FCH110N65F MOSFET Datasheet

FCH110N65F Datasheet, PDF, Equivalent


Part Number

FCH110N65F

Description

N-Channel MOSFET

Manufacture

ON Semiconductor

Total Page 9 Pages
Datasheet
Download FCH110N65F Datasheet


FCH110N65F
FCH110N65F
N-Channel SuperFET® II FRFET® MOSFET
650 V, 35 A, 110 mΩ
Features
• 700 V @ TJ = 150°C
• Typ. RDS(on) = 96 mΩ (Typ.)
• Ultra Low Gate Charge (Typ. Qg = 98 nC)
• Low Effective Output Capacitance (Typ. Coss(eff.) = 464 pF)
• 100% Avalanche Tested
• RoHS Compliant
Applications
• LCD / LED / PDP TV • Telecom / Server Power Supplies
• Solar Inverter
• AC - DC Power Supply
Description
SuperFET® II MOSFET is ON Semiconductor’s brand-new high
voltage super-junction (SJ) MOSFET family that is utilizing
charge balance technology for outstanding low on-resistance
and lower gate charge performance. This technology is tailored
to minimize conduction loss, provide superior switching perfor-
mance, dv/dt rate and higher avalanche energy. Consequently,
SuperFET II MOSFET is very suitable for the switching power
applications such as PFC, server/telecom power, FPD TV
power, ATX power and industrial power applications. SuperFET
II FRFET® MOSFET’s optimized body diode reverse recovery
performance can remove additional component and improve
system reliability.
D
G
G DS
TO-247
long leads
Absolute Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
VDSS
VGSS
ID
IDM
EAS
IAR
EAR
dv/dt
PD
TJ, TSTG
TL
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Drain Current
- DC
- AC
- Continuous (TC = 25oC)
- Continuous (TC = 100oC)
- Pulsed
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
MOSFET dv/dt
Peak Diode Recovery dv/dt
Power Dissipation
(TC = 25oC)
- Derate Above 25oC
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
©2014 Semiconductor Components Industries, LLC.
September-2017, Rev. 3
S
(f > 1 Hz)
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
FCH110N65F-F155
650
±20
±30
35
24
105
809
8
3.57
100
50
357
2.86
-55 to +150
300
Unit
V
V
A
A
mJ
A
mJ
V/ns
W
W/oC
oC
oC
FCH110N65F-F155
0.35
40
Unit
oC/W
Publication Order Number:
FCH110N65F-F155/D

FCH110N65F
Package Marking and Ordering Information
Part Number
FCH110N65F-F155
Top Mark
FCH110N65F
Package Packing Method
TO-247G03
Tube
Reel Size
N/A
Tape Width
N/A
Electrical Characteristics TC = 25oC unless otherwise noted.
Symbol
Parameter
Test Conditions
Off Characteristics
BVDSS
ΔBVDSS
/ ΔTJ
IDSS
IGSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Body Leakage Current
VGS = 0 V, ID = 10 mA, TJ = 25°C
VGS = 0 V, ID = 10 mA, TJ = 150°C
ID = 10 mA, Referenced to 25oC
VDS = 650 V, VGS = 0 V
VDS = 520 V, TC = 125oC
VGS = ±20 V, VDS = 0 V
On Characteristics
VGS(th)
RDS(on)
gFS
Gate Threshold Voltage
Static Drain to Source On Resistance
Forward Transconductance
VGS = VDS, ID = 3.5 mA
VGS = 10 V, ID = 17.5 A
VDS = 20 V, ID = 17.5 A
Dynamic Characteristics
Ciss
Coss
Crss
Coss
Coss(eff.)
Qg(tot)
Qgs
Qgd
ESR
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Effective Output Capacitance
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Equivalent Series Resistance
VDS = 100 V, VGS = 0 V,
f = 1 MHz
VDS = 380 V, VGS = 0 V, f = 1 MHz
VDS = 0 V to 400 V, VGS = 0 V
VDS = 380 V, ID = 17.5 A,
VGS = 10 V
(Note 4)
f = 1 MHz
Min.
650
700
-
-
-
-
3
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-
0.72
-
110
-
-
96
30
3680
110
0.65
65
464
98
20
43
0.7
Switching Characteristics
td(on)
tr
td(off)
tf
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
VDD = 380 V, ID = 17.5 A,
VGS = 10 V, Rg = 4.7 Ω
Drain-Source Diode Characteristics
IS Maximum Continuous Drain to Source Diode Forward Current
ISM Maximum Pulsed Drain to Source Diode Forward Current
VSD
Drain to Source Diode Forward Voltage
VGS = 0 V, ISD = 17.5 A
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
VGS = 0 V, ISD = 17.5 A,
dIF/dt = 100 A/μs
Notes:
1. Repetitive rating: pulse width limited by maximum junction temperature.
2. IAS = 8 A, RG = 25 Ω, starting TJ = 25°C.
3. ISD 17.5 A, di/dt 200 A/μs, VDD 380 V, starting TJ = 25°C.
4. Essentially independent of operating temperature typical characteristics.
(Note 4)
-
-
-
-
-
-
-
-
-
31
21
89
5.7
-
-
-
133
0.67
Quantity
30 units
Max. Unit
-
-
-
10
-
±100
V
V/oC
μA
nA
5V
110 mΩ
-S
4895
145
-
-
-
145
-
-
-
pF
pF
pF
pF
pF
nC
nC
nC
Ω
72 ns
52 ns
188 ns
21 ns
35 A
105 A
1.2 V
- ns
- μC
www.onsemi.com
2


Features FCH110N65F — N-Channel SuperFET® II F RFET® MOSFET FCH110N65F N-Channel Sup erFET® II FRFET® MOSFET 650 V, 35 A, 110 mΩ Features • 700 V @ TJ = 150 C • Typ. RDS(on) = 96 mΩ (Typ.) • Ultra Low Gate Charge (Typ. Qg = 98 nC ) • Low Effective Output Capacitance (Typ. Coss(eff.) = 464 pF) • 100% Ava lanche Tested • RoHS Compliant Applic ations • LCD / LED / PDP TV • Tele com / Server Power Supplies • Solar Inverter • AC - DC Power Supply Des cription SuperFET® II MOSFET is ON Sem iconductor’s brand-new high voltage s uper-junction (SJ) MOSFET family that i s utilizing charge balance technology f or outstanding low on-resistance and lo wer gate charge performance. This techn ology is tailored to minimize conductio n loss, provide superior switching perf ormance, dv/dt rate and higher avalanch e energy. Consequently, SuperFET II MOS FET is very suitable for the switching power applications such as PFC, server/ telecom power, FPD TV power, ATX power and industrial power applications. SuperFET II FRFET® MO.
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