SN74LV244A-EP Octal Buffers/Drivers Datasheet
|Total Page||14 Pages|
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
• Extended Temperature Performance of –55°C
• Enhanced Diminishing Manufacturing
Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree (1)
• 2-V to 5.5-V VCC Operation
• Max tpd of 6.5 ns at 5 V
• Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
• Supports Mixed-Mode Voltage Operation on
• Ioff Supports Partial-Power-Down Mode
• Latch-Up Performance Exceeds 250 mA Per
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
WITH 3-STATE OUTPUTS
SCLS695 – JANUARY 2006
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
This octal buffer/line driver is designed for 2-V to 5.5-V VCC operation.
The SN74LV244A-EP is designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the
device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the devices when they are powered down.
–55°C to 125°C
SOIC – DW
ORDERABLE PART NUMBER
Reel of 2000
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
WITH 3-STATE OUTPUTS
SCLS695 – JANUARY 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VCC Supply voltage range
VI Input voltage range(2)
VO Voltage range applied to any output in the high-impedance or power-off state(2)
VO Output voltage range applied in the high or low state(2)(3)
IIK Input clamp current
VI < 0
IOK Output clamp current
VO < 0
IO Continuous output current
VO = 0 to VCC
Continuous current through VCC or GND
θJA Package thermal impedance(4)
Tstg Storage temperature range
VCC + 0.5
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) This value is limited to 5.5 V maximum.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
|Features||www.ti.com FEATURES • Controlled Basel ine – One Assembly/Test Site, One Fab rication Site • Extended Temperature Performance of –55°C to 125°C • E nhanced Diminishing Manufacturing Sourc es (DMS) Support • Enhanced Product-C hange Notification • Qualification Pe digree (1) • 2-V to 5.5-V VCC Operati on • Max tpd of 6.5 ns at 5 V • Typ ical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 3.3 V, TA = 25°C • Supports M ixed-Mode Voltage Operation on All Port s • Ioff Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 250 mA Per JESD 17 (1) Compone nt qualification in accordance with JED EC and industry standards to ensure rel iable operation over an extended temper ature range. This includes, but is not limited to, Highly Accelerated Stress T est (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, ele ctromigration, bond intermetallic life, and mold compound life. Such qualification testing shou.|
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