FREQUENCY MULTIPLIER. HMC370LP4 Datasheet

HMC370LP4 MULTIPLIER. Datasheet pdf. Equivalent

Part HMC370LP4
Description SMT GaAs HBT MMIC x4 ACTIVE FREQUENCY MULTIPLIER
Feature FREQ. MULTIPLIERS - ACTIVE - SMT HMC370LP4 / 370LP4E v04.0110 SMT GaAs HBT MMIC x4 ACTIVE FREQUE.
Manufacture Analog Devices
Datasheet
Download HMC370LP4 Datasheet



HMC370LP4
HMC370LP4 / 370LP4E
v04.0110
SMT GaAs HBT MMIC x4 ACTIVE
FREQUENCY MULTIPLIER, 14.4 - 16.4 GHz OUTPUT
Typical Applications
7
The HMC370LP4(E) is ideal for:
• Point-to-Point & VSAT Radios
• Fiber Optic
• Military
Functional Diagram
Features
Output Power: 0 dBm
Sub-Harmonic Suppression: >22 dBc
SSB Phase Noise: -140 dBc/Hz
Single Supply: +5V @ 55 mA
24 Lead 4x4 mm SMT Package: 16 mm2
General Description
The HMC370LP4(E) is an active miniature x4 fre-
quency multiplier utilizing InGaP GaAs HBT
technology in a 4x4 mm leadless surface mount
package. Power output is 0 dBm typical from a
5V supply voltage and varies little vs. input power,
temperature and supply voltage. Suppression of
undesired fundamental and sub-harmonics is >22
dBc typical with respect to output signal level. The
low additive SSB phase noise of -140 dBc/Hz at
100 kHz offset helps the user maintain good sys-
tem noise performance. The HMC370LP4(E) are ideal
for use in LO multiplier chains allowing reduced parts
count vs. traditional approaches.
Electrical Specifications, TA = +25° C, Vcc = 5V
Parameter
Frequency Range, Input
Frequency Range, Output
Input Power Range
Output Power
Sub-Harmonic Suppression
Input Return Loss
Output Return Loss
SSB Phase Noise (100 kHz Offset)
Supply Current (Icc)
Pin = 0 dBm
Min.
Typ.
Max.
3.6 - 4.1
14.4 - 16.4
-15
+5
-4
0
22
18
7
-140
55
73
Units
GHz
GHz
dBm
dBm
dBc
dB
dB
dBc/Hz
mA
7 - 46
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HMC370LP4
HMC370* PRODUCT PAGE QUICK LINKS
Last Content Update: 02/23/2017
COMPARABLE PARTS
View a parametric search of comparable parts.
EVALUATION KITS
HMC370LP4 Evaluation Board
DOCUMENTATION
Data Sheet
HMC370 Data Sheet
TOOLS AND SIMULATIONS
HMC370 S-Parameter
REFERENCE MATERIALS
Quality Documentation
Package/Assembly Qualification Test Report: LP4, LP4B,
LP4C, LP4K (QTR: 2013-00487 REV: 04)
Package/Assembly Qualification Test Report: Plastic
Encapsulated QFN (QTR: 05006 REV: 02)
Semiconductor Qualification Test Report: GaAs HBT-A
(QTR: 2013-00228)
Technical Articles
Active Multipliers & Dividers to Simplify Synthesizers
DESIGN RESOURCES
HMC370 Material Declaration
PCN-PDN Information
Quality And Reliability
Symbols and Footprints
DISCUSSIONS
View all HMC370 EngineerZone Discussions.
SAMPLE AND BUY
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TECHNICAL SUPPORT
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number.
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