DMD. DLP9000 Datasheet

DLP9000 DMD. Datasheet pdf. Equivalent

Part DLP9000
Description DMD
Feature Product Folder Sample & Buy Technical Documents Tools & Software Support & Community DLP9000 DL.
Manufacture etcTI
Total Page 30 Pages
Datasheet
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DLP9000
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
DLP9000
DLPS036B – SEPTEMBER 2014 – REVISED OCTOBER 2016
DLP9000 Family of 0.9 WQXGA Type A DMDs
1 Features
1 High Resolution 2560×1600 (WQXGA) Array
– > 4 Million Micromirrors
– 7.56-µm Micromirror Pitch
– 0.9-Inch Micromirror Array Diagonal
– ±12° Micromirror Tilt Angle (Relative to Flat
State)
– Designed for Corner Illumination
– Integrated Micromirror Driver Circuitry
– Two High Speed Options
• DLP9000X With a Single DLPC910 Digital
Controller
– 480 MHz Input Data Clock Rate
– Up to 61 Giga-Bits Per Second (with
Continuous Streaming Input Data)
– Up to 14989 Hz (1-Bit Binary Patterns)
– Up to 1873 Hz (8-Bit Gray Patterns With
Illumination Modulation)
• DLP9000 with Dual DLPC900 Digital Controllers
– 400 MHz Input Data Clock Rate
– Up to 38 Giga-Bits per Second (With Up to 400
Pre-Stored Binary Patterns)
– Up to 9523 Hz (1-Bit Binary Patterns)
– Up to 1031 Hz (8-Bit Gray Patterns Pre-
Loaded With Illumination Modulation), External
Input Up to 360 Hz
• Designed for Use With Broad Wavelength Range
– 400 nm to 700 nm
– Window Transmission 95% (Single Pass,
Through Two Window Surfaces)
– Micromirror Reflectivity 88%
– Array Diffraction Efficiency 86%
– Array Fill Factor 92%
2 Applications
• Industrial
– Machine Vision and Quality Control
– 3D Printing
– Direct Imaging Lithography
– Laser Marking and Repair
• Medical
– Ophthalmology
– 3D Scanners for Limb and Skin Measurement
– Hyper-Spectral Imaging
– Hyper-Spectral Scanning
• Displays
– 3D Imaging Microscopes
– Intelligent and Adaptive Lighting
3 Description
Featuring over 4 million micromirrors, the high
resolution DLP9000 and DLP9000X digital
micromirror devices (DMDs) are spatial light
modulators (SLMs) that modulate the amplitude,
direction, and/or phase of incoming light. This
advanced light control technology has numerous
applications in the industrial, medical, and consumer
markets. The streaming nature of the DLP9000X and
its DLPC910 controller enable very high speed
continuous data streaming for lithographic
applications. Both DMDs enable large build sizes and
fine resolution for 3D printing applications. The high
resolution provides the direct benefit of scanning
larger objects for 3D machine vision applications.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (NOM)
DLP9000
DLP9000X
CLGA (355)
42.20 mm x 42.20 mm x
7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
SPACE
Typical DLP9000X Application
LVDS Interface
Row and Block Signals
Control Signals
Status Signals
JTAG(3:0)
DLPR910 PGM(4:0)
DLPC910
Illumination
Driver
Illumination
Sensor
LVD Interface
RESET Signals
SCP Interface
DLP9000XFLS
CTRL_RSTZ
I2C
OSC
50 MHz
VLED0
VLED1
Power Management
Typical DLP9000 Application
PCLK, DE
HSYNC, VSYNC
24-bit RGB Data
USB
I2C
Flash
DLPC900
Red,Green,Blue PWM
LED Strobes
FAN
LED0
LED1
DMD CTL, DATA
LED
Driver
OSC
24-bit RGB Data
Flash
I2C SCP
SCP
DMD DATA
DLPC900
LED0
LED1
Voltage
Supplies
DLP9000FLS
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP9000
DLP9000
DLPS036B – SEPTEMBER 2014 – REVISED OCTOBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 4
6 Pin Configuration and Functions ......................... 4
7 Specifications....................................................... 11
7.1 Absolute Maximum Ratings .................................... 11
7.2 Storage Conditions.................................................. 12
7.3 ESD Ratings............................................................ 12
7.4 Recommended Operating Conditions..................... 12
7.5 Thermal Information ................................................ 14
7.6 Electrical Characteristics......................................... 14
7.7 Timing Requirements .............................................. 16
7.8 Capacitance at Recommended Operating
Conditions ................................................................ 21
7.9 Typical Characteristics ............................................ 21
7.10 System Mounting Interface Loads ........................ 22
7.11 Micromirror Array Physical Characteristics .......... 22
7.12 Micromirror Array Optical Characteristics ............. 24
7.13 Optical and System Image Quality........................ 25
7.14 Window Characteristics......................................... 25
7.15 Chipset Component Usage Specification ............. 25
