Protection Device. TPD2E2U06 Datasheet

TPD2E2U06 Device. Datasheet pdf. Equivalent

Part TPD2E2U06
Description Dual-Channel High-Speed ESD Protection Device
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TPD2E2U06
SLLSEG9C – JUNE 2013 – REVISED DECEMBER 2019
TPD2E2U06 Dual-Channel High-Speed ESD Protection Device
1 Features
1 IEC 61000-4-2 Level 4
– ±25 kV (Contact discharge)
– ±30 kV (Air-gap discharge)
• IEC 61000-4-5 Surge protection
– 5.5-A Peak pulse current (8/20 µs Pulse)
• IO Capacitance 1.5 pF (Typ)
• DC Breakdown voltage 6.5 V (Min)
• Ultra-Low leakage current 10 nA (Max)
• Low ESD clamping voltage
• Industrial temperature range: –40°C to +125°C
• Small easy-to-route DRL and DCK package
2 Applications
End Equipment
Set Top Box
Notebook
Server
Electronic Point of Sale (EPOS)
Interfaces
USB 2.0
Ethernet
MIPI Bus
LVDS
I2C
3 Description
The TPD2E2U06 is a dual-channel low capacitance
TVS diode ESD protection device. The device offers
±25-kV contact and ±30-kV air-gap ESD protection in
accordance with the IEC 61000-4-2 standard. The
1.5-pF line capacitance of the TPD2E2U06 makes
the device suitable for a wide range of applications.
Typical application interfaces are USB 2.0, LVDS,
and I2C™.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPD2E2U06DRL SOT (5)
1.60 mm × 1.20 mm
TPD2E2U06DCK SC70 (3)
2.0 mm × 1.25 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
Vbus
D+
Power
Supply
D-
GND
35
TPD2E2U06
4
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



TPD2E2U06
TPD2E2U06
SLLSEG9C – JUNE 2013 – REVISED DECEMBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Typical Characteristics .............................................. 6
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
8 Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application ................................................. 10
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 12
11 Device and Documentation Support ................. 12
11.1 Trademarks ........................................................... 12
11.2 Receiving Notification of Documentation Updates 12
11.3 Support Resources ............................................... 12
11.4 Glossary ................................................................ 12
12 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
Changes from Revision B (May 2015) to Revision C
Page
• Added DCK Package to the Pin Configuration and Functions section................................................................................... 3
• Added DCK Package to the Electrical Characteristics table ................................................................................................. 4
Changes from Revision A (June 2013) to Revision B
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
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