TMUX1574 Switch Datasheet

TMUX1574 Datasheet, PDF, Equivalent


Part Number

TMUX1574

Description

Powered-Off Protected Switch

Manufacture

etcTI

Total Page 30 Pages
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TMUX1574
SCDS391C – OCTOBER 2018 – REVISED DECEMBER 2019
TMUX1574 Low-Capacitance, 2:1 (SPDT) 4-Channel,
Powered-Off Protected Switch with 1.8 V Logic
1 Features
1 Wide supply range: 1.5 V to 5.5 V
• Low on-capacitance: 7.5 pF
• Low on-resistance: 2 Ω
• High bandwidth: 2 GHz
• -40°C to +125°C operating temperature
1.8 V Logic Compatible
Supports Input Voltage Beyond Supply
Integrated Pull Down Resistor on Logic Pins
Bidirectional Signal Path
Fail-Safe Logic
Powered-off Protection up to 3.6 V Signals
– Pinout compatible to SN74CBTLV3257
2 Applications
• Flash memory sharing
• JTAG multiplexing
• SPI multiplexing
• eMMC multiplexing
Servers
Data center switches & routers
Wireless infrastructure
PC & notebooks
Building automation
Grid infrastructure
ePOS
Appliances
3 Description
The TMUX1574 is a complementary metal-oxide
semiconductor (CMOS) switch. The TMUX1574
offers 2:1 SPDT switch configuration with 4-channels.
Wide operating supply of 1.5 V to 5.5 V allows for use
in a broad array of applications from servers and
communication equipment to industrial applications.
The device supports bidirectional analog and digital
signals on the source (SxA, SxB) and drain (Dx) pins
and can pass signals above supply up to VDD x 2,
with a maximum input/output voltage of 5.5 V.
Powered-off Protection up to 3.6 V on the signal path
of the TMUX1574 provides isolation when the supply
voltage is removed (VDD = 0 V). Without this
protection feature, switches can back-power the
supply rail through an internal ESD diode and cause
potential damage to the system.
Fail-Safe Logic circuitry allows voltages on the logic
control pins to be applied before the supply pin,
protecting the device from potential damage. All
control inputs have 1.8 V logic compatible thresholds,
ensuring both TTL and CMOS logic compatibility
when operating in the valid supply voltage range.
Integrated pull down resistor on the logic pins
removes external components to reduce system size
and cost.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TSSOP (16)
5.00 mm × 4.40 mm
TMUX1574
UQFN (16)
2.60 mm x 1.80 mm
SOT-23-THIN (16) 4.20 mm x 2.00 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
Application Example
Block Diagram
VI/O
VDD
Processor
RAM
CPU
JTAG
DEBUG,
SPI, GPIO
Peripherals
1.8V Logic
I/O
GND
0.1µF VDD
D1
D2
D3
D4
SEL
EN
GND
SPI / JTAG / UART
Device #1
S1A MISO / TDI / GPIO
S2A MOSI / TDO / GPIO
S3A SCLK / TCK / GPIO
S4A SS / TMS / GPIO
SPI / JTAG / UART
Device #2
S1B MISO / TDI / GPIO
S2B MOSI / TDO / GPIO
S3B SCLK / TCK / GPIO
S4B SS / TMS / GPIO
TMUX1574
S1A
D1
S1B
S2A
S2B
D2
S3A
S3B
D3
S4A
D4
S4B
LOGIC CONTROL*
SEL EN
*Internal 6MO Pull-Down on Logic Pins
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TMUX1574
TMUX1574
SCDS391C – OCTOBER 2018 – REVISED DECEMBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Dynamic Characteristics ........................................... 7
6.7 Timing Requirements ................................................ 8
6.8 Typical Characteristics .............................................. 9
7 Parameter Measurement Information ................ 14
7.1 On-Resistance ........................................................ 14
7.2 Off-Leakage Current ............................................... 14
7.3 On-Leakage Current ............................................... 15
7.4 IPOFF Leakage Current ............................................ 15
7.5 Transition Time ....................................................... 16
7.6 tON (EN) and tOFF (EN) Time....................................... 16
7.7 tON (VDD) and tOFF (VDD) Time................................... 17
7.8 Break-Before-Make Delay....................................... 17
7.9 Propagation Delay................................................... 18
7.10 Skew ..................................................................... 18
7.11 Charge Injection .................................................... 19
7.12 Capacitance .......................................................... 19
7.13 Off Isolation ........................................................... 20
7.14 Channel-to-Channel Crosstalk .............................. 20
7.15 Bandwidth ............................................................. 21
8 Detailed Description ............................................ 22
8.1 Overview ................................................................. 22
8.2 Functional Block Diagram ....................................... 22
8.3 Feature Description................................................. 22
8.4 Device Functional Modes........................................ 24
8.5 Truth Tables ............................................................ 24
9 Application and Implementation ........................ 25
9.1 Application Information............................................ 25
9.2 Typical Application ................................................. 25
10 Power Supply Recommendations ..................... 26
11 Layout................................................................... 27
11.1 Layout Guidelines ................................................. 27
11.2 Layout Example .................................................... 28
12 Device and Documentation Support ................. 29
12.1 Documentation Support ........................................ 29
12.2 Receiving Notification of Documentation Updates 29
12.3 Community Resources.......................................... 29
12.4 Trademarks ........................................................... 29
12.5 Electrostatic Discharge Caution ............................ 29
12.6 Glossary ................................................................ 29
13 Mechanical, Packaging, and Orderable
Information ........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (September 2019) to Revision C
Page
• Added prop delay and skew specs for DYY package ........................................................................................................... 8
• Changed Figure 20 to include prop. delay and skew for DYY package .............................................................................. 12
Changes from Revision A (December 2018) to Revision B
Page
• Added the SOT-23-THIN (DYY) package to the data sheet .................................................................................................. 1
• Added thermal information for DYY package. ........................................................................................................................ 5
Changes from Original (October 2018) to Revision A
Page
• Changed the document status From: Advanced Information To: Production data ................................................................ 1
2 Submit Documentation Feedback
Product Folder Links: TMUX1574
Copyright © 2018–2019, Texas Instruments Incorporated


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity TMUX1574 SCDS391C – OCTOBER 2 018 – REVISED DECEMBER 2019 TMUX1574 Low-Capacitance, 2:1 (SPDT) 4-Channel, Powered-Off Protected Switch with 1.8 V Logic 1 Features •1 Wide supply ran ge: 1.5 V to 5.5 V • Low on-capacitan ce: 7.5 pF • Low on-resistance: 2 Ω • High bandwidth: 2 GHz • -40°C to +125°C operating temperature • 1.8 V Logic Compatible • Supports Input V oltage Beyond Supply • Integrated Pul l Down Resistor on Logic Pins • Bidir ectional Signal Path • Fail-Safe Logi c • Powered-off Protection up to 3.6 V Signals – Pinout compatible to SN74 CBTLV3257 2 Applications • Flash memo ry sharing • JTAG multiplexing • SP I multiplexing • eMMC multiplexing Servers • Data center switches & ro uters • Wireless infrastructure • P C & notebooks • Building automation Grid infrastructure • ePOS • App liances 3 Description The TMUX1574 is a complementary metal-oxide semiconductor (CMOS) switch. The TMUX1574 offers 2:.
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