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32-bit MCU. S9KEAZN8AMFK Datasheet

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32-bit MCU. S9KEAZN8AMFK Datasheet






S9KEAZN8AMFK MCU. Datasheet pdf. Equivalent




S9KEAZN8AMFK MCU. Datasheet pdf. Equivalent





Part

S9KEAZN8AMFK

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number S9KEA8P44M48SF0 Rev. 5, 10/2019 KEA8 Sub-Family Data S heet Supports the following: S9KEAZN8AC TG(R), S9KEAZN8ACFK(R), S9KEAZN8AMTG(R) and S9KEAZN8AMFK(R) Key features • O perating characteristics – Voltage ra nge: 2.7 to 5.5 V – Flash write volta ge range: 2.7 to 5.5 V – Temperature range (ambient): -40 to 12.
Manufacture

NXP

Datasheet
Download S9KEAZN8AMFK Datasheet


NXP S9KEAZN8AMFK

S9KEAZN8AMFK; 5°C • Performance – Up to 48 MHz Ar m® Cortex-M0+ core – Single cycle 32 -bit x 32-bit multiplier – Single cyc le I/O access port • Memories and mem ory interfaces – Up to 8 KB flash – Up to 1 KB RAM • Clocks – Oscillat or (OSC) - supports 32.768 kHz crystal or 4 MHz to 24 MHz crystal or ceramic r esonator; choice of low power or high g ain oscillators – Internal clock sourc.


NXP S9KEAZN8AMFK

e (ICS) - internal FLL with internal or external reference, 37.5 kHz pre-trimme d internal reference for 48 MHz system clock – Internal 1 kHz low-power osci llator (LPO) • System peripherals – Power management module (PMC) with thr ee power modes: Run, Wait, Stop – Low -voltage detection (LVD) with reset or interrupt, selectable trip points – W atchdog with independent clo.


NXP S9KEAZN8AMFK

ck source (WDOG) – Programmable cyclic redundancy check module (CRC) – Seri al wire debug interface (SWD) – Alias ed SRAM bitband region (BIT-BAND) – B it manipulation engine (BME) S9KEA8P44 M48SF0 • Security and integrity modul es – 80-bit unique identification (ID ) number per chip • Human-machine int erface – Up to 57 general-purpose inp ut/output (GPIO) – Up to 37 genera.

Part

S9KEAZN8AMFK

Description

32-bit MCU



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number S9KEA8P44M48SF0 Rev. 5, 10/2019 KEA8 Sub-Family Data S heet Supports the following: S9KEAZN8AC TG(R), S9KEAZN8ACFK(R), S9KEAZN8AMTG(R) and S9KEAZN8AMFK(R) Key features • O perating characteristics – Voltage ra nge: 2.7 to 5.5 V – Flash write volta ge range: 2.7 to 5.5 V – Temperature range (ambient): -40 to 12.
Manufacture

NXP

Datasheet
Download S9KEAZN8AMFK Datasheet




 S9KEAZN8AMFK
NXP Semiconductors
Data Sheet: Technical Data
Document Number S9KEA8P44M48SF0
Rev. 5, 10/2019
KEA8 Sub-Family Data Sheet
Supports the following:
S9KEAZN8ACTG(R),
S9KEAZN8ACFK(R),
S9KEAZN8AMTG(R) and
S9KEAZN8AMFK(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 125°C
• Performance
– Up to 48 MHz Arm® Cortex-M0+ core
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 8 KB flash
– Up to 1 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal or 4
MHz to 24 MHz crystal or ceramic resonator; choice
of low power or high gain oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 37.5 kHz pre-trimmed
internal reference for 48 MHz system clock
– Internal 1 kHz low-power oscillator (LPO)
• System peripherals
– Power management module (PMC) with three power
modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or interrupt,
selectable trip points
– Watchdog with independent clock source (WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Aliased SRAM bitband region (BIT-BAND)
– Bit manipulation engine (BME)
S9KEA8P44M48SF0
• Security and integrity modules
– 80-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 57 general-purpose input/output (GPIO)
– Up to 37 general-purpose input/output (GPIO)
– Up to 22 general-purpose input/output (GPIO)
– Up to 14 general-purpose input/output (GPIO)
– Two up to 8-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
• Analog modules
– One 12-channel 12-bit SAR ADC, operation in Stop
mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit DAC
and programmable reference input (ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– One 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One pulse width timer (PWT)
– One real-time clock (RTC)
• Communication interfaces
– One SPI module (SPI)
– One UART module (UART)
– One I2C module (I2C)
• Package options
– 24-pin QFN
– 16-pin TSSOP
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.




 S9KEAZN8AMFK
Table of Contents
1 Ordering parts.......................................................................................3
4.2.2 FTM module timing....................................................... 15
1.1 Determining valid orderable parts............................................... 3
4.3 Thermal specifications................................................................. 16
2 Part identification................................................................................. 3
4.3.1 Thermal characteristics.................................................. 16
2.1 Description...................................................................................3
5 Peripheral operating requirements and behaviors................................ 17
2.2 Format.......................................................................................... 3
5.1 Core modules............................................................................... 17
2.3 Fields............................................................................................3
5.1.1 SWD electricals .............................................................18
2.4 Example....................................................................................... 4
5.2 External oscillator (OSC) and ICS characteristics.......................19
3 Ratings..................................................................................................4
5.3 NVM specifications..................................................................... 21
3.1 Thermal handling ratings............................................................. 4
5.4 Analog..........................................................................................22
3.2 Moisture handling ratings............................................................ 4
5.4.1 ADC characteristics....................................................... 22
3.3 ESD handling ratings................................................................... 5
5.4.2 Analog comparator (ACMP) electricals.........................24
3.4 Voltage and current operating ratings..........................................5
5.5 Communication interfaces........................................................... 25
4 General................................................................................................. 6
5.5.1 SPI switching specifications.......................................... 25
4.1 Nonswitching electrical specifications........................................ 6
6 Dimensions...........................................................................................28
4.1.1 DC characteristics.......................................................... 6
6.1 Obtaining package dimensions.................................................... 28
4.1.2 Supply current characteristics........................................ 12
7 Pinout................................................................................................... 28
4.1.3 EMC performance..........................................................14
7.1 Signal multiplexing and pin assignments.................................... 28
4.2 Switching specifications.............................................................. 14
8 Revision History...................................................................................29
4.2.1 Control timing................................................................ 14
KEA8 Sub-Family Data Sheet, Rev. 5, 10/2019
2 NXP Semiconductors




 S9KEAZN8AMFK
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to nxp.com and perform a part number search for the
following device numbers: KEAZN8.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q B KEA A C FFF M T PP N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
B
KEA
A
C
Description
Qualification status
Memory type
Kinetis Auto family
Key attribute
CAN availability
Values
• S = Automotive qualified
• P = Prequalification
• 9 = Flash
• KEA
• Z = M0+ core
• F = M4 W/ DSP & FPU
• C= M4 W/ AP + FPU
• N = CAN not available
• (Blank) = CAN available
Table continues on the next page...
NXP Semiconductors
KEA8 Sub-Family Data Sheet, Rev. 5, 10/2019
3






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