HEADPHONE AMPLIFIER. TPA6141A2 Datasheet

TPA6141A2 AMPLIFIER. Datasheet pdf. Equivalent

TPA6141A2 Datasheet
Recommendation TPA6141A2 Datasheet
Part TPA6141A2
Description STEREO HEADPHONE AMPLIFIER
Feature TPA6141A2; TPA6141A2 www.ti.com................................................................................
Manufacture etcTI
Datasheet
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etcTI TPA6141A2
TPA6141A2
www.ti.com.................................................................................................................................................... SLOS634A – MARCH 2009 – REVISED AUGUST 2009
CLASS-G DIRECTPATH™ STEREO HEADPHONE AMPLIFIER
Check for Samples: TPA6141A2
FEATURES
1
2 TI Class-G Technology Significantly Prolongs
Battery Life and Music Playback Time
– 0.6 mA / Ch Quiescent Current
– 50% to 80% Lower Quiescent Current Than
Ground-Referenced Class-AB Headphone
Amplifiers
• DirectPathTM Technology Eliminates Large
Output DC-Blocking Capacitors
– Outputs Biased at 0 V
– Improves Low Frequency Audio Fidelity
• Active Click and Pop Suppression
• Fully Differential Inputs Reduce System Noise
– Also Configurable as Single-Ended Inputs
• SGND Pin Eliminates Ground Loop Noise
• Wide Power Supply Range: 2.5 V to 5.5 V
• 100 dB Power Supply Noise Rejection
• Built-in Input Low Pass Filter
• Gain Settings: 0 dB and 6dB
• Short-Circuit Current Limiter
• Thermal-Overload Protection
• ±8 kV HBM ESD Protected Outputs
• 0,4 mm Pitch, 1,6 mm × 1,6 mm 16-Bump
WCSP (YFF) Package
APPLICATIONS
• Cellular Phones / Music Phones
• Smart Phones
• Portable Media / MP3 Players
• Portable CD / DVD Players
DESCRIPTION
The TPA6141A2 (also known as TPA6141) is a
Class-G DirectPath™ stereo headphone amplifier
with selectable gain. Class-G technology maximizes
battery life by adjusting the voltage supplies of the
headphone amplifier based on the audio signal level.
At low level audio signals, the internal supply voltage
is reduced to minimize power dissipation.
DirectPathTM technology eliminates external
DC-blocking capacitors.
The device features fully differential inputs with an
integrated low pass filter to reduce system noise
pickup between the audio source and the headphone
amplifier and to reduce DAC out–of–band noise. The
high power supply noise rejection performance and
differential architecture provides increased RF noise
immunity. For single–ended input signals, connect
INL+ and INR+ to ground.
The device operates from a 2.5 V to 5.5 V supply
voltage. Class-G operation keeps total supply current
below 5.0 mA while delivering 500 μW per channel
into 32 . Shutdown mode reduces the supply
current to less than 3 μA and is activated through the
EN pin.
The device has built-in pop suppression circuitry to
completely eliminate disturbing pop noise during
turn-on and turn-off. The amplifier outputs have
short-circuit and thermal-overload protection along
with ±8 kV HBM ESD protection, simplifying end
equipment compliance to the IEC 61000-4-2 ESD
standard.
OUTR+
1 mF
INR+
OUTR-
CODEC
OUTL+
OUTL-
EN
GAIN
Vbat
2.2 mH
2.2 mF
INR-
OUTR
TPA6141A2
INL+
OUTL
INL-
EN
GAIN
AVDD
SGND
AGND
SW
HPVDD
CPP
HPVSS
CPN
2.2 mF
1 mF
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Class-G DirectPath, DirectPath are trademarks of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated



etcTI TPA6141A2
TPA6141A2
SLOS634A – MARCH 2009 – REVISED AUGUST 2009.................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTIONAL BLOCK DIAGRAM
AVDD
INL-
INL+
INR-
INR+
EN
GAIN
Ramp
Generator
+
Comparator
Compensation
Network
Gate
Drivers
+
SW
AGND
2.2 mH
HPVDD
2.2 mF
Audio
Level
Detector
AVDD
Optimizer
HPVDD
Thermal
Protection
OUTL
HPVSS
HPVDD
Short-Circuit
Protection
OUTR
Interface
HPVSS
HPVDD
Click-and-Pop
Suppression
HPVDD
Charge
Pump
CPP
1 mF
CPN
SGND
HPVSS
2.2 mF
2 Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPA6141A2



etcTI TPA6141A2
TPA6141A2
www.ti.com.................................................................................................................................................... SLOS634A – MARCH 2009 – REVISED AUGUST 2009
DEVICE PINOUT
WCSP PACKAGE
(TOP VIEW)
A1 A2 A3 A4
SW AVDD OUTL INL-
B1
AGND
B2
CPP
B3
HPVDD
B4
INL+
C1
CPN
C2 C3
HPVSS SGND
C4
INR+
D1 D2 D3 D4
EN GAIN OUTR INR-
TERMINAL
NAME
BALL
WCSP
INL–
A4
INL+
B4
INR+
C4
INR-
D4
SGND
EN
GAIN
C3
D1
D2
OUTL
OUTR
CPP
CPN
SW
AVDD
HPVDD
AGND
HPVSS
A3
D3
B2
C1
A1
A2
B3
B1
C2
INPUT /
OUTPUT /
POWER
(I/O/P)
I
I
I
I
I
I
I
O
O
P
P
P
P
P
P
P
TERMINAL FUNCTIONS
DESCRIPTION
Inverting left input for differential signals. Connect to left input signal through 1 μF capacitor for
single-ended input applications.
Non-inverting left input for differential signals. Connect to ground through 1 μF capacitor for
single-ended input applications.
Non-inverting right input for differential signals. Connect to ground through 1 μF capacitor for
single-ended input applications.
Inverting right input for differential signals. Connect to right input signal through 1 μF capacitor for
single-ended input applications.
Sense ground. Connect to shield terminal of headphone jack.
Amplifier enable. Connect to logic low to shutdown; connect to logic high to activate.
Amplifier gain select pin. Connect to logic low to select a gain of 0 dB; connect to logic high to select
a gain of 6 dB.
Left headphone amplifier output. Connect to left terminal of headphone jack.
Right headphone amplifier output. Connect to right terminal of headphone jack.
Charge pump positive flying cap. Connect to positive side of capacitor between CPP and CPN.
Charge pump negative flying cap. Connect to negative side of capacitor between CPP and CPN.
Buck converter switching node.
Primary power supply for device.
Power supply for headphone amplifier (DC/DC output node).
Main Ground for headphone amplifiers, DC/DC converter, and charge pump.
Charge pump output. Connect 2.2 μF capacitor to GND.
TA
–40°C to 85°C
ORDERING INFORMATION
PACKAGED DEVICES (1)
16-ball, WCSP
16-ball, WCSP
PART NUMBER (2)
TPA6141A2YFFR
TPA6141A2YFFT
SYMBOL
ASBI
ASBI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) YFF packages are only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250.
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPA6141A2
3







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