FLASH MEMORY. W25M121AV Datasheet


W25M121AV MEMORY. Datasheet pdf. Equivalent


Part Number

W25M121AV

Description

SERIAL MCP FLASH MEMORY

Manufacture

Winbond

Total Page 30 Pages
Datasheet
Download W25M121AV Datasheet


W25M121AV
W25M121AV
Featuring
SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations
3V 128M-bit Serial NOR Flash Memory
&
3V 1G-bit Serial NAND Flash Memory
Publication Release Date: August 21, 2017
Preliminary – Revision A

W25M121AV
W25M121AV
Table of Contents
1. GENERAL DESCRIPTIONS............................................................................................................. 2
2. FEATURES....................................................................................................................................... 3
3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4
3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4
3.2 Pad Description WSON 8x6-mm.......................................................................................... 4
4. DEVICE CONFIGURATION & PIN DESCRIPTIONS....................................................................... 5
4.1 Serial MCP (SpiStack®) Device Configuration ..................................................................... 5
4.2 Chip Select (/CS).................................................................................................................. 5
4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5
4.4 Serial Clock (CLK) ................................................................................................................ 6
5. CONCURRENT OPERATION DESCRIPTIONS.............................................................................. 6
6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7
7. SOFTWARE RESET ........................................................................................................................ 8
7.1.1 Enable Reset (66h) and Reset Device (99h) ..........................................................................9
7.1.2 Device Reset (FFh).................................................................................................................9
8. PACKAGE SPECIFICATIONS ....................................................................................................... 10
8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10
9. ORDERING INFORMATION .......................................................................................................... 11
9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12
10. REVISION HISTORY...................................................................................................................... 13
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Features W25M121AV Featuring SERIAL MCP FLASH MEM ORY With Multi I/O SPI & Concurrent Ope rations 3V 128M-bit Serial NOR Flash Me mory & 3V 1G-bit Serial NAND Flash Memo ry Publication Release Date: August 21, 2017 Preliminary – Revision A W25M1 21AV Table of Contents 1. GENERAL DESCR IPTIONS................................ ....................................... ...................................... 2 2. FEATURES.......................... ....................................... ....................................... ............................... 3 3. PA CKAGE TYPES AND PIN CONFIGURATIONS .... ....................................... ............................... 4 3.1 P ad Configuration WSON 8x6-mm .......... ....................................... ..................................... 4 3.2 Pad Description WSON 8x6-mm....... ....................................... ....................................... ..... 4 4. DEVICE CONFIGURATION & PIN D ESCRIPTIONS.......................................................
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