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32-bit MCU. S9KEAZ128ACLK Datasheet

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32-bit MCU. S9KEAZ128ACLK Datasheet






S9KEAZ128ACLK MCU. Datasheet pdf. Equivalent




S9KEAZ128ACLK MCU. Datasheet pdf. Equivalent





Part

S9KEAZ128ACLK

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data KEA128 Sub-Family Data Sheet Supp orts the following: S9KEAZ64AMLK(R), S9 KEAZ128AMLK(R), S9KEAZ64AVLK(R), S9KEAZ 128AVLK(R), S9KEAZ64ACLK(R), S9KEAZ128A CLK(R), S9KEAZ64AMLH(R), S9KEAZ128AMLH( R), S9KEAZ64AVLH(R), S9KEAZ128AVLH(R), S9KEAZ64ACLH(R) and S9KEAZ128ACLH(R) Ke y features • Operating characteristic s – Voltage range: 2.
Manufacture

NXP

Datasheet
Download S9KEAZ128ACLK Datasheet


NXP S9KEAZ128ACLK

S9KEAZ128ACLK; .7 to 5.5 V – Flash write voltage rang e: 2.7 to 5.5 V – Temperature range ( ambient): -40 to 125°C • Performance – Up to 48 MHz Arm® Cortex-M0+ core – Single cycle 32-bit x 32-bit multi plier – Single cycle I/O access port • Memories and memory interfaces – Up to 128 KB flash – Up to 16 KB RAM • Clocks – Oscillator (OSC) - suppo rts 32.768 kHz crystal or 4 MHz to 24 MHz .


NXP S9KEAZ128ACLK

crystal or ceramic resonator; choice of low power or high gain oscillators – Internal clock source (ICS) - internal FLL with internal or external reference , 37.5 kHz pre-trimmed internal referen ce for 48 MHz system clock – Internal 1 kHz low-power oscillator (LPO) Docu ment Number S9KEA128P80M48SF0 Rev. 5, 0 9/2019 S9KEA128P80M48SF0 • System per ipherals – Power managem.


NXP S9KEAZ128ACLK

ent module (PMC) with three power modes: Run, Wait, Stop – Low-voltage detect ion (LVD) with reset or interrupt, sele ctable trip points – Watchdog with in dependent clock source (WDOG) – Progr ammable cyclic redundancy check module (CRC) – Serial wire debug interface ( SWD) – Aliased SRAM bitband region (B IT-BAND) – Bit manipulation engine (B ME) • Security and integrity m.

Part

S9KEAZ128ACLK

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data KEA128 Sub-Family Data Sheet Supp orts the following: S9KEAZ64AMLK(R), S9 KEAZ128AMLK(R), S9KEAZ64AVLK(R), S9KEAZ 128AVLK(R), S9KEAZ64ACLK(R), S9KEAZ128A CLK(R), S9KEAZ64AMLH(R), S9KEAZ128AMLH( R), S9KEAZ64AVLH(R), S9KEAZ128AVLH(R), S9KEAZ64ACLH(R) and S9KEAZ128ACLH(R) Ke y features • Operating characteristic s – Voltage range: 2.
Manufacture

NXP

Datasheet
Download S9KEAZ128ACLK Datasheet




 S9KEAZ128ACLK
NXP Semiconductors
Data Sheet: Technical Data
KEA128 Sub-Family Data
Sheet
Supports the following:
S9KEAZ64AMLK(R),
S9KEAZ128AMLK(R),
S9KEAZ64AVLK(R),
S9KEAZ128AVLK(R),
S9KEAZ64ACLK(R),
S9KEAZ128ACLK(R),
S9KEAZ64AMLH(R),
S9KEAZ128AMLH(R),
S9KEAZ64AVLH(R),
S9KEAZ128AVLH(R),
S9KEAZ64ACLH(R) and
S9KEAZ128ACLH(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 125°C
• Performance
– Up to 48 MHz Arm® Cortex-M0+ core
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 128 KB flash
– Up to 16 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4
MHz to 24 MHz crystal or ceramic resonator; choice
of low power or high gain oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 37.5 kHz pre-trimmed
internal reference for 48 MHz system clock
– Internal 1 kHz low-power oscillator (LPO)
Document Number S9KEA128P80M48SF0
Rev. 5, 09/2019
S9KEA128P80M48SF0
• System peripherals
– Power management module (PMC) with three power
modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,
selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Aliased SRAM bitband region (BIT-BAND)
– Bit manipulation engine (BME)
• Security and integrity modules
– 80-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 57 general-purpose input/output (GPIO)
– Up to 37 general-purpose input/output (GPIO)
– Up to 22 general-purpose input/output (GPIO)
– Up to 14 general-purpose input/output (GPIO)
– Up to 71 general-purpose input/output (GPIO)
– Two 32-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.




 S9KEAZ128ACLK
• Analog modules
– One up to 16-channel 12-bit SAR ADC, operation in Stop mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DAC and programmable reference input (ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– Two 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One pulse width timer (PWT)
– One real-time clock (RTC)
• Communication interfaces
– Two SPI modules (SPI)
– Up to three UART modules (UART)
– Two I2C modules (I2C)
– One MSCAN module (MSCAN)
• Package options
– 80-pin LQFP
– 64-pin LQFP
KEA128 Sub-Family Data Sheet, Rev. 5, 09/2019
2 NXP Semiconductors




 S9KEAZ128ACLK
Table of Contents
1 Ordering parts.......................................................................................4
4.2.2 FTM module timing....................................................... 16
1.1 Determining valid orderable parts............................................... 4
4.3 Thermal specifications................................................................. 17
2 Part identification................................................................................. 4
4.3.1 Thermal characteristics.................................................. 17
2.1 Description...................................................................................4
5 Peripheral operating requirements and behaviors................................ 19
2.2 Format.......................................................................................... 4
5.1 Core modules............................................................................... 19
2.3 Fields............................................................................................4
5.1.1 SWD electricals .............................................................19
2.4 Example....................................................................................... 5
5.2 External oscillator (OSC) and ICS characteristics.......................20
3 Ratings..................................................................................................5
5.3 NVM specifications..................................................................... 22
3.1 Thermal handling ratings............................................................. 5
5.4 Analog..........................................................................................23
3.2 Moisture handling ratings............................................................ 5
5.4.1 ADC characteristics....................................................... 23
3.3 ESD handling ratings................................................................... 6
5.4.2 Analog comparator (ACMP) electricals.........................25
3.4 Voltage and current operating ratings..........................................6
5.5 Communication interfaces........................................................... 26
4 General................................................................................................. 7
5.5.1 SPI switching specifications.......................................... 26
4.1 Nonswitching electrical specifications........................................ 7
5.5.2 MSCAN......................................................................... 29
4.1.1 DC characteristics.......................................................... 7
6 Dimensions...........................................................................................29
4.1.2 Supply current characteristics........................................ 13
6.1 Obtaining package dimensions.................................................... 29
4.1.3 EMC performance..........................................................15
7 Pinout................................................................................................... 30
4.2 Switching specifications.............................................................. 15
7.1 Signal multiplexing and pin assignments.................................... 30
4.2.1 Control timing................................................................ 15
8 Revision History...................................................................................30
NXP Semiconductors
KEA128 Sub-Family Data Sheet, Rev. 5, 09/2019
3






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