LC898249XH Control LSI Datasheet

LC898249XH Datasheet, PDF, Equivalent


Part Number

LC898249XH

Description

AF Control LSI

Manufacture

ON Semiconductor

Total Page 9 Pages
Datasheet
Download LC898249XH Datasheet


LC898249XH
AF Control LSI
LC898249XH
Overview
This LSI is ClosedAuto Focus control LSI equipped with hall
sensor. It consists of 1 system of feedback circuit and constant current
driver. It has also a builtin EEPROM and temperature sensor.
Features
Builtin Equalizer Circuit Using Digital Operation
AF Control Equalizer Circuit
Any Coefficient can be Specified by 2wire Serial I/F (TWIF)
2wire Serial Interface
(The Communication Protocol is Compatible with I2C)
4 Selectable Slave Addresses
50h(W)/51h(R), 53h(R)
74h(W)/75h(R), 77h(R)
E8h(W)/E9h(R), EBh(R)
E4h(W)/E5h(R), E7h(R) factoryconfigured
Right Side Addresses are Used at the Access of Builtin EEPROM
Builtin A/D Converter
Builtin D/A Converter
Hall Offset
Constant Current Bias
Builtin Hall Sensor
Si Hall Sensor
Builtin EEPROM
64 Byte (16 Byte / Page)
Builtin OSC
Builtin Constant Current Driver
150 mA
Package
WLCSP 6pin (2 x 3 Pin), Thickness Max 0.29 mm,
with Backside Coat
Supply Voltage
VDD (2.6 V to 3.3 V)
This Device is PbFree, Halogen Free/BFR Free and is RoHS
Compliant
www.onsemi.com
WLCSP6, 0.86x1.75x0.265
CASE 567XD
MARKING DIAGRAM
8249XH
ALYWW
8249XH = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
ORDERING INFORMATION
Device
LC898249XHTBG
Package
WLCSP6
Shipping
4000 / Tape
& Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2019
March, 2020 Rev. 0
1
Publication Order Number:
LC898249XH/D

LC898249XH
LC898249XH
PIN DESCRIPTION
Table 1. PIN DESCRIPTION
Pin Name
I
P
NC
O
B
2wire serial interface
SCL I
2wire serial interface clock pin
SDA B
2wire serial interface data pin
Driver interface
OUT1 O
Driver output (to Actuator)
OUT2 O
Driver output (to Actuator)
Power supply pin
VDD P
Power Supply
VSS P
GND
Input
Power Supply, GND
Not Connect
Output
Bidirection
Description
*Process when pins are not used
PIN TYPE “O” – Ensure that it is set to OPEN.
PIN TYPE “I” – OPEN is inhibited. Ensure that it is
connected to the VDD or VSS even when it is unused.
(Please contact ON Semiconductor for more information
about selection of VDD or VSS.)
PIN TYPE “B” – If you are unsure about processing
method on the pin description of pin layout table, please
contact us.
Note that incorrect processing of unused pins may result in
defects.
Table 2. PIN LAYOUT
Circuit Name
Driver
Power
Logic
PIN LAYOUT
Number of PINs
2
2
2
BA
AB
3
SDA
SCL
3 SCL SDA
2 OUT2 OUT1
2 OUT1 OUT2
1
VSS
VDD
1
VDD
VSS
BOTTOM VIEW
Figure 1. Pin Layout
TOP VIEW
www.onsemi.com
2


Features AF Control LSI LC898249XH Overview This LSI is Closed−Auto Focus control LSI equipped with hall sensor. It consists of 1 system of feedback circuit and co nstant current driver. It has also a bu ilt−in EEPROM and temperature sensor. Features • Built−in Equalizer Circ uit Using Digital Operation ♦ AF Cont rol Equalizer Circuit ♦ Any Coefficie nt can be Specified by 2−wire Serial I/F (TWIF) • 2−wire Serial Interfac e (The Communication Protocol is Compat ible with I2C) ♦ 4 Selectable Slave A ddresses − 50h(W)/51h(R), 53h(R) − 74h(W)/75h(R), 77h(R) − E8h(W)/E9h(R) , EBh(R) − E4h(W)/E5h(R), E7h(R) fact ory−configured Right Side Addresses a re Used at the Access of Built−in EEP ROM • Built−in A/D Converter • Bu ilt−in D/A Converter ♦ Hall Offset ♦ Constant Current Bias • Built−i n Hall Sensor ♦ Si Hall Sensor • Bu ilt−in EEPROM ♦ 64 Byte (16 Byte / Page) • Built−in OSC • Built−in Constant Current Driver ♦ 150 mA • Package ♦ WLCSP 6−pin (2 x 3 Pin), Thickness Max 0.29 mm, with Backside Coat • Supply Volta.
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