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N0014L
N0014L Process Geometry
Features
Low Input Capacitance: 2.3pF Typical Low Gate Leakage: 2.0pA Typical High Breakdown Voltage: -30V Typical High Input Impedance Small Die: 365um X 365um X 203um Bond Pads: 90um X 90um and 66um Dia. Substrate Connected to Gate Au Back Side Finish
A...
