SERIAL FLASH. GPR25L005B Datasheet

GPR25L005B FLASH. Datasheet pdf. Equivalent

Part GPR25L005B
Description CMOS SERIAL FLASH
Feature GPR25L005B 512K-BIT [x 1] CMOS SERIAL FLASH DEC. 14, 2006 Version 1.1 GENERALPLUS TECHNOLOGY INC. re.
Manufacture Generalplus
Datasheet
Download GPR25L005B Datasheet



GPR25L005B
GPR25L005B
512K-BIT [x 1] CMOS SERIAL FLASH
DEC. 14, 2006
Version 1.1
GENERALPLUS TECHNOLOGY INC. reserves the right to change this documentation without prior notice. Information provided by GENERALPLUS
TECHNOLOGY INC. is believed to be accurate and reliable. However, GENERALPLUS TECHNOLOGY INC. makes no warranty for any errors which may
appear in this document. Contact GENERALPLUS TECHNOLOGY INC. to obtain the latest version of device specifications before placing your order. No
responsibility is assumed by GENERALPLUS TECHNOLOGY INC. for any infringement of patent or other rights of third parties which may result from its use.
In addition, GENERALPLUS products are not authorized for use as critical components in life support devices/systems or aviation devices/systems, where a
malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the express written approval of Generalplus.



GPR25L005B
GPR25L005B
Table of Contents
PAGE
1. FEATURES.................................................................................................................................................................................................. 4
1.1. GENERAL .............................................................................................................................................................................................. 4
1.2. PERFORMANCE...................................................................................................................................................................................... 4
1.3. SOFTWARE FEATURES ........................................................................................................................................................................... 4
1.4. HARDWARE FEATURES .......................................................................................................................................................................... 4
2. GENERAL DESCRIPTION .......................................................................................................................................................................... 5
3. PIN CONFIGURATIONS ............................................................................................................................................................................. 5
3.1. 8-PIN SOP (150MIL) ............................................................................................................................................................................. 5
4. PIN DESCRIPTION...................................................................................................................................................................................... 5
5. BLOCK DIAGRAM ...................................................................................................................................................................................... 6
6. DATA PROTECTION................................................................................................................................................................................... 6
7. HOLD FEATURE ......................................................................................................................................................................................... 7
8. DEVICE OPERATION ................................................................................................................................................................................. 9
9. COMMAND DESCRIPTION ...................................................................................................................................................................... 10
9.1. WRITE ENABLE (WREN)...................................................................................................................................................................... 10
9.2. WRITE DISABLE (WRDI) ...................................................................................................................................................................... 10
9.3. READ IDENTIFICATION (RDID) .............................................................................................................................................................. 10
9.4. READ STATUS REGISTER (RDSR)........................................................................................................................................................ 10
9.5. WRITE STATUS REGISTER (WRSR).......................................................................................................................................................11
9.6. READ DATA BYTES (READ) ................................................................................................................................................................. 12
9.7. READ DATA BYTES AT HIGHER SPEED (FAST_READ) ......................................................................................................................... 12
9.8. SECTOR ERASE (SE) ........................................................................................................................................................................... 12
9.9. BLOCK ERASE (BE) ............................................................................................................................................................................. 12
9.10.CHIP ERASE (CE) ................................................................................................................................................................................ 12
9.11.PAGE PROGRAM (PP) .......................................................................................................................................................................... 13
9.12.DEEP POWER-DOWN (DP) ................................................................................................................................................................... 13
9.13.RELEASE FROM DEEP POWER-DOWN (RDP), READ ELECTRONIC SIGNATURE (RES) ............................................................................. 13
9.14.READ ELECTRONIC MANUFACTURER ID & DEVICE ID (REMS) .............................................................................................................. 14
10. POWER-ON STATE .................................................................................................................................................................................. 15
11. ELECTRICAL SPECIFICATIONS ............................................................................................................................................................. 15
11.1.ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................................. 15
11.2.CAPACITANCE TA = 25, F = 1.0 MHZ ................................................................................................................................................ 16
11.3.INITIAL DELIVERY STATE ...................................................................................................................................................................... 19
12. RECOMMENDED OPERATING CONDITIONS ........................................................................................................................................ 27
12.1.AT DEVICE POWER-UP ........................................................................................................................................................................ 27
13. ERASE AND PROGRAMMING PERFORMANCE .................................................................................................................................... 27
14. LATCH-UP CHARACTERISTICS ............................................................................................................................................................. 28
15. ORDERING INFORMATION ..................................................................................................................................................................... 28
16. PACKAGE INFORMATION....................................................................................................................................................................... 29
16.1.TITLE: PACKAGE OUTLINE FOR SOP 8L (150MIL) ................................................................................................................................. 29
16.2.DIMENSIONS (INCH DIMENSIONS ARE DERIVED FROM THE ORIGINAL MM DIMENSIONS).............................................................................. 29
© Generalplus Technology Inc.
2
Proprietary & Confidential
DEC. 14, 2006
Version: 1.1





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