Headphone Amplifier. TPA6133A2 Datasheet

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TPA6133A2
SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014
TPA6133A2 138-mW DirectPath™ Stereo Headphone Amplifier
1 Features
1 DirectPath™ Ground-Referenced Outputs
– Eliminates Output DC Blocking Capacitors
– Reduces Board Area
– Reduces Component Height and Cost
– Full Bass Response Without Attenuation
• Power Supply Voltage Range: 2.5 V to 5.5 V
• High Power Supply Rejection Ratio
(>100 dB PSRR)
• Differential Inputs for Maximum Noise Rejection
(69 dB CMRR)
• High-Impedance Outputs When Disabled
• Advanced Pop and Click Suppression Circuitry
• GPIO Control for Shutdown
• 20 Pin, 4 mm x 4 mm WQFN Package
2 Applications
• Mobile Phones
• Audio Headsets
• Notebook Computers
• High Fidelity Applications
3 Description
The TPA6133A2 is a stereo DirectPath™ headphone
amplifier with GPIO control. The TPA6133A2 has
minimal quiescent current consumption, with a typical
IDD of 4.2 mA, making it optimal for portable
applications. The GPIO control allows the device to
be put in a low power shutdown mode.
The TPA6133A2 is a high fidelity amplifier with an
SNR of 93 dB. A PSRR greater than 100 dB enables
direct-to-battery connections without compromising
the listening experience. The output noise of 12
μVrms (typical A-weighted) provides a minimal noise
background during periods of silence. Configurable
differential inputs and high CMRR allow for maximum
noise rejection in the noisy environment of a mobile
device.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA6133A2
WQFN (20)
4.00 mm x 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Application Diagram
GPIO
VBAT
2.2K3
Audio Source
0.47uF
LEFT_OUTM
0.47uF
LEFT_OUTP
0.47uF
RIGHT_OUTM
0.47uF
RIGHT_OUTP
SD TEST1 TEST2
LEFTINM
LEFTINP
HPLEFT
RIGHTINM
RIGHTINP
CPP CPN CPVSS
HPRIGHT
GND
GND
VDD VDD
1uF 1uF
1uF 1uF
VBAT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


TPA6133A2 Datasheet
Recommendation TPA6133A2 Datasheet
Part TPA6133A2
Description Stereo Headphone Amplifier
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TPA6133A2
SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Simplified Application Diagram............................ 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specification........................................................... 4
7.1 Absolute Maximum Ratings ..................................... 4
7.2 Handling Ratings....................................................... 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Operating Characteristics.......................................... 5
7.7 Typical Characteristics .............................................. 6
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 12
9 Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application ................................................. 13
10 Power Supply Recommendations ..................... 16
11 Layout................................................................... 17
11.1 Layout Guidelimes ................................................ 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1 Trademarks ........................................................... 18
12.2 Electrostatic Discharge Caution ............................ 18
12.3 Glossary ................................................................ 18
13 Mechanical, Packaging, and Orderable
Information ........................................................... 18
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (August 2014) to Revision B
Page
• Changed "PIN QFN" To: "NUMBER" in the Pin Functions table............................................................................................ 3
• Added a NOTE to the Applications and Implementation section ........................................................................................ 13
• Added new paragraph to the Application Information section.............................................................................................. 13
Changes from Original (June 2013) to Revision A
Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Added the Device Information Table ..................................................................................................................................... 1
• Moved "Minimum Load Impedance" From the Absolute Maximum Ratings table To the Recommended Operating
Conditions table ...................................................................................................................................................................... 4
• Added the Thermal Information Table ................................................................................................................................... 4
• Changed text in the Overview section From: "toggling the SD pin to logic 1." To: "asserting the SD pin to logic 1." ......... 10
• Changed text in the Headphone Amplifier section From: "the output signal is severely clipped" To: "power
consumption will be higher" .................................................................................................................................................. 11
• Added the Optional Test Setup section................................................................................................................................ 15
• Added the Layout Example image ...................................................................................................................................... 17
2 Submit Documentation Feedback
Product Folder Links: TPA6133A2
Copyright © 2013–2014, Texas Instruments Incorporated



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6 Pin Configuration and Functions
RTJ Package
(Top VIEW)
TPA6133A2
SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014
20 19 18 17 16
LEFTINM 1
LEFTINP 2
GND 3
RIGHTINP 4
Top View
15 CPVSS
14 HPLEFT
13 GND
12 VDD
RIGHTINM 5
11 HPRIGHT
6 7 8 9 10
NAME
LEFTINM
LEFTINP
PIN
NUMBER
1
2
RIGHTINP
GND
RIGHTINM
SD
TEST2
TEST1
HPRIGHT
VDD
HPLEFT
CPVSS
CPN
CPP
GND
VDD
Thermal pad
4
3, 9, 10, 13
5
6
7
8
11
12
14
15, 16
17
18
19
20
Die Pad
INPUT,
OUTPUT,
POWER
I
I
I
P
I
I
I
I
O
P
O
P
P
P
P
P
P
Pin Functions
DESCRIPTION
Left channel negative differential input. Impedance must be matched to LEFTINP. Connect the left
input to LEFTINM when using single-ended inputs.
Left channel positive differential input. Impedance must be matched to LEFTINM. AC ground
LEFTINP near signal source while maintaining matched impedance to LEFTINM when using single-
ended inputs.
Right channel positive differential input. Impedance must be matched to RIGHTINM. AC ground
RIGHTINP near signal source while maintaining matched impedance to RIGHTINM when using
single-ended inputs.
Analog ground. Must be connected to common supply GND. It is recommended that this pin be
used to decouple VDD for analog. Use pin 13 to decouple pin 12 on the QFN package.
Right channel negative differential input. Impedance must be matched to RIGHTINP. Connect the
right input to RIGHTINM when using single-ended inputs.
Shutdown. Active low logic. 5V tolerant input.
Factory test pins. Pull up to VDD supply. See Applications Diagram.
Factory test pins. Pull up to VDD supply. See Applications Diagram.
Headphone light channel output. Connect to the right terminal of the headphone jack.
Analog VDD. VDD must be connected to common VDD supply. Decouple with its own 1-μF capacitor
to analog ground (pin 13).
Headphone left channel output. Connect to left terminal of headphone jack.
Negative supply generated by the charge pump. Decouple to pin 19 or a GND plane. Use a 1 μF
capacitor.
Charge pump flying capacitor negative terminal. Connect one side of the flying capacitor to CPN.
Charge pump flying capacitor positive terminal. Connect one side of the flying capacitor to CPP.
Charge pump ground. GND must be connected to common supply GND. It is recommended that
this pin be decoupled to the VDD of the charge pump pin (pin 20 on the QFN).
Charge pump voltage supply. VDD must be connected to the common VDD voltage supply. Decouple
to GND (pin 19 ) with its own 1 μF capacitor.
Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is
required for mechanical stability and will enhance thermal performance.
Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: TPA6133A2
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