LED Balancer. LM3466 Datasheet


LM3466 Balancer. Datasheet pdf. Equivalent


Part Number

LM3466

Description

Multi-String LED Balancer

Manufacture

etcTI

Total Page 23 Pages
Datasheet
Download LM3466 Datasheet


LM3466
LM3466
www.ti.com
SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013
Multi-String LED Current Balancer for Use with Constant-Current Power Supplies
Check for Samples: LM3466
FEATURES
1
2 Easy to Design for Lighting Systems
Consisting of Multiple LED Strings (Supports
Modular Design)
• Automatically Balances the Current of Every
Active LED String, even the Forward Voltage
of Each String is Different
• Easy to Pre-Set and Fine-Tune Current Ratio
Among LED Strings (e.g., color temperature
adjustment or CRI Enhancement)
• ±1% Current Accuracy at Room Temperature
and ±1.5% Over Temperature
• Maintains Constant Output Power if Some
Strings Open (inactive) by Automatically
Balancing the Current of Remaining Active
LED Strings
• Works with a Constant Current Power Supply
(ac/dc or dc/dc), and no Communication
to/from the Constant Current Power Supply is
Required
• Operates with Minimum Voltage Overhead to
Maximize Power Efficiency
• Wide Input Voltage Range from 6 V to 70 V
• Fault Status Output
• Thermal Shutdown
• Integrated 70-V, 1.5-A MOSFET with 2.06 A
Current Limit
• Maximum 70-V per LED String, 20 LEDs
• Linear Circuitry Does Not Deteriorate EMI
• DDA-8 Exposed Thermal Pad and TO220-7
Packages
DESCRIPTION
The LM3466 integrates a linear LED driver for lighting
systems which consist of multiple LED strings
powered by a constant current power supply. It
balances the current provided by the supply in a pre-
set ratio for each active LED string, where an active
string is a fully turned on LED string, regardless of
the number of strings connected to the supply or the
forward voltage of each LED string. If any LED string
opens during operation, the LM3466 automatically
balances the supply current through all of the
remaining active LED strings. As a result, the overall
brightness of the lighting system is maintained even if
some LED strings open during operation.
The LM3466 lighting system is simple to design
owing to a proprietary control scheme. To minimize
the component count, the LM3466 integrates a 70-V,
1.5-A, N-channel power MOSFET with a current limit
of 2.06 A. To add one more LED string to the system,
only a single resistor, a capacitor, and a LM3466 are
required. Other supervisory features of the LM3466
include under-voltage lock-out, fault reporting,
thermal latch off, and thermal shutdown protection.
The LM3466 consists of only linear circuitry so that
the EMI of the application circuit is not deteriorated.
The LM3466 lighting system is EMI friendly if the
constant current power supply used is complied to
EMI standards. The LM3466 is available in the DDA-
8 exposed thermal pad and TO220-7 packages.
SIMPLIFIED APPLICATION
VIN
Connect to
VIN pin of
another
LM3466
CIN
APPLICATIONS
• Street Lamps
• Solid State Lighting Systems
CLED
LM3466
ILED
VEQ
VIN
SEN
COMM
SRC
GND
RSEN
Connect to
VEQ pin of
another
LM3466
Connect to
COMM pin
of another
LM3466
REQ
CEQ
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated

LM3466
LM3466
SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for
availability and specifications.
MIN
MAX
UNIT
VIN, ILED to GND
–0.3 75 V
COMM to GND
–0.3 7 V
SEN, SRC, VEQ to GND
ESD Rating (2), Human Body Model
–0.3 5 V
–2 2 kV
Storage Temperature Range
–65 150 °C
Junction Temperature (TJ)
150 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kresistor into each pin.
RECOMMENDED OPERATING CONDITIONS(1)
MIN
MAX
UNIT
Supply Voltage Range (VIN)
6 70 V
Junction Temperature Range (TJ)
40 125 °C
(1) Recommended Operating conditions are those under which operation of the device is intended to be functional. For specifications and
test conditions, see the Electrical Characteristics table.
THERMAL INFORMATION
THERMAL METRIC
SO PowerPAD
DDA
TO-220
NEC (1)
UNITS
θJA
θJCtop
θJB
ψJT
ψJB
θJCbot
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
8 PINS
50.7
56.1
28.9
9.8
28.8
3.3
7 PINS
32.2
36.4
25.2
6.2
23.8
0.3
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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Copyright © 2011–2013, Texas Instruments Incorporated


Features LM3466 www.ti.com SNOSB96F – JUNE 20 11 – REVISED NOVEMBER 2013 Multi-Str ing LED Current Balancer for Use with C onstant-Current Power Supplies Check fo r Samples: LM3466 FEATURES 1 •2 Easy to Design for Lighting Systems Consist ing of Multiple LED Strings (Supports M odular Design) • Automatically Balanc es the Current of Every Active LED Stri ng, even the Forward Voltage of Each St ring is Different • Easy to Pre-Set a nd Fine-Tune Current Ratio Among LED St rings (e.g., color temperature adjustme nt or CRI Enhancement) • ±1% Current Accuracy at Room Temperature and ±1.5 % Over Temperature • Maintains Consta nt Output Power if Some Strings Open (i nactive) by Automatically Balancing the Current of Remaining Active LED String s • Works with a Constant Current Pow er Supply (ac/dc or dc/dc), and no Comm unication to/from the Constant Current Power Supply is Required • Operates w ith Minimum Voltage Overhead to Maximiz e Power Efficiency • Wide Input Voltage Range from 6 V to 70 V • Fault Status Outpu.
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