W25M161AV FLASH MEMORY Datasheet

W25M161AV Datasheet, PDF, Equivalent


Part Number

W25M161AV

Description

SERIAL MCP FLASH MEMORY

Manufacture

Winbond

Total Page 30 Pages
Datasheet
Download W25M161AV Datasheet


W25M161AV
W25M161AV
Featuring
SERIAL MCP FLASH MEMORY
With Multi I/O SPI & Concurrent Operations
3V 16M-bit Serial NOR Flash Memory
&
3V 1G-bit Serial NAND Flash Memory
Publication Release Date: August 24, 2016
Preliminary – Revision A

W25M161AV
W25M161AV
Table of Contents
1. GENERAL DESCRIPTIONS............................................................................................................. 2
2. FEATURES....................................................................................................................................... 3
3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4
3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4
3.2 Pad Description WSON 8x6-mm.......................................................................................... 4
4. DEVICE CONFIGURATION & PIN DESCRIPTIONS....................................................................... 5
4.1 Serial MCP (SpiStack®) Device Configuration ..................................................................... 5
4.2 Chip Select (/CS).................................................................................................................. 5
4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5
4.4 Serial Clock (CLK) ................................................................................................................ 6
5. CONCURRENT OPERATION DESCRIPTIONS.............................................................................. 6
6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7
7. SOFTWARE RESET......................................................................................................................... 8
7.1.1 Enable Reset (66h) and Reset Device (99h) ..........................................................................9
7.1.2 Device Reset (FFh).................................................................................................................9
8. PACKAGE SPECIFICATIONS ....................................................................................................... 10
8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10
9. ORDERING INFORMATION .......................................................................................................... 11
9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12
10. REVISION HISTORY...................................................................................................................... 13
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Features W25M161AV Featuring SERIAL MCP FLASH MEM ORY With Multi I/O SPI & Concurrent Ope rations 3V 16M-bit Serial NOR Flash Mem ory & 3V 1G-bit Serial NAND Flash Memor y Publication Release Date: August 24, 2016 Preliminary – Revision A W25M16 1AV Table of Contents 1. GENERAL DESCRI PTIONS................................. ....................................... ..................................... 2 2. FEATURES........................... ....................................... ....................................... .............................. 3 3. PAC KAGE TYPES AND PIN CONFIGURATIONS ..... ....................................... .............................. 4 3.1 Pa d Configuration WSON 8x6-mm ........... ....................................... .................................... 4 3.2 Pad Description WSON 8x6-mm........ ....................................... ....................................... .... 4 4. DEVICE CONFIGURATION & PIN DE SCRIPTIONS........................................................
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