TLV702-Q1 Regulator Datasheet

TLV702-Q1 Datasheet, PDF, Equivalent


Part Number

TLV702-Q1

Description

Low-Dropout Regulator

Manufacture

etcTI

Total Page 30 Pages
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TLV702-Q1
SLVSC35D – AUGUST 2013 – REVISED JULY 2019
TLV702-Q1 300-mA, Low-IQ, Low-Dropout Regulator
1 Features
1 Qualified for Automotive Applications
• AEC-Q100 Qualified with the Following Results:
– Device Temperature Grade 1: –40°C to 125°C
Ambient Operating Temperature Range
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C4B
• Very Low Dropout:
– 37 mV at IOUT = 50 mA, VOUT = 2.8 V
– 75 mV at IOUT = 100 mA, VOUT = 2.8 V
– 220 mV at IOUT = 300 mA, VOUT = 2.8 V
• 2% Accuracy Over Temperature
• Low IQ: 35 µA
• Fixed-Output Voltage Combinations Possible from
1.2 V to 4.8 V
• High PSRR: 68 dB at 1 kHz
• Stable with Effective Capacitance of 0.1 µF(1)
• Thermal Shutdown and Overcurrent Protection
• Packages: 5-Pin SOT (DBV and DDC) and
1.5-mm × 1.5-mm, 6-Pin WSON
(1) See the Input and Output Capacitor Requirements in the
Application Information section.
3 Description
The TLV702-Q1 series of low-dropout (LDO) linear
regulators are low quiescent current devices with
excellent line and load transient performance. These
LDOs are designed for power-sensitive applications.
A precision bandgap and an error amplifier provide
overall 2% accuracy. Low output noise, very high
power-supply rejection ratio (PSRR), and low-dropout
voltage make this series of devices ideal for a wide
selection of battery-operated equipment. All device
versions have thermal shutdown and current limit
protections for safety.
Furthermore, these devices are stable with an
effective output capacitance of only 0.1 µF. This
feature enables the use of cost-effective capacitors
that have higher bias voltages and temperature
derating. The devices regulate to specified accuracy
with no output load.
The TLV702-Q1 series of LDO linear regulators is
available in SOT and WSON packages.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV702-Q1
SOT (5)
WSON (6)
2.90 mm × 1.60 mm
1.50 mm × 1.50 mm
2 Applications
(1) For all available packages, see the package option addendum
at the end of the data sheet.
• Automotive Camera Modules
• Image Sensor Power
• Microprocessor Rails
• Automotive Infotainment Head Units
• Automotive Body Electronics
Typical Application
VIN
CIN
IN OUT
TLV702-Q1
COUT
VOUT
1F
Ceramic
On
Off
EN
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV702-Q1
TLV702-Q1
SLVSC35D – AUGUST 2013 – REVISED JULY 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagrams ..................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 12
8 Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application .................................................. 13
9 Power Supply Recommendations...................... 15
9.1 Power Dissipation ................................................... 15
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Examples................................................... 16
11 Device and Documentation Support ................. 17
11.1 Device Support .................................................... 17
11.2 Documentation Support ........................................ 17
11.3 Receiving Notification of Documentation Updates 17
11.4 Community Resources.......................................... 17
11.5 Trademarks ........................................................... 17
11.6 Electrostatic Discharge Caution ............................ 17
11.7 Glossary ................................................................ 18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (January 2018) to Revision D
Page
• Changed OUT pin number from 5 to 3 in DSE column of Pin Functions table ..................................................................... 4
• Added footnote to maximum EN voltage specification .......................................................................................................... 5
• Added parameter names to Recommended Operating Conditions table............................................................................... 5
Changes from Revision B (June 2015) to Revision C
Page
• Added DBV package to document ......................................................................................................................................... 1
• Changed Packages Features bullet to include DBV package ............................................................................................... 1
• Added DBV package to Pin Configuration and Functions section ......................................................................................... 4
• Added DBV column to Thermal Information table .................................................................................................................. 5
• Changed title of Layout Example for the DDC and DBV Packages figure to include DBV package ................................... 16
Changes from Revision A (August 2013) to Revision B
Page
• Added DSE (6-Pin WSON) package to data sheet ................................................................................................................ 1
• Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed
Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation
Support, and Mechanical, Packaging, and Orderable Information sections to data sheet .................................................... 1
• Deleted all references to P version of device throughout data sheet..................................................................................... 1
• Added "Over Temperature" to 2% accuracy Features bullet ................................................................................................ 1
• Changed DDC package name from TSOT23 to SOT throughout data sheet........................................................................ 1
• Changed Applications bullets ................................................................................................................................................. 1
• Changed Description section text........................................................................................................................................... 1
• Changed ceramic capacitor units on Typical Application circuit from mF to µF (typo) ......................................................... 1
• Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement .................... 5
• Added TJ to TA condition in Electrical Characteristics condition statement............................................................................ 6
2 Submit Documentation Feedback
Product Folder Links: TLV702-Q1
Copyright © 2013–2019, Texas Instruments Incorporated


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity TLV702-Q1 SLVSC35D – AUGUST 2 013 – REVISED JULY 2019 TLV702-Q1 30 0-mA, Low-IQ, Low-Dropout Regulator 1 Features •1 Qualified for Automotive Applications • AEC-Q100 Qualified wit h the Following Results: – Device Tem perature Grade 1: –40°C to 125°C Am bient Operating Temperature Range – D evice HBM ESD Classification Level H2 Device CDM ESD Classification Level C4B • Very Low Dropout: – 37 mV at IOUT = 50 mA, VOUT = 2.8 V – 75 mV at IOUT = 100 mA, VOUT = 2.8 V – 220 mV at IOUT = 300 mA, VOUT = 2.8 V • 2% Accuracy Over Temperature • Low IQ: 3 5 µA • Fixed-Output Voltage Combinat ions Possible from 1.2 V to 4.8 V • H igh PSRR: 68 dB at 1 kHz • Stable wit h Effective Capacitance of 0.1 µF(1) Thermal Shutdown and Overcurrent Pro tection • Packages: 5-Pin SOT (DBV an d DDC) and 1.5-mm × 1.5-mm, 6-Pin WSON (1) See the Input and Output Capacitor Requirements in the Application Information section. 3 Descriptio.
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