D/A Converter. DAC7574 Datasheet

DAC7574 Converter. Datasheet pdf. Equivalent

Part DAC7574
Description Quad 12-Bit D/A Converter
Feature www.ti.com QUAD, 12-BIT, LOW-POWER, VOLTAGE OUTPUT, I2C INTERFACE DIGITAL-TO-ANALOG CONVERTER DAC7.
Manufacture etcTI
Datasheet
Download DAC7574 Datasheet



DAC7574
www.ti.com
QUAD, 12-BIT, LOW-POWER, VOLTAGE OUTPUT,
I2C INTERFACE DIGITAL-TO-ANALOG CONVERTER
DAC7574
SLAS375 – JUNE 2003
FEATURES
Micropower Operation: 600 µA at 5 V VDD
Power-On Reset to Zero
+2.7 V to +5.5 V Analog Power Supply
12-Bit Monotonic
I2C™ Interface Up to 3.4 Mbps
Data Transmit Capability
On-Chip Output Buffer Amplifier, Rail-to-Rail
Operation
Double-Buffered Input Register
Address Support for up to Four DAC7574s
Synchronous Update Support for up to 16
Channels
Operation From -40°C to 105°C
Small 10 Lead MSOP Package
APPLICATIONS
Process Control
Data Acquisition Systems
Closed-Loop Servo Control
PC Peripherals
Portable Instrumentation
VDD
DESCRIPTION
The DAC7574 is a low-power, quad channel, 12-bit
buffered voltage output DAC. Its on-chip precision out-
put amplifier allows rail-to-rail output swing to be
achieved. The DAC7574 utilizes an I2C compatible two
wire serial interface supporting high-speed interface
mode with address support of up to four DAC7574s for
a total of 16 channels on the bus.
The DAC7574 uses VDD and GND to set the output
range of the DAC. The DAC7574 incorporates a
power-on-reset circuit that ensures that the DAC output
powers up at zero volts and remains there until a valid
write takes place to the device. The DAC7574 contains
a power-down feature, accessed via the internal control
register, that reduces the current consumption of the
device to 200 nA at 5 V.
The low power consumption of this part in normal
operation makes it ideally suited to portable battery
operated equipment. The power consumption is less
than 3mW at VDD = 5 V reducing to 1 µW in power-down
mode.
The DAC7574 is available in a 10-lead MSOP package.
Data
Buffer A
DAC
DAC A
Register A
Data
Buffer D
DAC
Register D
DAC D
14
VOUTA
VOUTB
VOUTC
VOUTD
SCL
SDA
I2C Block
Buffer
Control
8
Register
Control
Power - Down
Control Logic
Resistor
Network
A0 A1 GND
I2C is a trademark of Philips Corporation.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily in-
clude testing of all parameters.
Copyright © 2003, Texas Instruments Incorporated



DAC7574
DAC7574
SLAS375 – JUNE 2003
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE
DAC7574
10-MSOP
PACKAGE
DRAWING
NUMBER
DGS
SPECIFICATION
TEMPERATURE
RANGE
-40°C TO +105°C
PACKAGE
MARKING
ORDERING
NUMBER
D774
DAC7574IDGS
DAC7574IDGSR
TRANSPORT MEDIA
80 Piece Tube
2500 Piece Tape and Reel
DGS PACKAGE
(TOPVIEW)
VOUTA 1
VOUTB 2
GND 3
VOUTC 4
VOUTD 5
DAC7574
10 A1
9 A0
8 VDD
7 SDA
6 SCL
PIN DESCRIPTIONS
PIN NAME
DESCRIPTION
1
VOUTA Analog output voltage from DAC A
2
VOUTB Analog output voltage from DAC B
3
GND
Ground reference point for all circuitry on the
part
4
VOUTC Analog output voltage from DAC C
5
VOUTD Analog output voltage from DAC D
6
SCL Serial clock input
7
SDA Serial data input and output
8
VDD Analog voltage supply input
9
A0 Device address select - I2C
10
A1 Device address select - I2C
ABSOLUTE MAXIMUM RATINGS (1)
VDD to GND
Digital input voltage to GND
VOUT to GND
Operating temperature range
Storage temperature range
Junction temperature range (TJ max)
Power dissipation:
Thermal impedance (ΘJA)
Thermal impedance (ΘJC)
Lead temperature, soldering: Vapor phase (60s)
Infrared (15s)
–0.3 V to +6 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
– 40°C to +105°C
– 65°C to +150°C
+150°C
270°C/W
77°C/W
215°C
220°C
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2







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