DMD. DLP7000 Datasheet

DLP7000 DMD. Datasheet pdf. Equivalent

Part DLP7000
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DLP7000
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DLP7000
DLPS026F – AUGUST 2012 – REVISED JUNE 2019
DLP7000 DLP® 0.7 XGA 2x LVDS Type A DMD
1 Features
1 0.7-Inch diagonal micromirror array
– 1024 × 768 array of Al, micrometer-sized
mirrors
– 13.68-µm micromirror pitch
– ±12° micromirror tilt angle (relative to flat state)
– Designed for corner illumination
• Use with visible light (400 nm to 700 nm):
– Window transmission 97% (single pass,
through two window surfaces)
– Micromirror reflectivity 88%
– Array diffraction efficiency 86%
– Array fill factor 92%
• Two 16-Bit, low voltage differential signaling
(LVDS) double data rate (DDR) input data buses
• Iinput data clock rate up to 400 MHz
• 40.64 mm × 31.75 mm × 6.0 mm package
• Hermetic package
2 Applications
• Industrial
– Digital imaging lithography
– Laser marking
– LCD and OLED repair
– Computer-to-plate printers
– SLA 3D printers
– 3D scanners for machine vision and factory
automation
– Flat panel lithography
• Medical
– Phototherapy devices
– Ophthalmology
– Direct manufacturing
– Hyperspectral imaging
– 3D biometrics
– Confocal microscopes
• Display
– 3D imaging microscopes
– Adaptive illumination
– Augmented reality and information overlay
3 Description
The DLP7000 XGA Chipset is part of the DLP®
Discovery™ 4100 platform, which enables high
resolution and high performance spatial light
modulation. The DLP7000 is the digital micromirror
device (DMD) fundamental to the 0.7 XGA chipset,
and currently supports the fastest pattern rates in the
DLP catalog portfolio. The DLP Discovery 4100
platform also provides the highest level of individual
micromirror control with the option for random row
addressing. Combined with a hermetic package, the
unique capability and value offered by DLP7000
makes it well suited to support a wide variety of
industrial, medical, and advanced display
applications.
In addition to the DLP7000 DMD, the 0.7 XGA
Chipset includes these components:
• Dedicated DLPC410 controller for high speed
pattern rates of >32000 Hz (1-bit binary) and
>4000 Hz (8-bit gray)
• One unit DLPR410 (DLP Discovery 4100
Configuration PROM)
• One unit DLPA200 (DMD Micromirror Driver)
PART NUMBER
DLP7000
Device Information(1)
PACKAGE
BODY SIZE (NOM)
FLP (203)
40.64 mm × 31.75 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP7000
DLP7000
DLPS026F – AUGUST 2012 – REVISED JUNE 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 5
6 Pin Configuration and Functions ......................... 5
7 Specifications....................................................... 12
7.1 Absolute Maximum Ratings .................................... 12
7.2 Storage Conditions.................................................. 12
7.3 ESD Ratings............................................................ 12
7.4 Recommended Operating Conditions..................... 13
7.5 Thermal Information ................................................ 14
7.6 Electrical Characteristics......................................... 15
7.7 LVDS Timing Requirements ................................... 16
7.8 LVDS Waveform Requirements.............................. 16
7.9 Serial Control Bus Timing Requirements................ 16
7.10 Systems Mounting Interface Loads....................... 19
7.11 Micromirror Array Physical Characteristics ........... 20
7.12 Micromirror Array Optical Characteristics ............. 21
7.13 Window Characteristics......................................... 22
7.14 Chipset Component Usage Specification ............. 22
8 Detailed Description ............................................ 23
8.1 Overview ................................................................. 23
8.2 Functional Block Diagram ....................................... 23
8.3 Feature Description................................................. 25
8.4 Device Functional Modes........................................ 32
8.5 Optical Interface and System Image Quality
Considerations ........................................................ 34
8.6 Micromirror Array Temperature Calculation............ 35
8.7 Micromirror Landed-On/Landed-Off Duty Cycle ..... 37
9 Application and Implementation ........................ 40
9.1 Application Information............................................ 40
9.2 Typical Application .................................................. 41
10 Power Supply Recommendations ..................... 44
10.1 DMD Power-Up and Power-Down Procedures..... 44
11 Layout................................................................... 44
11.1 Layout Guidelines ................................................. 44
11.2 Layout Example .................................................... 45
12 Device and Documentation Support ................. 47
12.1 Device Support...................................................... 47
12.2 Documentation Support ........................................ 47
12.3 Related Links ........................................................ 48
12.4 Trademarks ........................................................... 48
12.5 Electrostatic Discharge Caution ............................ 48
12.6 Glossary ................................................................ 48
13 Mechanical, Packaging, and Orderable
Information ........................................................... 48
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (May 2017) to Revision F
Page
• Deleted "Broadband" ............................................................................................................................................................. 1
• Changed values for high speed pattern rates ........................................................................................................................ 1
• Changed package type to FLP (203) ..................................................................................................................................... 1
• Changed package type to FLP; deleted reference to LCCC ................................................................................................. 5
• Changed FLP package figure "bottom view" .......................................................................................................................... 5
• Changed "Case temperature" to "Array temperature" ......................................................................................................... 12
• Changed "Case temperature" to "Array temperature" ......................................................................................................... 12
• Changed "Device temperature gradient - operational" to "Absolute temperature delta between the window test
points (TP2, TP3) and the ceramic test point TP1" ............................................................................................................. 12
• Deleted "RH" after "%" ........................................................................................................................................................ 12
• Changed "Applicable before the DMD is installed in the final product" to "Applicable for the DMD as a component or
non-operating system" .......................................................................................................................................................... 12
• Changed ", non-condensing" to "(non-condensing)" ........................................................................................................... 12
• Changed "JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control
process." to "JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD
control process. Manufacturing with less than 500-V HBM is possible if necessary precautions are taken." .................... 12
• Changed Table "Recommended Operating Conditions" ...................................................................................................... 13
• Added "RH" under "Environmental" ..................................................................................................................................... 13
• Added cross reference to table note at row "ILLVIS" ............................................................................................................ 13
• Changed Array temperature, Long-term operational MAX from "30" to "40" ....................................................................... 13
• Changed package type to FLP in table "THERMAL METRIC" ............................................................................................ 14
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