DMD. DLP6500 Datasheet

DLP6500 DMD. Datasheet pdf. Equivalent

Part DLP6500
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DLP6500
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DLP6500
DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016
DLP6500 0.65 1080p MVSP Type A DMD
1 Features
1 High Resolution 1080p (1920×1080) Array With
>2 Million Micromirrors
– 0.65-Inch Micromirror Array Diagonal
– 7.56 µm Micromirror Pitch
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Designed for Corner Illumination
• Designed for Use With Broadband Visible Light
(400 nm – 700 nm)
– Window Transmission 97% (Single Pass,
Through Two Window Surfaces)
– Micromirror Reflectivity 88%
– Array Diffraction Efficiency 86%
– Array Fill Factor 92%
• Two 16-Bit, Low Voltage Differential Signaling
(LVDS), Double Data Rate (DDR) Buses
• Two Dedicated Controller Options at 400 MHz
Input Data Clock Rate
• DLPC900 Digital Controller
– Up to 9523 Hz (1-Bit Binary Patterns)
– Up to 19.7 Giga-bits Per Second (1-Bit Binary
Patterns)
– Up to 1031 Hz (8-Bit Gray Patterns Pre-
Loaded With Illumination Modulation), External
Input Up to 360 Hz
• DLPC910 Digital Controller
– Up to 11574 Hz (1-Bit Binary Patterns)
– Up to 24 Giga-bits Per Second (1-Bit Binary
Patterns)
– Up to 1446 Hz (8-Bit Gray Patterns With
Illumination Modulation)
• Integrated Micromirror Driver Circuitry
• Hermetic Package
DLPC900 Simplified Diagram
PCLK, DE
HSYNC, VSYNC
24-bit RGB Data
Red,Green,Blue PWM
LED
LED Strobes
Driver
USB
I2C
Flash
DLPC900
FAN
OSC
DMD CTL, DATA
SCP
Voltage
Supplies
DLP6500FLQ
2 Applications
• Industrial
– 3D Scanners for Machine Vision and Quality
Control
– 3D Printing
– Direct Imaging Lithography
– Laser Marking and Repair
• Medical
– Ophthalmology
– 3D Scanners for Limb and Skin Measurement
– Hyper-spectral Imaging
• Displays
– 3D Imaging Microscopes
– Intelligent and Adaptive Lighting
3 Description
Featuring over 2 million micromirrors in a hermetic
package, the high resolution 0.65 1080p digital
micromirror device (DMD) is a spatial light modulator
(SLM) that modulates the amplitude, direction, and/or
phase of incoming light. The unique capability and
value offered by the DLP6500, including operation at
405nm, makes it well suited to support a wide variety
of industrial, medical, and advanced imaging
applications. Reliable function and operation of the
DLP6500 requires that it be used in conjunction with
the DLPC900 or the DLPC910 digital controllers. This
dedicated chipset provides full HD resolution at high
speeds and can be easily integrated into a variety of
end equipment solutions.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DLP6500
FLQ (203)
40.6 mm × 31.8 mm
× 6 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
DLPC910 Simplified Diagram
LVDS Interface
Row and Block Signals
Control Signals
Status Signals
JTAG(3:0)
DLPR910 PGM(4:0)
CTRL_RSTZ
I2C
OSC
50 MHz
DLPC910
Illumination
Driver
Illumination
Sensor
LVD Interface
RESET Signals
SCP Interface
VLED0
VLED1
DLP6500FLQ
Power Management
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP6500
DLP6500
DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 8
6.1 Absolute Maximum Ratings ...................................... 8
6.2 Storage Conditions.................................................... 8
6.3 ESD Ratings.............................................................. 9
6.4 Recommended Operating Conditions....................... 9
6.5 Thermal Information ................................................ 11
6.6 Electrical Characteristics......................................... 12
6.7 Timing Requirements .............................................. 13
6.8 Typical Characteristics ............................................ 17
6.9 System Mounting Interface Loads .......................... 18
6.10 Micromirror Array Physical Characteristics ........... 19
6.11 Micromirror Array Optical Characteristics ............. 20
6.12 Window Characteristics......................................... 21
6.13 Chipset Component Usage Specification ............. 21
7 Detailed Description ............................................ 22
7.1 Overview ................................................................. 22
7.2 Functional Block Diagram ....................................... 23
7.3 Feature Description................................................. 24
7.4 Device Functional Modes........................................ 27
7.5 Window Characteristics and Optics ....................... 27
7.6 Micromirror Array Temperature Calculation............ 28
7.7 Micromirror Landed-on/Landed-Off Duty Cycle ...... 29
8 Application and Implementation ........................ 31
8.1 Application Information............................................ 31
8.2 Typical Application ................................................. 31
9 Power Supply Requirements .............................. 33
9.1 DMD Power Supply Requirements ........................ 33
9.2 DMD Power Supply Power-Up Procedure .............. 33
9.3 DMD Mirror Park Sequence Requirements ............ 33
9.4 DMD Power Supply Power-Down Procedure ......... 34
10 Layout................................................................... 37
10.1 Layout Guidelines ................................................. 37
10.2 Layout Example .................................................... 37
11 Device and Documentation Support ................. 42
11.1 Device Support...................................................... 42
11.2 Documentation Support ....................................... 43
11.3 Community Resources.......................................... 43
11.4 Trademarks ........................................................... 43
11.5 Electrostatic Discharge Caution ............................ 43
11.6 Glossary ................................................................ 43
12 Mechanical, Packaging, and Orderable
Information ........................................................... 43
4 Revision History
Changes from Original (October 2014) to Revision A
Page
• Updated features to include additional digital controller......................................................................................................... 1
• Added additional symplified diagram...................................................................................................................................... 1
• Removed DLKC_C and DCLK_D, separated TCASE into TARRAY and TWINDOW, added TDELTA, and reduced
fclock in Absolute Maximum Ratings...................................................................................................................................... 8
• Separated handling ratings into Storage Conditions and ESD Ratings. ................................................................................ 8
• Changed TDMD to TARRAY, TGRADIENT to TDELTA, and added short term operational values in Recommended
Operating Conditions .............................................................................................................................................................. 9
• Updated Micromirror Derating Curve.................................................................................................................................... 11
• Added typical characteristics when DMD is controlled with the DLPC910........................................................................... 17
• Update CL2W constant in Micromirror Array Termperature Calculation. ............................................................................. 28
• Added recommended idle mode operation for maximizing mirror useful life. ...................................................................... 29
• Added additional typical application schematic. ................................................................................................................... 31
• Added DMD Mirror Park Sequence requirements. ............................................................................................................... 33
• Added cross reference to DMD Mirror Park Sequence requirements.................................................................................. 34
• Updated part number description and device markings. ...................................................................................................... 42
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