STF202-22T1G USB Filter Datasheet

STF202-22T1G Datasheet, PDF, Equivalent


Part Number

STF202-22T1G

Description

USB Filter

Manufacture

ON Semiconductor

Total Page 6 Pages
Datasheet
Download STF202-22T1G Datasheet


STF202-22T1G
STF202-22T1G
USB Filter with ESD
Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for
use in upstream USB ports, Cellular phones, Wireless equipment and
computer applications. This device offers an integrated solution in a
small package (TSOP6, Case 318G) reducing PCB space and cost.
Features:
Provides USB Line Termination, Filtering and ESD Protection
Single IC Offers Cost Savings by Replacing 3 Resistors,
2 Capacitors, and 5 TVs diodes
Bidirectional EMI Filtering Prevents Noise from Entering/Leaving
the System
IEC6100042 ESD Protection for USB Port
Flexible Pulldown or Pullup Line Termination to Meet USB 1.1
Low Speed and High Speed Specification
ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
This is a PbFree Device
Benefits:
TSOP6 Package Minimizes PCB Space
Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
USB Hubs
Computer Peripherals Using USB
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
Steady State Power
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Solder Temperature
(10 second duration)
PD
TJ(max)
TJ
Tstg
TL
225
125
55 to +125
55 to +125
260
mW
°C
°C
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
CIRCUIT DESCRIPTION
GND
6
D(OUT)
5
D(OUT)
4
C Rs1 C Rs2
Rup
1
VBUS
2
D(IN)
3
D(IN)
65 4
123
TSOP6
CASE 318G
STYLE 8
MARKING DIAGRAM
65 4
S22 MG
G
12 3
S22 = Specific Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
STF20222T1G TSOP6 3000/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
September, 2012 Rev. 9
1
Publication Order Number:
STF20222T1/D

STF202-22T1G
STF20222T1G
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Device
Device VRWM
Marking (Volts)
VBR @
1 mA
(Volts)
Min Max
Max IR
@ VRWM
= 5.25 V
VBUS to
GND
(mA)
Max IR
@ VRWM
= 3.3 V
I/O Pin
(mA)
Typical Line
Capacitance
(pF)
(Notes 2, 3)
Series Resistor
RS (W) (Note 1)
Min Nom Max
STF20222T1G S22
5.25 6.0 8.0
5.0
1.0
68 20 22 24
1. For other RS values (i.e. RS = 30 W) contact your local ON Semiconductor sales representative.
2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.
3. For other capacitance values contact your local ON Semiconductor sales representative.
Pullup Resistor
Rup (kW)
Min Nom Max
1.35 1.5 1.65
TYPICAL CHARACTERISTICS
10
0
10 P = 25 dBm
20 Vdc = 0 V
30
40
50
60
70
80
90 0.1
1 10
(MHz)
100 1000
Figure 1. Analog Crosstalk (D+ to D)
50
40
30 P = 25 dBm
20 Vdc = 0 V
10
0
10
20
30
40
50 0.1
1 10
(MHz)
100 1000
Figure 2. Insertion Loss Characteristics
22.2
22.0
RSTARGET
21.8
21.6
21.4
21.2
21.0
30 20 10
0 10 20 30 40 50 60 70 80
TEMPERATURE (°C)
Figure 3. RS versus Temperature
1540
1530
1520
TARGET
1510
1500
1490
1480
1470
1460
1450
30 20 10
0 10 20 30 40 50 60 70 80
TEMPERATURE (°C)
Figure 4. Rup versus Temperature
http://onsemi.com
2


Features STF202-22T1G USB Filter with ESD Protec tion This device is designed for appli cations requiring Line Termination, EMI Filtering and ESD Protection. It is in tended for use in upstream USB ports, C ellular phones, Wireless equipment and computer applications. This device offe rs an integrated solution in a small pa ckage (TSOP−6, Case 318G) reducing PC B space and cost. Features: • Provide s USB Line Termination, Filtering and E SD Protection • Single IC Offers Cost Savings by Replacing 3 Resistors, 2 Ca pacitors, and 5 TVs diodes • Bi−dir ectional EMI Filtering Prevents Noise f rom Entering/Leaving the System • IEC 61000−4−2 ESD Protection for USB Po rt • Flexible Pull−down or Pull−u p Line Termination to Meet USB 1.1 Low Speed and High Speed Specification • ESD Ratings: Machine Model = C ESD Rati ngs: Human Body Model = 3B • This is a Pb−Free Device Benefits: • TSOP 6 Package Minimizes PCB Space • Inte grated Circuit Increases System Reliability versus Discrete Component Implementation • TVs Device.
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