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32-bit MCU. S9KEAZN16AMLH Datasheet

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32-bit MCU. S9KEAZN16AMLH Datasheet






S9KEAZN16AMLH MCU. Datasheet pdf. Equivalent




S9KEAZN16AMLH MCU. Datasheet pdf. Equivalent





Part

S9KEAZN16AMLH

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number S9KEA64P64M20SF0 Rev. 6, 10/2019 KEA64 Sub-Family Data Sheet Supports the following: S9KEAZN1 6AMLC(R), S9KEAZN32AMLC(R), S9KEAZN64AM LC(R), S9KEAZN16AMLH(R), S9KEAZN32AMLH( R), and S9KEAZN64AMLH(R) Key features ⠀¢ Operating characteristics – Voltag e range: 2.7 to 5.5 V – Flash write v oltage range: 2.7 to 5.5.
Manufacture

NXP

Datasheet
Download S9KEAZN16AMLH Datasheet


NXP S9KEAZN16AMLH

S9KEAZN16AMLH; V – Temperature range (ambient): -40 to 125°C • Performance – Up to 40 MHz Arm® Cortex-M0+ core and up to 20 MHz bus clock – Single cycle 32-bit x 32-bit multiplier – Single cycle I/O access port • Memories and memory in terfaces – Up to 64 KB flash – Up t o 256 B EEPROM – Up to 4 KB RAM • C locks – Oscillator (OSC) - supports 3 2.768 kHz crystal or 4 MHz to 20 MHz cryst.


NXP S9KEAZN16AMLH

al or ceramic resonator; choice of low p ower or high gain oscillators – Inter nal clock source (ICS) - internal FLL w ith internal or external reference, 31. 25 kHz pretrimmed internal reference fo r 40 MHz system and core clock. – Int ernal 1 kHz low-power oscillator (LPO) S9KEA64P64M20SF0 • System peripheral s – Power management module (PMC) wit h three power modes: Run, .


NXP S9KEAZN16AMLH

Wait, Stop – Low-voltage detection (LV D) with reset or interrupt, selectable trip points – Watchdog with independe nt clock source (WDOG) – Programmable cyclic redundancy check module (CRC) ⠀“ Serial wire debug interface (SWD) †“ Bit manipulation engine (BME) • Sec urity and integrity modules – 64-bit unique identification (ID) number per c hip • Human-machine interface – .

Part

S9KEAZN16AMLH

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number S9KEA64P64M20SF0 Rev. 6, 10/2019 KEA64 Sub-Family Data Sheet Supports the following: S9KEAZN1 6AMLC(R), S9KEAZN32AMLC(R), S9KEAZN64AM LC(R), S9KEAZN16AMLH(R), S9KEAZN32AMLH( R), and S9KEAZN64AMLH(R) Key features ⠀¢ Operating characteristics – Voltag e range: 2.7 to 5.5 V – Flash write v oltage range: 2.7 to 5.5.
Manufacture

NXP

Datasheet
Download S9KEAZN16AMLH Datasheet




 S9KEAZN16AMLH
NXP Semiconductors
Data Sheet: Technical Data
Document Number S9KEA64P64M20SF0
Rev. 6, 10/2019
KEA64 Sub-Family Data
Sheet
Supports the following:
S9KEAZN16AMLC(R),
S9KEAZN32AMLC(R),
S9KEAZN64AMLC(R),
S9KEAZN16AMLH(R),
S9KEAZN32AMLH(R), and
S9KEAZN64AMLH(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 125°C
• Performance
– Up to 40 MHz Arm® Cortex-M0+ core and up to 20
MHz bus clock
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 64 KB flash
– Up to 256 B EEPROM
– Up to 4 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4
MHz to 20 MHz crystal or ceramic resonator; choice
of low power or high gain oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 31.25 kHz pre-
trimmed internal reference for 40 MHz system and
core clock.
– Internal 1 kHz low-power oscillator (LPO)
S9KEA64P64M20SF0
• System peripherals
– Power management module (PMC) with three power
modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,
selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Bit manipulation engine (BME)
• Security and integrity modules
– 64-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 57 general-purpose input/output (GPIO)
– Up to 22 general-purpose input/output (GPIO)
– Up to 14 general-purpose input/output (GPIO)
– Two up to 8-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
• Analog modules
– One up to 16-channel 12-bit SAR ADC, operation in
Stop mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DAC
and programmable reference input (ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– Two 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One real-time clock (RTC)
• Communication interfaces
– Two SPI modules (SPI)
– Up to three UART modules (UART)
– One I2C module (I2C)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.




 S9KEAZN16AMLH
• Package options
– 64-pin LQFP
– 32-pin LQFP
KEA64 Sub-Family Data Sheet, Rev. 6, 10/2019
2 NXP Semiconductors




 S9KEAZN16AMLH
Table of Contents
1 Ordering parts.......................................................................................4
4.2.2 FTM module timing....................................................... 16
1.1 Determining valid orderable parts............................................... 4
4.3 Thermal specifications................................................................. 17
2 Part identification................................................................................. 4
4.3.1 Thermal characteristics.................................................. 17
2.1 Description...................................................................................4
5 Peripheral operating requirements and behaviors................................ 18
2.2 Format.......................................................................................... 4
5.1 Core modules............................................................................... 18
2.3 Fields............................................................................................4
5.1.1 SWD electricals .............................................................18
2.4 Example....................................................................................... 5
5.2 External oscillator (OSC) and ICS characteristics.......................19
3 Ratings..................................................................................................5
5.3 NVM specifications..................................................................... 21
3.1 Thermal handling ratings............................................................. 5
5.4 Analog..........................................................................................23
3.2 Moisture handling ratings............................................................ 5
5.4.1 ADC characteristics....................................................... 23
3.3 ESD handling ratings................................................................... 6
5.4.2 Analog comparator (ACMP) electricals.........................25
3.4 Voltage and current operating ratings..........................................6
5.5 Communication interfaces........................................................... 26
4 General................................................................................................. 7
5.5.1 SPI switching specifications.......................................... 26
4.1 Nonswitching electrical specifications........................................ 7
6 Dimensions...........................................................................................29
4.1.1 DC characteristics.......................................................... 7
6.1 Obtaining package dimensions.................................................... 29
4.1.2 Supply current characteristics........................................ 13
7 Pinout................................................................................................... 29
4.1.3 EMC performance..........................................................15
7.1 Signal multiplexing and pin assignments.................................... 29
4.2 Switching specifications.............................................................. 15
8 Revision History...................................................................................30
4.2.1 Control timing................................................................ 15
NXP Semiconductors
KEA64 Sub-Family Data Sheet, Rev. 6, 10/2019
3






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