XOR/XNOR Gate. HMC745 Datasheet

HMC745 Gate. Datasheet pdf. Equivalent

Part HMC745
Description Fast Rise Time XOR/XNOR Gate
Feature Data Sheet 13 Gbps, Fast Rise Time XOR/XNOR Gate with Programmable Output Voltage and Positive Supp.
Manufacture Analog Devices
Datasheet
Download HMC745 Datasheet



HMC745
Data Sheet
13 Gbps, Fast Rise Time XOR/XNOR Gate with
Programmable Output Voltage and Positive Supply
HMC745
FEATURES
Inputs terminated internally at 50 Ω
Differential and single-ended operation
Fast rise and fall times: 21 ps and 19 ps
Low power consumption: 240 mW (typical)
Programmable differential
Output voltage swing: 600 mV to 1200 mV
Propagation delay: 95 ps
Single supply: 3.3 V
16-terminal, ceramic 3 mm × 3 mm LCC package
APPLICATIONS
RF automatic test equipment (ATE) applications
Broadband test and measurement
Serial data transmission up to 13 Gbps
Digital logic systems up to 13 GHz
FUNCTIONAL BLOCK DIAGRAM
GND 1
AN 2
VCC
50Ω
AP 3
GND 4
50Ω
50Ω
VCC
VCC
50Ω
12 GND
11 DP
50Ω
50Ω
VCC
10 DN
9 GND
PACKAGE
BASE
Figure 1.
GENERAL DESCRIPTION
The HMC745 is a XOR/XNOR gate function designed to
support data transmission rates of up to 13 Gbps, and clock
frequencies as high as 13 GHz. The HMC745 also features an
output level control pin, VR, which permits loss compensation
or signal level optimization.
All input and output signals to the HMC745 are terminated
with 50 Ω to VCC on-chip, and can be either ac-coupled or
dc-coupled.
Inputs or outputs can be connected directly to a 50 Ω VCC
terminated system, while dc blocking capacitors may be used
if the terminating system is 50 Ω to ground. The HMC745
operates from a single 3.3 V dc supply, and is available in a
ceramic, RoHS compliant, 3 mm × 3 mm LCC package.
Rev. D
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HMC745
HMC745
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Specifications ............................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
6/2018—Rev. C to Rev. D
Changes to Power Supply Voltage Parameter, Table 1 ................. 3
Changes to Input Signals Parameter and Output Signals
Parameter, Table 2............................................................................. 4
Changes to Pin 14, Pin No. Column, Table 3................................ 5
Change to Figure 19 ....................................................................... 10
Changes to Ordering Guide .......................................................... 11
Data Sheet
Pin Configuration and Function Descriptions..............................5
Interface Schematics .....................................................................5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Applications Information .................................................................9
Evaluation Printed Circuit Board (PCB)....................................9
Outline Dimensions ....................................................................... 11
Ordering Guide .......................................................................... 11
10/2017—Rev. 02.0514 to Rev. C
This Hittite Microwave Products data sheet has been reformatted to
meet the styles and standards of Analog Devices, Inc.
Updated Format..................................................................Universal
Change to Features Section, General Description Section, and
Figure 1 Caption..................................................................................1
Changes to Table 2.............................................................................4
Changes to Figure 2 Caption............................................................5
Deleted Figure 7; Renumbered Sequentially .................................5
Changes to Theory of Operation Section.......................................8
Changes to Evaluation Printed Circuit Board (PCB) Section .....9
Changes to Figure 18 Caption ...................................................... 10
Changes to Figure 19 Caption ...................................................... 11
Updated Outline Dimensions ....................................................... 12
Changes to Ordering Guide .......................................................... 12
Rev. D | Page 2 of 11





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