Analog Front-End. AFE1256 Datasheet

AFE1256 Front-End. Datasheet pdf. Equivalent

Part AFE1256
Description 256-Channel Analog Front-End
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AFE1256
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AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors
1 Features
1 256 Channels
• On-Chip, 16-Bit ADC
• Photodiode Short Immunity
• Column Short Immunity
• High Performance:
– Noise: 758 e-RMS with 28-pF Sensor
Capacitor in 1.2-pC Range
– Integral Nonlinearity:
±2 LSB with Internal 16-Bit ADC
– Minimum Scan Time:
– 37.9 µs in Normal Mode
– 20 µs in 2x Binning Mode
• Integration:
– Eight Selectable Full-Scale Ranges:
0.15 pC (Min) to 9.6 pC (Max)
– Built-In Correlated Double Sampler
– 2x Binning (Averages Charge of Two Adjacent
Channels) for Faster Throughput
– Pipelined Integrate and Read: Allows Data
Read During Integration
• Flexibility:
– Electron and Hole Integration
• Low Power:
– 2.9 mW/Ch with ADC
– 2.3 mW/Ch without ADC
– 0.1 mW/Ch in Nap Mode
– Total Power-Down Feature
• 22-mm × 5-mm Gold-Bump Die,
Suitable for TCP and COF
2 Application
Flat-Panel, X-Ray Detector
3 Description
The AFE1256 is a 256-channel, analog front-end
(AFE) designed to suit the requirements of flat-panel
detectors (FPDs) based on digital X-ray systems. The
device includes 256 integrators, a programmable gain
amplifier (PGA) for full-scale, charge-level selection, a
correlated double sampler (CDS) with dual banking,
256:4 analog multiplexers, and four 16-bit,
successive-approximation register (SAR) analog-to-
digital converters (ADCs) onboard. Serial data from
the ADCs are available in SPI™ format.
Hardware-selectable integration polarity allows for the
integration of positive or negative charge and
provides more flexibility in system design. The Nap
feature enables substantial power saving. This power
savings is especially useful in battery-powered
systems.
The device is available as a 22-mm × 5-mm gold-
bumped die and a 38-mm × 28-mm, COF-314 TDS
package in singulated forms.
To request a full data sheet or other design
resources: request AFE1256
Device Information(1)
ORDER NUMBER
PACKAGE
BODY SIZE
AFE1256GBTD
Gold-bump die (533) 22 mm × 5 mm
AFE1256TDS
COF (314)
38 mm × 28 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
(2) Product-preview device.
space
AFE1256 Schematic
REFP, REFM
Reference
Voltage
TFT Switch
Pixel
Capacitor
[255:0]
Integrators and
CDS
[255:0]
16-Bit
Mux ADC[3:0]
AADADDCCC
Device
SPI
Interface
SDO[3:0]
Timing and Control
STI, CLK, A_BZ, RST, IRST, SHR, SHS, LPF_ON
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



AFE1256
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Application ............................................................. 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device and Documentation Support.................... 3
5.1 Trademarks ............................................................... 3
5.2 Electrostatic Discharge Caution ................................ 3
5.3 Glossary .................................................................... 3
6 Mechanical, Packaging, and Orderable
Information ............................................................. 3
6.1 Tray Dimensions ....................................................... 4
6.2 GBTD Die.................................................................. 5
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2015) to Revision D
Page
• Added link to request full data sheet ...................................................................................................................................... 1
Changes from Revision B (April 2014) to Revision C
Page
• Changed document status from Mixed to Production Data ................................................................................................... 1
• Deleted TDQ package from document ................................................................................................................................... 1
• Changed last paragraph of Description section .................................................................................................................... 1
• Deleted second row from Device Information table ............................................................................................................... 1
• Changed Tray Dimensions section: deleted Figure 1 ........................................................................................................... 4
Changes from Revision A (March 2014) to Revision B
Page
• Changed TDS package to Production Data .......................................................................................................................... 1
Changes from Original (October 2013) to Revision A
Page
• Made changes to product preview data sheet ...................................................................................................................... 1
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