Positive-AND Gate. SN74AHC1G09 Datasheet

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SN74AHC1G09 Datasheet
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Part SN74AHC1G09
Description Positive-AND Gate
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SN74AHC1G09
SCLS724D – MAY 2011 – REVISED SEPTEMBER 2016
SN74AHC1G09 Single 2–Input Positive-AND Gate With Open-Drain Output
1 Features
1 Operating Range from 2 V to 5.5 V
• Maximum tpd of 6 ns at 5 V
• ±8-mA Output Drive at 5 V
• Schmitt-Trigger Action at All Inputs Makes the
Circuit Tolerant for Slower Input Rise and Fall
Time
• Latch-Up Performance Exceeds 250 mA Per
JESD 17
• ESD Protection Exceeds JESD 22:
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
2 Applications
• Barcode Scanners
• Cable Solutions
• E-Books
• Embedded PCs
• Field Transmitter: Temperature or Pressure
Sensors
• Fingerprint Biometrics
• HVAC: Heating, Ventilating, and Air Conditioning
• Network-Attached Storage (NAS)
• Server Motherboard and PSU
• Software Defined Radios (SDR)
• TV: High Definition (HDTV), LCD, and Digital
• Video Communications Systems
• Wireless Data Access Cards, Headsets,
Keyboards, Mice, and LAN Cards
3 Description
The SN74AHC1G09 is a single 2-input positive-AND
gate with an open drain output configuration. The
device performs the Boolean logic Y = A × B or
Y = A + B in positive logic.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN74AHC1G09DBVR SOT-23 (5)
2.90 mm × 1.60 mm
SN74AHC1G09DCKR SC70 (5)
2.00 mm × 1.25 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1
A
B2
Logic Diagram
4Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments SN74AHC1G09
SN74AHC1G09
SCLS724D – MAY 2011 – REVISED SEPTEMBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings ............................................................ 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V ........ 5
6.7 Switching Characteristics, VCC = 5 V ± 0.5 V ........... 5
6.8 Operating Characteristics.......................................... 5
6.9 Typical Characteristics .............................................. 5
7 Parameter Measurement Information .................. 6
8 Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 7
8.4 Device Functional Modes.......................................... 7
9 Application and Implementation .......................... 8
9.1 Application Information.............................................. 8
9.2 Typical Application ................................................... 8
10 Power Supply Recommendations ....................... 9
11 Layout..................................................................... 9
11.1 Layout Guidelines ................................................... 9
11.2 Layout Example ...................................................... 9
12 Device and Documentation Support ................. 10
12.1 Documentation Support ........................................ 10
12.2 Receiving Notification of Documentation Updates 10
12.3 Community Resources.......................................... 10
12.4 Trademarks ........................................................... 10
12.5 Electrostatic Discharge Caution ............................ 10
12.6 Glossary ................................................................ 10
13 Mechanical, Packaging, and Orderable
Information ........................................................... 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (January 2016) to Revision D
Page
• Deleted 200-V Machine Model from Features ....................................................................................................................... 1
• Changed description for pin A from No connection to Input................................................................................................... 3
• Added Receiving Notification of Documentation Updates section ....................................................................................... 10
Changes from Revision B (July 2011) to Revision C
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
2 Submit Documentation Feedback
Copyright © 2011–2016, Texas Instruments Incorporated
Product Folder Links: SN74AHC1G09



Texas Instruments SN74AHC1G09
www.ti.com
5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
SN74AHC1G09
SCLS724D – MAY 2011 – REVISED SEPTEMBER 2016
DCK Package
5-Pin SC70
Top View
A
B
GND
1
2
3
5 VCC
4Y
A
B
GND
1
2
3
5 VCC
4Y
Not to scale
Not to scale
NAME
A
B
GND
VCC
Y
PIN
NO.
1
2
3
5
4
Pin Functions(1)
I/O
I Input
I Input
— Ground
— Power pin
O Output
(1) See Mechanical, Packaging, and Orderable Information for dimensions.
DESCRIPTION
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC Supply voltage
VI Input voltage(2)
VO Output voltage(2)
IIK Input clamp current (VI < 0)
IOK Output clamp current (VO < 0 or VO > VCC)
IO Continuous output current (VO = 0 to VCC)
Continuous current through VCC or GND
TJ Maximum junction temperature
Tstg Storage temperature
–0.5
–0.5
–0.5
–20
–20
–25
–50
–65
7
7
VCC + 0.7
+25
+50
150
150
V
V
V
mA
mA
mA
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
V(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
VALUE
±2500
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
Copyright © 2011–2016, Texas Instruments Incorporated
Product Folder Links: SN74AHC1G09
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