SN74LV244A-EP Octal Buffers/Drivers Datasheet

SN74LV244A-EP Datasheet, PDF, Equivalent


Part Number

SN74LV244A-EP

Description

Octal Buffers/Drivers

Manufacture

etcTI

Total Page 14 Pages
Datasheet
Download SN74LV244A-EP Datasheet


SN74LV244A-EP
www.ti.com
FEATURES
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of –55°C
to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
2-V to 5.5-V VCC Operation
Max tpd of 6.5 ns at 5 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Supports Mixed-Mode Voltage Operation on
All Ports
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
SN74LV244A-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS695 – JANUARY 2006
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DW PACKAGE
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
2
3
4
5
6
7
8
9
10
20 VCC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
DESCRIPTION/ORDERING INFORMATION
This octal buffer/line driver is designed for 2-V to 5.5-V VCC operation.
The SN74LV244A-EP is designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the
device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance
state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the devices when they are powered down.
TA
–55°C to 125°C
SOIC – DW
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
Reel of 2000
SN74LV244AMDWREP
TOP-SIDE MARKING
LV244AMEP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated

SN74LV244A-EP
SN74LV244A-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS695 – JANUARY 2006
1
1OE
1A1 2
1A2 4
1A3 6
1A4 8
FUNCTION TABLE
(EACH BUFFER)
INPUTS
OE A
LH
LL
HX
OUTPUT
Y
H
L
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
19
2OE
18 1Y1
2A1 11
16 1Y2
2A2 13
14 1Y3
2A3 15
12 1Y4
2A4 17
www.ti.com
9 2Y1
7 2Y2
5 2Y3
3 2Y4
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VCC Supply voltage range
VI Input voltage range(2)
VO Voltage range applied to any output in the high-impedance or power-off state(2)
VO Output voltage range applied in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
VO = 0 to VCC
Continuous current through VCC or GND
θJA Package thermal impedance(4)
Tstg Storage temperature range
MIN
–0.5
–0.5
–0.5
–0.5
–65
MAX
7
7
7
VCC + 0.5
–20
–50
±35
±70
58
150
UNIT
V
V
V
V
mA
mA
mA
mA
°C/W
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) This value is limited to 5.5 V maximum.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2


Features www.ti.com FEATURES • Controlled Basel ine – One Assembly/Test Site, One Fab rication Site • Extended Temperature Performance of –55°C to 125°C • E nhanced Diminishing Manufacturing Sourc es (DMS) Support • Enhanced Product-C hange Notification • Qualification Pe digree (1) • 2-V to 5.5-V VCC Operati on • Max tpd of 6.5 ns at 5 V • Typ ical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 3.3 V, TA = 25°C • Supports M ixed-Mode Voltage Operation on All Port s • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 250 mA Per JESD 17 (1) Compone nt qualification in accordance with JED EC and industry standards to ensure rel iable operation over an extended temper ature range. This includes, but is not limited to, Highly Accelerated Stress T est (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, ele ctromigration, bond intermetallic life, and mold compound life. Such qualification testing shou.
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