LM8335 Output Expander Datasheet

LM8335 Datasheet, PDF, Equivalent


Part Number

LM8335

Description

General Purpose Output Expander

Manufacture

etcTI

Total Page 21 Pages
Datasheet
Download LM8335 Datasheet


LM8335
LM8335
www.ti.com
SNVS840B – JUNE 2012 – REVISED MAY 2013
LM8335 General Purpose Output Expander with MIPI® RFFE Host Interface
Check for Samples: LM8335
FEATURES
1
2 MIPI RFFE Interface Version 1.10 Compliant
• Supports Output Expansion
• Host Interface Address Select Pin:
– ADR=GND, USID[3:0]=0001
– ADR=VDD, USID[3:0]=1001
• Pin-Configurable Initial State: VIO
– CFG=GND, GPO High-z, with Weak Internal
Pull-Down Resistor Enabled;
GPO_OUT_DATA is Unmasked
– CFG=VDD, GPO High-z, with Weak Internal
Pull-Down Resistor Enabled;
GPO_OUT_DATA is Masked
• Three Sources for Chip Reset:
– VIO Input Pin
– POR
– Software-Commanded Reset
APPLICATIONS:
• Smart Handheld Devices
• RF Transceiver Applications
KEY SPECIFICATIONS
• 1.8 ± 0.15V MIPI RFFE Operation (VIO)
• 1.8 ± 0.15V Core Supply (VDD)
• 1.65 to 3.6V GPO Supply (VDDIO)
• Low Standby and Active Current
• On-Chip Power-On Reset (POR)
30 to +85°C Ambient Temperature Range
• 16-Bump DSBGA Package
– 1.965 mm x 1.965 mm x 0.6 mm, 0.5 mm
Pitch (Nominal)
DESCRIPTION
The LM8335 General Purpose Output Expander is a
dedicated device to provide flexible and general
purpose, host programmable output expansion
functions. This device communicates with a host
processor through a MIPI® RFFE Interface (Mobile
Industry Processor Interface RF Front-End).
Eight general purpose outputs (GPO) can be
configured by the host controller as drive
high/low/high-z. Weak pull-ups (PU) or weak pull-
downs (PD) can be enabled.
Upon power-on, the LM8335 default configuration is
for all GPO to be set based on the state of the CFG
pin.
After startup, any changes to the default configuration
must be sent from the host via the MIPI RFFE host
interface..
The LM8335 is available in a 16-bump lead-free
DSBGA package of size 1.965 mm x 1.965 mm x 0.6
mm (0.5 mm pitch).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated

LM8335
LM8335
SNVS840B – JUNE 2012 – REVISED MAY 2013
Single RFFE Slave Application Block Diagram
www.ti.com
2 Submit Documentation Feedback
Product Folder Links: LM8335
Copyright © 2012–2013, Texas Instruments Incorporated


Features LM8335 www.ti.com SNVS840B – JUNE 20 12 – REVISED MAY 2013 LM8335 General Purpose Output Expander with MIPI® RF FE Host Interface Check for Samples: LM 8335 FEATURES 1 •2 MIPI RFFE Interfa ce Version 1.10 Compliant • Supports Output Expansion • Host Interface Add ress Select Pin: – ADR=GND, USID[3:0] =0001 – ADR=VDD, USID[3:0]=1001 • P in-Configurable Initial State: VIO – CFG=GND, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DA TA is Unmasked – CFG=VDD, GPO High-z, with Weak Internal Pull-Down Resistor Enabled; GPO_OUT_DATA is Masked • Thr ee Sources for Chip Reset: – VIO Inpu t Pin – POR – Software-Commanded Re set APPLICATIONS: • Smart Handheld De vices • RF Transceiver Applications KEY SPECIFICATIONS • 1.8 ± 0.15V MIP I RFFE Operation (VIO) • 1.8 ± 0.15V Core Supply (VDD) • 1.65 to 3.6V GPO Supply (VDDIO) • Low Standby and Act ive Current • On-Chip Power-On Reset (POR) • −30 to +85°C Ambient Temperature Range • 16-Bump DSBGA Package – 1.965 mm x 1.965 mm x 0.6 mm, 0.5 m.
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