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N0026S
N0026S Process Geometry
Features
Low Input Capacitance: 4.3pF Typical Low Gate Leakage: 10pA Typical High Breakdown Voltage: -45V Typical High Input Impedance Small Die: 365um X 365um X 203um Bond Pads: 90um X 90um Substrate Connected to Gate Au Back-Side Finish
Applications
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