Gate Driver. UCC27524A-Q1 Datasheet

UCC27524A-Q1 Driver. Datasheet pdf. Equivalent

Part UCC27524A-Q1
Description Low-Side Gate Driver
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UCC27524A-Q1
SLVSCC1B – NOVEMBER 2013 – REVISED SEPTEMBER 2015
UCC27524A-Q1 Dual 5-A, High-Speed, Low-Side Gate Driver
With Negative Input Voltage Capability
1 Features
1 Qualified for Automotive Applications
• AEC-Q100 Qualified With the Following Results
– Device Temperature Grade 1
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C4B
• Industry-Standard Pin Out
• Two Independent Gate-Drive Channels
• 5-A Peak Source and Sink-Drive Current
• Independent Enable Function for Each Output
• TTL and CMOS-Compatible Logic Threshold
Independent of Supply Voltage
• Hysteretic-Logic Thresholds for High-Noise
Immunity
• Ability to Handle Negative Voltages (–5 V) at
Inputs
• Inputs and Enable Pin-Voltage Levels Not
Restricted by VDD Pin Bias Supply Voltage
• 4.5-V to 18-V Single-Supply Range
• Outputs Held Low During VDD-UVLO, (ensures
glitch-free operation at power-up and power-
down)
• Fast Propagation Delays (13-ns typical)
• Fast Rise and Fall Times (7-ns and 6-ns typical)
• 1-ns Typical Delay Matching Between 2-Channels
• Ability to Parallel Two Outputs for High-Drive
Current
• Outputs Held in LOW When Inputs are Floating
• SOIC-8 and MSOP-8 PowerPad™ Package
Options
• Operating Temperature Range of –40°C to 140°C
3 Description
The UCC27524A-Q1 device is a dual-channel, high-
speed, low-side, gate-driver device capable of
effectively driving MOSFET and IGBT power
switches. The UCC27524A-Q1 device is a variant of
the UCC2752x family. The UCC27524A-Q1 device
adds the ability to handle –5 V directly at the input
pins for increased robustness. The UCC27524A-Q1
device is a dual, non-inverting driver. Using a design
that inherently minimizes shoot-through current, the
UCC27524A-Q1 device is capable of delivering high-
peak current pulses of up to 5-A source and 5-A sink
into capacitive loads along with rail-to-rail drive
capability and extremely small propagation delay
(typically 13 ns). In addition, the drivers feature
matched, internal-propagation delays between the
two channels which are very well suited for
applications requiring dual-gate drives with critical
timing, such as synchronous rectifiers. This also
enables connecting two channels in parallel to
effectively increase current-drive capability or driving
two switches in parallel with a single input signal. The
input pin thresholds are based on TTL and CMOS
compatible low-voltage logic, which is fixed and
independent of the VDD supply voltage. Wide
hysteresis between the high and low thresholds offers
excellent noise immunity.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
UCC27524A-Q1
MSOP-PowerPAD (8) 3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Product Matrix
Dual Non-Inverting Inputs
2 Applications
• Automotive
• Switch-Mode Power Supplies
• DC-to-DC Converters
• Motor Control, Solar Power
• Gate Drive for Emerging Wide Band-Gap Power
Devices such as GaN
UCC27524A-Q1
ENA 1
8 ENB
INA 2
7 OUTA
GND 3
6 VDD
INB 4
5 OUTB
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



UCC27524A-Q1
UCC27524A-Q1
SLVSCC1B – NOVEMBER 2013 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 3
6 Pin Configuration and Functions ......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings ............................................................ 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Switching Characteristics .......................................... 6
7.7 Typical Characteristics .............................................. 8
8 Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 12
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 17
9 Application and Implementation ........................ 18
9.1 Application Information............................................ 18
9.2 Typical Application .................................................. 18
10 Power Supply Recommendations ..................... 22
11 Layout................................................................... 23
11.1 Layout Guidelines ................................................. 23
11.2 Layout Example .................................................... 24
11.3 Thermal Considerations ........................................ 24
12 Device and Documentation Support ................. 25
12.1 Community Resources.......................................... 25
12.2 Trademarks ........................................................... 25
12.3 Electrostatic Discharge Caution ............................ 25
12.4 Glossary ................................................................ 25
13 Mechanical, Packaging, and Orderable
Information ........................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (January 2014) to Revision B
Page
• Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Original (November 2013) to Revision A
Page
• Changed document status from Product Preview to Production Data ................................................................................... 1
2 Submit Documentation Feedback
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