D/A Converter. DAC7552 Datasheet

DAC7552 Converter. Datasheet pdf. Equivalent

Part DAC7552
Description Dual 12-Bit D/A Converter
Feature Actual Size 3 mm x 3 mm DAC7552 www.ti.com SLAS442D – JANUARY 2005 – REVISED JUNE 2011 12-BIT, DU.
Manufacture etcTI
Datasheet
Download DAC7552 Datasheet




DAC7552
Actual Size
3 mm x 3 mm
DAC7552
www.ti.com
SLAS442D JANUARY 2005 REVISED JUNE 2011
12-BIT, DUAL, ULTRALOW GLITCH, VOLTAGE OUTPUT
DIGITAL-TO-ANALOG CONVERTER
Check for Samples: DAC7552
FEATURES
1
2 2.7-V to 5.5-V Single Supply
12-Bit Linearity and Monotonicity
Rail-to-Rail Voltage Output
Settling Time: 5 µs (Max)
Ultralow Glitch Energy: 0.1 nVs
Ultralow Crosstalk: 100 dB
Low Power: 440 µA (Max)
Per-Channel Power Down: 2 µA (Max)
Power-On Reset to Zero Scale
SPI-Compatible Serial Interface: Up to 50 MHz
Daisy-Chain Capability
Asynchronous Hardware Clear
Simultaneous or Sequential Update
Specified Temperature Range: 40°C to 105°C
Small 3-mm × 3-mm, 16-Lead QFN Package
APPLICATIONS
Portable Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
Industrial Process Control
DESCRIPTION
The DAC7552 is a 12-bit, dual-channel,
voltage-output DAC with exceptional linearity and
monotonicity. Its proprietary architecture minimizes
undesired transients such as code-to-code glitch and
channel-to-channel crosstalk. The low-power
DAC7552 operates from a single 2.7-V to 5.5-V
supply. The DAC7552 output amplifiers can drive a
2-k, 200-pF load rail-to-rail with 5-µs settling time;
the output range is set using an external voltage
reference.
The 3-wire serial interface operates at clock rates up
to 50 MHz and is compatible with SPI, QSPI,
Microwire, and DSP interface standards. The
outputs of all DACs may be updated simultaneously
or sequentially. The parts incorporate a
power-on-reset circuit to ensure that the DAC outputs
power up to zero volts and remain there until a valid
write cycle to the device takes place. The parts
contain a power-down feature that reduces the
current consumption of the device to under 2 µA.
The small size and low-power operation makes the
DAC7552 ideally suited for battery-operated portable
applications. The power consumption is typically
1.5 mW at 5 V, 0.75 mW at 3 V, and reduces to 1 µW
in power-down mode.
The DAC7552 is available in a 16-lead QFN package
and is specified over 40°C to 105°C.
FUNCTIONAL BLOCK DIAGRAM
VDD
IOVDD
VREFA
SCLK
SYNC
SDIN
SDO
Interface
Logic
Input
Register
DAC
Register
Input
Register
DAC
Register
DAC7552
Power-On
Reset
DCEN CLR
GND
_
String
+
DAC A
_
String
+
DAC B
Power-Down
Logic
VREFB
PD
VFBA
VOUT A
VFBB
VOUT B
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Microwire is a trademark of National Semiconductor Corporation.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 20052011, Texas Instruments Incorporated



DAC7552
DAC7552
SLAS442D JANUARY 2005 REVISED JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR
DAC7552 16 QFN
RGT
ORDERING INFORMATION(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
40°C TO 105°C
D752
DAC7552IRGTT
DAC7552IRGTR
TRANSPORT
MEDIA
250-piece Tape and Reel
3000-piece Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VDD , IOVDD to GND
Digital input voltage to GND
VOUT to GND
Operating temperature range
Storage temperature range
Junction temperature (TJ Max)
UNIT
0.3 V to 6 V
0.3 V to VDD + 0.3 V
0.3 V to VDD+ 0.3 V
40°C to 105°C
65°C to 150°C
150°C
(1) Stresses above those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
VDD = 2.7 V to 5.5 V, VREF = VDD, RL = 2 kto GND; CL = 200 pF to GND; all specifications 40°C to 105°C, unless otherwise
specified
PARAMETER
STATIC PERFORMANCE(1)
TEST CONDITIONS
MIN TYP
MAX
UNITS
Resolution
12
Bits
Relative accuracy
±0.35
±1
LSB
Differential nonlinearity
Specified monotonic by design
±0.08
±0.5
LSB
Offset error
±12
mV
Zero-scale error
All zeroes loaded to DAC register
±12
mV
Gain error
±0.15
%FSR
Full-scale error
±0.5
%FSR
Zero-scale error drift
7
µV/°C
Gain temperature coefficient
3
ppm of FSR/°C
PSRR
VDD = 5 V
0.75
mV/V
(1) Linearity tested using a reduced code range of 30 to 4065; output unloaded.
2
Copyright © 20052011, Texas Instruments Incorporated







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