STM32L552ZC 32-bit MCU Datasheet

STM32L552ZC Datasheet, PDF, Equivalent


Part Number

STM32L552ZC

Description

Ultra-low-power Arm Cortex-M33 32-bit MCU

Manufacture

STMicroelectronics

Total Page 30 Pages
Datasheet
Download STM32L552ZC Datasheet


STM32L552ZC
STM32L552xx
Ultra-low-power Arm® Cortex®-M33 32-bit MCU+TrustZone®+FPU,
165 DMIPS, up to 512 KB Flash memory, 256 KB SRAM, SMPS
Datasheet - production data
Features
Ultra-low-power with FlexPowerControl
1.71 V to 3.6 V power supply
-40 °C to 85/125 °C temperature range
Batch acquisition mode (BAM)
187 nA in VBAT mode: supply for RTC and
32x32-bit backup registers
17 nA Shutdown mode (5 wakeup pins)
108 nA Standby mode (5 wakeup pins)
222 nA Standby mode with RTC
3.16 μA Stop 2 with RTC
106 μA/MHz Run mode (LDO mode)
62 μA/MHz Run mode @ 3 V
(SMPS step-down converter mode)
5 µs wakeup from Stop mode
Brownout reset (BOR) in all modes except
Shutdown
Core
Arm® 32-bit Cortex®-M33 CPU with
TrustZone® and FPU
ART Accelerator
8-Kbyte instruction cache allowing 0-wait-state
execution from Flash memory and external
memories; frequency up to 110 MHz, MPU,
165 DMIPS and DSP instructions
Performance benckmark
1.5 DMIPS/MHz (Drystone 2.1)
442 CoreMark® (4.02 CoreMark®/MHz)
Energy benchmark
370 ULPMark-CP® score
54 ULPMark-PP® score
27400 SecureMark-TLS® score
LQFP48 (7 x 7 mm)
LQFP64 (10 x 10 mm)
LQFP100(*) (14 x14 mm)
LQFP144 (20 x 20mm)
FBGA
UFQFPN48 (7 x 7 mm)
UFBGA132 (7 x 7 mm)
WLCSP81 (4.36 x 4.07 mm)
(*): Silhouette shown above.
Memories
Up to 512-Kbyte Flash, two banks read-while-
write
256 Kbytes of SRAM including 64 Kbytes with
hardware parity check
External memory interface supporting SRAM,
PSRAM, NOR, NAND and FRAM memories
OCTOSPI memory interface
Security
Arm® TrustZone® and securable I/Os,
memories and peripherals
Flexible life cycle scheme with RDP (readout
protection)
Root of trust thanks to unique boot entry and
hide protection area (HDP)
SFI (secure firmware installation) thanks to
embedded RSS (root secure services)
Secure firmware upgrade support with TF-M
HASH hardware accelerator
Active tamper and protection against
temperature, voltage and frequency attacks
True random number generator NIST SP800-
90B compliant
96-bit unique ID
February 2020
This is information on a product in full production.
DS12737 Rev 3
1/322
www.st.com

STM32L552ZC
STM32L552xx
512-byte OTP (one-time programmable) for
user data
General-purpose input/outputs
Up to 114 fast I/Os with interrupt capability
most 5 V-tolerant and up to 14 I/Os with
independent supply down to 1.08 V
Power management
Embedded regulator (LDO) with three
configurable range output to supply the digital
circuitry
Embedded SMPS step-down converter
External SMPS support
Clock management
4 to 48 MHz crystal oscillator
32 kHz crystal oscillator for RTC (LSE)
Internal 16 MHz factory-trimmed RC (±1%)
Internal low-power 32 kHz RC (±5%)
Internal multispeed 100 kHz to 48 MHz
oscillator, auto-trimmed by LSE (better than
±0.25% accuracy)
Internal 48 MHz with clock recovery
3 PLLs for system clock, USB, audio, ADC
Up to 16 timers and 2 watchdogs
16x timers: 2 x 16-bit advanced motor-control,
2 x 32-bit and 5 x 16-bit general purpose, 2x
16-bit basic, 3x low-power 16-bit timers
(available in Stop mode), 2x watchdogs, 2x
SysTick timer
RTC with hardware calendar, alarms and
calibration
Up to 19 communication peripherals
1x USB Type-C™/ USB power delivery
controller
1x USB 2.0 full-speed crystal less solution,
LPM and BCD
2x SAIs (serial audio interface)
4x I2C FM+(1 Mbit/s), SMBus/PMBus™
6x USARTs (ISO 7816, LIN, IrDA, modem)
3x SPIs (7x SPIs with USART and OCTOSPI in
SPI mode)
1x FDCAN controller
1x SDMMC interface
2 DMA controllers
14 DMA channels
Up to 22 capacitive sensing channels
Support touch key, linear and rotary touch
sensors
Rich analog peripherals (independent
supply)
2x 12-bit ADC 5 Msps, up to 16-bit with
hardware oversampling, 200 µA/Msps
2x 12-bit DAC outputs, low-power sample and
hold
2x operational amplifiers with built-in PGA
2x ultra-low-power comparators
4x digital filters for sigma delta modulator
CRC calculation unit
Debug
Development support: serial wire debug
(SWD), JTAG, Embedded Trace Macrocell™
(ETM)
Reference
STM32L552xx
Table 1. Device summary
Part numbers
STM32L552CC, STM32L552CE, STM32L552ME, STM32L552QC, STM32L552QE,
STM32L552RC, STM32L552RE, STM32L552VC, STM32L552VE, STM32L552ZC,
STM32L552ZE
2/322
DS12737 Rev 3


Features STM32L552xx Ultra-low-power Arm® Corte x®-M33 32-bit MCU+TrustZone®+FPU, 165 DMIPS, up to 512 KB Flash memory, 256 KB SRAM, SMPS Datasheet - production da ta Features Ultra-low-power with FlexP owerControl • 1.71 V to 3.6 V power s upply • -40 °C to 85/125 °C tempera ture range • Batch acquisition mode ( BAM) • 187 nA in VBAT mode: supply fo r RTC and 32x32-bit backup registers 17 nA Shutdown mode (5 wakeup pins) 108 nA Standby mode (5 wakeup pins) • 222 nA Standby mode with RTC • 3. 16 μA Stop 2 with RTC • 106 μA/MHz Run mode (LDO mode) • 62 μA/MHz Run mode @ 3 V (SMPS step-down converter mo de) • 5 µs wakeup from Stop mode • Brownout reset (BOR) in all modes exce pt Shutdown Core • Arm® 32-bit Corte x®-M33 CPU with TrustZone® and FPU AR T Accelerator • 8-Kbyte instruction c ache allowing 0-wait-state execution fr om Flash memory and external memories; frequency up to 110 MHz, MPU, 165 DMIPS and DSP instructions Performance benckmark • 1.5 DMIPS/MHz (Drystone 2.1) • 442 CoreMark® (4.02 CoreMa.
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