Step-Down Converter. TPS5450 Datasheet

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TPS5450
SLVS757D – MARCH 2007 – REVISED DECEMBER 2014
TPS5450 5-A, Wide Input Range, Step-Down Converter
1 Features
1 Wide Input Voltage Range: 5.5 V to 36 V
• Up to 5-A Continuous (6-A Peak) Output Current
• High Efficiency Greater Than 90% Enabled by
110-mIntegrated MOSFET Switch
• Wide Output Voltage Range: Adjustable Down to
1.22 V With 1.5% Initial Accuracy
• Internal Compensation Minimizes External Part
Count
• Fixed 500-kHz Switching Frequency for Small
Filter Size
• 18-μA Shutdown Supply Current
• Improved Line Regulation and Transient
Response by Input Voltage Feed Forward
• System Protected by Overcurrent Limiting,
Overvoltage Protection and Thermal Shutdown
• –40°C to 125°C Operating Junction Temperature
Range
• Available in Small Thermally Enhanced 8-Pin
SOIC PowerPAD™ Package
2 Applications
• High Density Point-of-Load Regulators
• LCD Displays, Plasma Displays
• Battery Chargers
• 12-V and 24-V Distributed Power Systems
3 Description
The TPS5450 is a high-output-current PWM
converter that integrates a low-resistance, high-side
N-channel MOSFET. Included on the substrate with
the listed features are a high-performance voltage
error amplifier that provides tight voltage regulation
accuracy under transient conditions; an undervoltage-
lockout circuit to prevent start-up until the input
voltage reaches 5.5 V; an internally set slow-start
circuit to limit inrush currents; and a voltage feed-
forward circuit to improve the transient response.
Using the ENA pin, shutdown supply current is
reduced to 18 μA typically. Other features include an
active-high enable, overcurrent limiting, overvoltage
protection and thermal shutdown. To reduce design
complexity and external component count, the
TPS5450 feedback loop is internally compensated.
The TPS5450 device is available in a thermally-
enhanced, 8-pin SOIC PowerPAD package. TI
provides evaluation modules and software tool to aid
in achieving high-performance power supply designs
to meet aggressive equipment development cycles.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (NOM)
TPS5450
HSOP (8)
4.89 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
Efficiency vs Output Current
VIN
VIN PH
NC BOOT
NC
ENA VSENSE
GND
VOUT
100
95
90
85
80
75
70
65
60
55
50
0
VI = 12 V,
VO = 5 V,
fs = 500 kHz,
TA = 25°C
1 2 345
IO - Output Current - A
6
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


TPS5450 Datasheet
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Part TPS5450
Description Step-Down Converter
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TPS5450
SLVS757D – MARCH 2007 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 6
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application ................................................. 11
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 18
10.3 Thermal Calculations ............................................ 19
11 Device and Documentation Support ................. 20
11.1 Device Support...................................................... 20
11.2 Trademarks ........................................................... 20
11.3 Electrostatic Discharge Caution ............................ 20
11.4 Glossary ................................................................ 20
12 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (October 2013) to Revision D
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision B (September 2013) to Revision C
Page
• Changed Figure 18............................................................................................................................................................... 18
Changes from Revision A (January 2013) to Revision B
Page
• Deleted SWIFT from the data sheet Title, Features, and Description.................................................................................... 1
Changes from Original (March 2007) to Revision A
Page
• Replaced the DISSIPATION RATINGS with the THERMAL INFORMATION table............................................................... 4
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Copyright © 2007–2014, Texas Instruments Incorporated



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5 Pin Configuration and Functions
DDA PACKAGE
(TOP VIEW)
TPS5450
SLVS757D – MARCH 2007 – REVISED DECEMBER 2014
BOOT
NC
NC
VSENSE
18
2 PowerPAD 7
(Pin 9)
36
45
PH
VIN
GND
ENA
PIN
NAME
NO.
BOOT
1
NC
VSENSE
ENA
GND
2, 3
4
5
6
VIN 7
PH
PowerPAD
8
9
Pin Functions
I/O DESCRIPTION
O
Boost capacitor for the high-side FET gate driver. Connect 0.01-μF, low-ESR capacitor from BOOT pin to PH
pin.
– Not connected internally.
I Feedback voltage for the regulator. Connect to output voltage divider.
I On and off control. Below 0.5 V, the device stops switching. Float the pin to enable.
– Ground. Connect to PowerPAD.
I
Input supply voltage. Bypass VIN pin to GND pin close to device package with a high-quality, low-ESR
ceramic capacitor.
O Source of the high-side power MOSFET. Connected to external inductor and diode.
– GND pin must be connected to the exposed pad for proper operation.
Copyright © 2007–2014, Texas Instruments Incorporated
Product Folder Links: TPS5450
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