SN74LVC2G66 Switch Datasheet

SN74LVC2G66 Datasheet, PDF, Equivalent


Part Number

SN74LVC2G66

Description

Dual Bilateral Analog Switch

Manufacture

etcTI

Total Page 29 Pages
Datasheet
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SN74LVC2G66
SCES325N – JULY 2001 – REVISED AUGUST 2018
SN74LVC2G66 Dual Bilateral Analog Switch
1 Features
1 Available in the Texas Instruments
NanoFree™ Package
• 1.65-V to 5.5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 0.8 ns at 3.3 V
• High On-Off Output Voltage Ratio
• High Degree of Linearity
• High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
• Rail-to-Rail Input/Output
• Low ON-State Resistance, Typically 6
(VCC = 4.5 V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
2 Applications
• Wireless Devices
• Audio and Video Signal Routing
• Portable Computing
• Wearable Devices
• Signal Gating, Chopping, Modulation or
Demodulation (Modem)
• Signal Multiplexing for Analog-to-Digital and
Digital-to-Analog Conversion Systems
3 Description
This dual bilateral analog switch is designed for
1.65-V to 5.5-V VCC operation.
The SN74LVC2G66 device can handle both analog
and digital signals. The SN74LVC2G66 device
permits signals with amplitudes of up to 5.5 V (peak)
to be transmitted in either direction.
NanoFree package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
Each switch section has its own enable-input control
(C). A high-level voltage applied to C turns on the
associated switch section.
Applications include signal gating, chopping,
modulation or demodulation (modem), and signal
multiplexing for analog-to-digital and digital-to-analog
conversion systems.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74LVC2G66DCT SSOP (8)
2.95 mm × 2.80 mm
SN74LVC2G66DCU VSSOP (8)
2.30 mm × 2.00 mm
SN74LVC2G66YZP DSBGA (8)
1.91 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram, Each Switch (Positive Logic)
1A 1
1C 7
One of Two Switches
2 1B
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC2G66
SN74LVC2G66
SCES325N – JULY 2001 – REVISED AUGUST 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics ......................................... 6
6.7 Analog Switch Characteristics .................................. 6
6.8 Operating Characteristics.......................................... 7
6.9 Typical Characteristics .............................................. 7
7 Parameter Measurement Information .................. 8
8 Detailed Description ............................................ 13
8.1 Overview ................................................................. 13
8.2 Functional Block Diagram ....................................... 13
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 13
9 Application and Implementation ........................ 14
9.1 Application Information............................................ 14
9.2 Typical Application ................................................. 14
10 Power Supply Recommendations ..................... 15
11 Layout................................................................... 16
11.1 Layout Guidelines ................................................. 16
11.2 Layout Example .................................................... 16
12 Device and Documentation Support ................. 17
12.1 Community Resources.......................................... 17
12.2 Trademarks ........................................................... 17
12.3 Electrostatic Discharge Caution ............................ 17
12.4 Glossary ................................................................ 17
13 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision M (May 2018) to Revision N
Page
• Changed the YZP pin configuration ...................................................................................................................................... 3
Changes from Revision L (September 2015) to Revision M
Page
• Updated pinout image and the Pin Function table ................................................................................................................ 3
• Changed pin 3 Name From: 1C To: 2C ................................................................................................................................ 3
• Changed the Thermal Information table for the DCT package .............................................................................................. 5
Changes from Revision K (January 2014) to Revision L
Page
• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Typical Characteristics section, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
• Added Thermal Information table ........................................................................................................................................... 5
Changes from Revision J (December 2011) to Revision K
Page
• Updated document to new TI data sheet format--no specification changes. ......................................................................... 1
• Removed Ordering Information table. .................................................................................................................................... 1
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Copyright © 2001–2018, Texas Instruments Incorporated
Product Folder Links: SN74LVC2G66


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity SN74LVC2G66 SCES325N – JULY 2 001 – REVISED AUGUST 2018 SN74LVC2G66 Dual Bilateral Analog Switch 1 Featur es •1 Available in the Texas Instrume nts NanoFree™ Package • 1.65-V to 5 .5-V VCC Operation • Inputs Accept Vo ltages to 5.5 V • Max tpd of 0.8 ns a t 3.3 V • High On-Off Output Voltage Ratio • High Degree of Linearity • High Speed, Typically 0.5 ns (VCC = 3 V , CL = 50 pF) • Rail-to-Rail Input/Ou tput • Low ON-State Resistance, Typic ally ≉6 Ω (VCC = 4.5 V) • Latch-U p Performance Exceeds 100 mA Per JESD 7 8, Class II 2 Applications • Wireless Devices • Audio and Video Signal Rou ting • Portable Computing • Wearabl e Devices • Signal Gating, Chopping, Modulation or Demodulation (Modem) • Signal Multiplexing for Analog-to-Digit al and Digital-to-Analog Conversion Sys tems 3 Description This dual bilateral analog switch is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G66 device can handle both anal.
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