5.25 V
• Supply Current (Without LC Tank): 1.7 mA
• RP Resolution: 16-Bit
• L Resolution: 24-Bit
• LC Frequency Range: 5 kHz to 5 MHz
2 Applications
• Position Sensing
• Motion Sensing
• Gear-Tooth Counting
• Flow Meters
• Push-Button Switches
• Multi-Function Printers
• Digital Cameras
• Medical Devices
3 Description
Inductive Sensing is a contact-less, short-range
sensing technology that enables low-cost, high-
resolution sensing of conductive targets in the
presence of dust, dirt, oil, and moisture, making it
extremely reliable in hostile environments. Using a
coil which can be created on a PCB as a sensing
element, the LDC1000 enables ultra-low cost system
solutions.
Inductive sensing technology enables precise
measurement of linear and angular position,
displacement, motion, compression, vibration, metal
composition, and several other applications in
markets including automotive, consumer, computer,
industrial, medical, and communications. Inductive
sensing offers better performance and reliability at
lower cost than other competitive solutions.
The LDC1000 is the world’s first inductance-to-digital
converter, offering the benefits of inductive sensing in
a low-power, small-footprint solution. The product is
available in a SON-16 package and offers several
modes of operation. A serial peripheral interface (SPI)
simplifies connection to an MCU.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LDC1000
WSON (16)
5.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Axial Distance Sensing Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LDC1000
LDC1000
SNOSCX2C – SEPTEMBER 2013 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Condition......................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Timing Requirements ............................................... 7
6.7 Typical Characteristics .............................................. 8
7 Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 13
7.5 Programming .......................................................... 16
7.6 Register Maps ......................................................... 18
8 Application and Implementation ........................ 24
8.1 Application Information............................................ 24
8.2 Typical Application .................................................. 25
9 Power Supply Recommendations...................... 28
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Layout Example .................................................... 29
11 Device and Documentation Support ................. 30
11.1 Documentation Support (if applicable).................. 30
11.2 Community Resources.......................................... 30
11.3 Trademarks ........................................................... 30
11.4 Electrostatic Discharge Caution ............................ 30
11.5 Glossary ................................................................ 30
12 Mechanical, Packaging, and Orderable
Information ........................................................... 30
4 Revision History
Changes from Revision B (March 2015) to Revision C
Page
• Changed XOUT pin description to clarify proper crystal connection...................................................................................... 4
• Added instructions on proper DAP connection....................................................................................................................... 4
• Added conditions for L measurement resolution .................................................................................................................... 6
• Changed TYP to NOM............................................................................................................................................................ 7
• Changed Some descriptions of device functionality for better clarity and consistency ......................................................... 9
• Changed RP Conversion equation for clarity ...................................................................................................................... 12
• Added extended SPI transaction figure for clarity ............................................................................................................... 17
• Changed Register maps to include Clock Configuration and Threshold Registers ............................................................ 18
• Changed description of Min Sensor frequency for clarity .................................................................................................... 21
• Added documentation of registers 0x05, 0x06, and 0x08 ................................................................................................... 21
• Changed description of OSC Status to include possible causes. ....................................................................................... 23
• Changed some details on Application Information for improved clarity and consistency. .................................................. 24
• Deleted lateral and rotation images from example applications, as example application details axial sensing
configuration ......................................................................................................................................................................... 25
• Changed details of example design for improved clarity...................................................................................................... 26
Changes from Revision A (December 2013) to Revision B
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed SCLK Pin type from DO to DI ................................................................................................................................. 4
• Added L Res value to Electrical Characteristics..................................................................................................................... 6
• Added Measuring Inductance With LDC1000 subsection to Feature Description ............................................................... 12
• Changed Frequency Counter Data values in Register Description table............................................................................. 18
2 Submit Documentation Feedback
Product Folder Links: LDC1000
Copyright © 2013–2015, Texas Instruments Incorporated


Features Product Folder Sample & Buy Technical Documents Tools & Software Support & Community LDC1000 SNOSCX2C – SEPTEMB ER 2013 – REVISED SEPTEMBER 2015 LDC1 000 Inductance-to-Digital Converter 1 Features •1 Magnet-Free Operation • Sub-Micron Precision • Adjustable Se nsing Range (Through Coil Design) • L ower System Cost • Remote Sensor Plac ement (Decoupling the LDC From Harsh En vironments) • High Durability (by Vir tue of Contact-Less Operation) • Inse nsitivity to Environmental Interference (Such as Dirt, Dust, Water, Oil) • S upply Voltage, Analog: 4.75 V to 5.25 V • Supply Voltage, I/O: 1.8 V to 5.25 V • Supply Current (Without LC Tank) : 1.7 mA • RP Resolution: 16-Bit • L Resolution: 24-Bit • LC Frequency R ange: 5 kHz to 5 MHz 2 Applications • Position Sensing • Motion Sensing Gear-Tooth Counting • Flow Meters Push-Button Switches • Multi-Funct ion Printers • Digital Cameras • Me dical Devices 3 Description Inductive Sensing is a contact-less, short-range sensing technology that enables.
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