8 Parameter Measurement Information ................ 26
9 Detailed Description ............................................ 27
9.1 Overview ................................................................. 27
9.2 Functional Block Diagram ....................................... 28
9.3 Feature Description................................................. 29
9.4 Device Functional Modes........................................ 32
9.5 Window Characteristics and Optics ....................... 32
9.6 Micromirror Array Temperature Calculation............ 33
9.7 Micromirror Landed-On/Landed-Off Duty Cycle ..... 34
10 Application and Implementation........................ 37
10.1 Application Information.......................................... 37
10.2 Typical Applications .............................................. 37
11 Power Supply Requirements ............................. 40
11.1 DMD Power Supply Requirements ...................... 40
11.2 DMD Power Supply Power-Up Procedure ........... 40
11.3 DMD Mirror Park Sequence Requirements .......... 41
11.4 DMD Power Supply Power-Down Procedure ...... 41
12 Layout................................................................... 44
12.1 Layout Guidelines ................................................. 44
12.2 Layout Example .................................................... 46
13 Device and Documentation Support ................. 50
13.1 Device Support...................................................... 50
13.2 Documentation Support ........................................ 51
13.3 Community Resources.......................................... 51
13.4 Trademarks ........................................................... 52
13.5 Electrostatic Discharge Caution ............................ 52
13.6 Glossary ................................................................ 52
14 Mechanical, Packaging, and Orderable
Information ........................................................... 52
14.1 Thermal Characteristics ........................................ 52
14.2 Package Thermal Resistance ............................... 52
14.3 Case Temperature ................................................ 52
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2015) to Revision B
Page
• Separated TCASE into TARRAY and TWINDOW. Changed TGRADIENT to TDELTA. Reduce DCLK_A,B,C,D for
DLP9000 in Absolute Maximum Ratings. ............................................................................................................................. 11
• Separated Tstg into Tdmd and RH in Storage Conditions. .................................................................................................. 12
• Changed TDMD to TARRAY and TGRADIENT to TDELTA, added short term operational, and updated temperature
values in Recommended Operating Conditions. .................................................................................................................. 13
• Added the four modes of operation. ..................................................................................................................................... 21
• Removed the column showing the pixel data rate and added the pattern mode pattern rates............................................ 21
• Updated CL2w constant in Micromirror Array Temperature Calculation. ............................................................................. 33
• Added recommended idle mode operation for maximizing mirror useful life. ...................................................................... 34
• Updated Micromirror Derating Curve.................................................................................................................................... 34
• Added mirror park sequence requirements. ......................................................................................................................... 41
• Updated device nomenclature and markings. ...................................................................................................................... 51
Changes from Original (September 2014) to Revision A
Page
• Updated title .......................................................................................................................................................................... 1
• Updated Features, Description, and Device Information to include DLP9000XFLS DMD..................................................... 1
• Added DLP9000XFLS application diagram. ........................................................................................................................... 1
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