RGB/White-LED Drive. LP55281 Datasheet

LP55281 Drive. Datasheet pdf. Equivalent

Part LP55281
Description 12-Channel RGB/White-LED Drive
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LP55281
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
LP55281
SNVS458D – JUNE 2007 – REVISED OCTOBER 2016
LP55281 12-Channel RGB/White-LED Drive With SPI, I2C Interface
1 Features
1 Audio Synchronization for a Single Fun-Light LED
• Four PWM Controlled RGB LED Drivers
• High-Efficiency Boost DC-DC Converter
• SPI or I2C-Compatible Interface
• Two Addresses in I2C-Compatible Interface
• LED Connectivity Test Through the Serial
Interface
2 Applications
• Cellular Phones
• PDAs, MP3 Players
3 Description
The LP55281 device is a quadruple RGB LED driver
for handheld devices. It can drive 4 RGB LED sets
and a single fun-light LED. The boost DC-DC
converter drives high current loads with high
efficiency. The RGB driver can drive individual color
LEDs or RGB LEDs powered from boost output or
external supply. Built-in audio synchronization feature
allows user to synchronize the fun-light LED to audio
inputs. The flexible SPI or I2C interface allows easy
control of LP55281. A small YZR0036 or YPG0036
package, together with minimum number of external
components, is a best fit for handheld devices. The
LP55281 also has an LED test feature, which can be
used, for example, in production for checking the LED
connections.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LP55281
DSBGA (36)
2.982 mm × 2.982 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
BATTERY
CIN
10 PF
CVDD
100 nF
CVDDA
1 éF
CREF
100 nF
RRGB
RRT
MCU
CVDDIO
100 nF
AUDIO
INPUTS
VDD1
VDD2
VDDA
VREF
IRGB
IRT
SO
SI/A0
SCK/SCL
SS/SDA
NRST
VDDIO
IF_SEL
ASE1
ASE2
Lboost
4.7 PH
SW
D1
FB
R1
G1
B1
R2
G2
B2
LP55281
R3
G3
B3
R4
G4
B4
IMAX = 300...400 mA
VOUT = 4...5.3V
COUT
10 PF
RGB1
RGB2
RGB3
RGB4
GNDs
ALED
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



LP55281
LP55281
SNVS458D – JUNE 2007 – REVISED OCTOBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 SPI Timing Requirements ......................................... 9
6.7 I2C Timing Requirements ....................................... 10
6.8 Boost Converter Typical Characteristics................. 11
6.9 RGB Driver Typical Characteristics ........................ 12
7 Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description................................................. 15
7.4 Device Functional Modes........................................ 23
7.5 Programming........................................................... 25
7.6 Register Maps ......................................................... 30
8 Application and Implementation ........................ 31
8.1 Application Information............................................ 31
8.2 Typical Application ................................................. 31
8.3 Initialization Set Up Example .................................. 34
9 Power Supply Recommendations...................... 34
10 Layout................................................................... 35
10.1 Layout Guidelines ................................................. 35
10.2 Layout Example .................................................... 36
11 Device and Documentation Support ................. 37
11.1 Device Support...................................................... 37
11.2 Related Documentation ....................................... 37
11.3 Receiving Notification of Documentation Updates 37
11.4 Community Resources.......................................... 37
11.5 Trademarks ........................................................... 37
11.6 Electrostatic Discharge Caution ............................ 37
11.7 Glossary ................................................................ 37
12 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (March 2013) to Revision D
Page
• Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information
tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply
Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable
Information sections; update title............................................................................................................................................ 1
• Added NRST pin connection to MCU on Simplified Schematic ............................................................................................ 1
• Changed RθJA for YPG package from "60°C/W" to "48.9°C/W"and for YZR package from "60°C/W" to "49.1°C/W"............ 6
Changes from Revision B (March 2013) to Revision C
Page
• Changed layout of National Semiconductor data sheet to TI format...................................................................................... 1
2
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