Op Amp. TLE2062 Datasheet

TLE2062 Amp. Datasheet pdf. Equivalent

Part TLE2062
Description uPower Op Amp
Feature .
Manufacture etcTI
Datasheet
Download TLE2062 Datasheet



TLE2062
ąą
D 2× Bandwidth (2 MHz) of the TL06x and
TL03x Operational Amplifiers
D Low Supply Current . . . 290 µA/Ch Typ
D On-chip Offset Voltage Trimming for
Improved DC Performance
TLE206x, TLE206xA, TLE206xB
EXCALIBUR JFETĆINPUT HIGHĆOUTPUTĆDRIVE
µPOWER OPERATIONAL AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
D High Output Drive, Specified into 100-
Loads
D Lower Noise Floor Than Earlier
Generations of Low-Power BiFETs
description
The TLE206x series of low-power JFET-input operational amplifiers doubles the bandwidth of the earlier
generation TL06x and TL03x BiFET families without significantly increasing power consumption. Texas
Instruments Excalibur process also delivers a lower noise floor than the TL06x and TL03x. On-chip zener
trimming of offset voltage yields precision grades for dc-coupled applications. The TL206x devices are
pin-compatible with other Texas Instruments BiFETs; they can be used to double the bandwidth of TL06x and
TL03x circuits or to reduce power consumption of TL05x, TL07x, and TL08x circuits by nearly 90%.
BiFET operational amplifiers offer the inherently-higher input impedance of the JFET-input transistors, without
sacrificing the output drive associated with bipolar amplifiers. This makes them better suited for interfacing with
high-impedance sensors or low-level ac signals. They also feature inherently better ac response than bipolar
or CMOS devices having comparable power consumption. The TLE206x family features a high-output-drive
circuit capable of driving 100-loads at supplies as low as ± 5 V. This makes them uniquely suited for driving
transformer loads in modems and other applications requiring good ac characteristics, low power, and high
output drive.
Because BiFET operational amplifiers are designed for use with dual power supplies, care must be taken to
observe common-mode input voltage limits and output swing when operating from a single supply. DC biasing
of the input signal is required and loads should be terminated to a virtual ground node at mid-supply. Texas
Instruments TLE2426 integrated virtual ground generator is useful when operating BiFET amplifiers from single
supplies.
The TLE206x are fully specified at ±15 V and ± 5 V. For operation in low-voltage and/or single-supply systems,
Texas Instruments LinCMOS families of operational amplifiers (TLC- and TLV-prefixes) are recommended.
When moving from BiFET to CMOS amplifiers, particular attention should be paid to slew rate and bandwidth
requirements and output loading. The Texas Instruments TLV2432 and TLV2442 CMOS operational amplifiers
are excellent choices to consider.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 2004, Texas Instruments Incorporated
1



TLE2062
TLE206x, TLE206xA, TLE206xB
ą
EXCALIBUR JFETĆINPUT HIGHĆOUTPUTĆDRIVE
µPOWER OPERATIONAL AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
TLE2061 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP‡
(PW)
CERAMIC
FLAT PACK
(U)
500 µV
0°C to 70°C
1.5 mV TLE2061ACD
3 mV TLE2061CD
TLE2061ACP
TLE2061CP TLE2061CPWLE
500 µV
−40°C to 85°C 1.5 mV TLE2061AID
TLE2061AIP
3 mV TLE2061ID
TLE2061IP
500 µV
TLE2061BMJG
−55°C to 125°C 1.5 mV TLE2061AMD TLE2061AMFK TLE2061AMJG
TLE2061AMU
3 mV TLE2061MD TLE2061MFK TLE2061MJG
TLE2061MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2061ACDR).Chips are tested at 25°C.
The PW package is available left-end taped and reeled (indicated by the LE suffix on the device type (e.g., TLE2061CPWLE).
TLE2062 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax SMALL OUTLINE† CHIP CARRIER
AT 25°C
(D)
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
0°C
1 mV
TLE2062BCD
to
2 mV
TLE2062ACD
70°C
4 mV
TLE2062CD
TLE2062BCP
TLE2062ACP
TLE2062CP
−40°C 1 mV
TLE2062BID
to
2 mV
TLE2062AID
85°C
4 mV
TLE2062ID
TLE2062BIP
TLE2062AIP
TLE2062IP
−55°C 1 mV
TLE2062BMD
TLE2062BMJG
to
2 mV
TLE2062AMD
TLE2062AMFK TLE2062AMJG
125°C 4 mV
TLE2062MD
TLE2062MFK TLE2062MJG
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2062ACDR).
CERAMIC
FLAT PACK
(U)
TLE2062AMU
TLE2062MU
TLE2064 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax SMALL OUTLINE† CHIP CARRIER
AT 25°C
(D)
(FK)
CERAMIC DIP
(J)
PLASTIC DIP
(N)
0°C
2 mV
to
4 mV
TLE2064ACD
70°C
6 mV
TLE2064CD
TLE2064BCN
TLE2064ACN
TLE2064CN
−40°C 2 mV
to
4 mV
TLE2064AID
85°C
6 mV
TLE2064ID
TLE2064BIN
TLE2064AIN
TLE2064IN
−55°C 2 mV
TLE2064BMFK TLE2064BMJ
to
4 mV
TLE2064AMD
TLE2064AMFK TLE2064AMJ
125°C 6 mV
TLE2064MD
TLE2064MFK
TLE2064MJ
The D packages are available taped and reeled. Add R suffix to device type, (e.g., TLE2064ACDR).
CERAMIC
FLAT PACK
(W)
TLE2064AMW
TLE2064MW
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265





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