W25Q32JW FLASH MEMORY Datasheet

W25Q32JW Datasheet, PDF, Equivalent


Part Number

W25Q32JW

Description

1.8V 32M-BIT SERIAL FLASH MEMORY

Manufacture

Winbond

Total Page 30 Pages
Datasheet
Download W25Q32JW Datasheet


W25Q32JW
W25Q32JW
1.8V 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL, QUAD SPI
Publication Release Date: December 12, 2019
-Revision G

W25Q32JW
W25Q32JW
Table of Contents
1. GENERAL DESCRIPTIONS ........................................................................................................ 4
2. FEATURES ................................................................................................................................. 4
3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 5
3.1 Pin Configuration SOIC 150-mil / 208-mil ......................................................................... 5
3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ................................. 5
3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ........ 5
3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................... 6
3.5 Ball Description TFBGA 8x6-mm...................................................................................... 6
3.6 Ball Configuration WLCSP ............................................................................................... 7
3.7 Ball Description WLCSP12............................................................................................... 7
4. PIN DESCRIPTIONS ................................................................................................................... 8
4.1 Chip Select (/CS) ............................................................................................................. 8
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 8
4.3 Write Protect (/WP) .......................................................................................................... 8
4.4 HOLD (/HOLD) ................................................................................................................ 8
4.5 Serial Clock (CLK) ........................................................................................................... 8
4.6 Reset (/RESET)(1) ............................................................................................................ 8
5. BLOCK DIAGRAM....................................................................................................................... 9
6. FUNCTIONAL DESCRIPTIONS................................................................................................. 10
6.1 Standard SPI Instructions............................................................................................... 10
6.2 Dual SPI Instructions...................................................................................................... 10
6.3 Quad SPI Instructions .................................................................................................... 10
6.4 Software Reset & Hardware /RESET pin........................................................................ 10
6.5 Write Protection ............................................................................................................. 11
Write Protect Features ..........................................................................................................11
7. STATUS AND CONFIGURATION REGISTERS......................................................................... 12
7.1 Status Registers ............................................................................................................ 12
Erase/Write In Progress (BUSY) Status Only .................................................................12
Write Enable Latch (WEL) Status Only...........................................................................12
Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable.................................12
Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable........................................13
Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................13
Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................13
Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable................................14
Erase/Program Suspend Status (SUS) Status Only .......................................................15
Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ...........15
Quad Enable (QE) Volatile/Non-Volatile Writable...........................................................15
Write Protect Selection (WPS) Volatile/Non-Volatile Writable.........................................16
Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ............................16
Reserved Bits Non Functional ........................................................................................16
Status Register Memory Protection (WPS = 0, CMP = 0).....................................................17
-1-


Features W25Q32JW 1.8V 32M-BIT SERIAL FLASH MEMOR Y WITH DUAL, QUAD SPI Publication Relea se Date: December 12, 2019 -Revision G W25Q32JW Table of Contents 1. GENERAL DESCRIPTIONS .......................... ....................................... ....................................... 4 2. FEATURES ........................ ....................................... ....................................... ........................... 4 3. PACKAG E TYPES AND PIN CONFIGURATIONS ........ ....................................... ........................ 5 3.1 Pin Conf iguration SOIC 150-mil / 208-mil ...... ....................................... ............................ 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ........................... ...... 5 3.3 Pin Description SOIC 150/2 08-mil, WSON 6x5-mm, XSON 4x4-mm, USON4 x3-mm ........ 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . ....................................... ....... 6 3.5 Ball Description TFBGA 8x6-mm.....................
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