10-BIT BUFFER. CY74FCT2827T Datasheet

CY74FCT2827T BUFFER. Datasheet pdf. Equivalent

Part CY74FCT2827T
Description 10-BIT BUFFER
Feature D Function and Pinout Compatible With FCT, F, and AM29827 Logic D 25-Ω Output Series Resistors Reduc.
Manufacture etcTI
Total Page 12 Pages
Datasheet
Download CY74FCT2827T Datasheet



CY74FCT2827T
D Function and Pinout Compatible With FCT,
F, and AM29827 Logic
D 25-Output Series Resistors Reduce
Transmission-Line Reflection Noise
D Reduced VOH (Typically = 3.3 V) Versions
of Equivalent FCT Functions
D Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
D Ioff Supports Partial-Power-Down Mode
Operation
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
D Matched Rise and Fall Times
D Fully Compatible With TTL Input and
Output Logic Levels
D 12-mA Output Sink Current
15-mA Output Source Current
D 3-State Outputs
CY74FCT2827T
10-BIT BUFFER
WITH 3-STATE OUTPUTS
SCCS045A – MAY 1994 – REVISED SEPTEMBER 2001
Q PACKAGE
(TOP VIEW)
OE1
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
GND
1
2
3
4
5
6
7
8
9
10
11
12
24 VCC
23 Y0
22 Y1
21 Y2
20 Y3
19 Y4
18 Y5
17 Y6
16 Y7
15 Y8
14 Y9
13 OE2
description
The CY74FCT2827T 10-bit buffer provides high-performance bus-interface buffering for wide data/address
paths or buses carrying parity. This 10-bit buffer has NANDed output-enable (OE) inputs for maximum control
flexibility. The CY74FCT2827T is designed for high-capacitance-load drive capability, while providing
low-capacitance bus loading at both inputs and outputs. All inputs have clamp diodes and all outputs are
designed for low-capacitance bus loading in the high-impedance state. On-chip termination resistors at the
outputs reduce system noise caused by reflections. The CY74FCT2827T can replace the CY74FCT827T to
reduce noise in an existing design.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE†
SPEED
(ns)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QSOP – Q Tape and reel 4.4 CY74FCT2827CTQCT FCT2827C
–40°C to 85°C
QSOP – Q Tape and reel 8 CY74FCT2827ATQCT FCT2827A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 2001, Texas Instruments Incorporated
1



CY74FCT2827T
CY74FCT2827T
10-BIT BUFFER
WITH 3-STATE OUTPUTS
SCCS045A MAY 1994 REVISED SEPTEMBER 2001
FUNCTION TABLE
INPUTS
OE1
L
OE2
L
LL
D
L
H
OUTPUT
Y
L
H
FUNCTION
Transparent
HXX
XHX
Z
Z
3-State
H = High logic level, L = Low logic level, X = Dont care,
Z = High-impedance state
logic diagram (positive logic)
OE1
OE2
1
13
2
D0
23
Y0
To Nine Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θJA (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61°C/W
Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 135°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and
functionaloperation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
MIN NOM MAX UNIT
VCC Supply voltage
VIH High-level input voltage
VIL Low-level input voltage
IOH High-level output current
IOL Low-level output current
TA Operating free-air temperature
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
4.75
2
40
5 5.25 V
V
0.8 V
15 mA
12 mA
85 °C
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265





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