LED driver. LP55231 Datasheet

LP55231 driver. Datasheet pdf. Equivalent

Part LP55231
Description 9-channel LED driver
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LP55231
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Folder
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Now
Technical
Documents
Tools &
Software
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Design
LP55231
SNOSCR5D – MARCH 2013 – REVISED DECEMBER 2016
LP55231 Nine-Channel RGB, White-LED Driver With Internal Program Memory
and Integrated Charge Pump - WQFN
1 Features
1 Three Independent Program Execution Engines, 9
Programmable Outputs With 25.5-mA Full-Scale
Current, 8-Bit Current Setting Resolution and
12-Bit PWM Control Resolution
• Adaptive High-Efficiency 1×/1.5× Fractional
Charge Pump - Efficiency up to 94%
• LED Drive Efficiency Up to 93%
• Charge Pump With Soft Start
• Overcurrent and Short-Circuit Protection
• Built-in LED Test
• 200-nA Typical Standby Current
• Automatic Power Save Mode; IVDD = 10 µA
(Typical)
• Two-Wire I2C-Compatible Control Interface
• Flexible Instruction Set
• Large SRAM Program Memory
• Small Application Circuit
• Source (High-Side) Drivers
• Architecture Supports Color Control
2 Applications
• Fun Lights and Indicator Lights
• LED Backlighting
• Haptic Feedback
• Programmable Current Source
• Fire Notification
• Electronic Thermostats
• Electronic Locks
• Robotics
• Intruder Notification
• Light Switches and Dimmers
• Gaming and Smart Headphones
• Speakers
3 Description
The LP55231 is a 9-channel LED driver designed to
produce lighting effects for mobile devices. A high-
efficiency charge pump enables LED driving over full
Li-Ion battery voltage range. The device is equipped
with an internal program memory, which allows
operation without processor control.
The LP55231 has an I2C-compatible control interface
with four pin-selectable addresses. The INT pin can
be used to notify processor when a lighting sequence
has ended (interrupt function). Also, the device has a
trigger input interface, which allows synchronization,
for example, between multiple LP55231 devices.
Excellent efficiency is maintained over a wide
operating range by autonomously selecting the best
charge pump gain based on LED forward voltage
requirements. The device is able to automatically
enter power-save mode when LED outputs are not
active, thus lowering idle current consumption down
to 10 µA (typical). Only four small and low-cost
ceramic capacitors are required.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LP55231
WQFN (24)
4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
space
Typical Application
C1
C2
0.47 µF 0.47 µF
VIN = 2.7 V to 5.5 V
CIN
1 µF
MCU
C1+ C1- C2+ C2- VOUT
VDD
D7
D1
SCL
SDA
D2
EN
CLK
D8
LP55231
D3
INT
TRIG
D4
ASEL0
ASEL1
D9
GND
D5
D6
C1
C2
0.47 µF 0.47 µF
COUT1 µF
R
G
B
R
G
B
R
G
VIN = 2.7 V to 5.5 V
CIN
1 µF
MCU
C1+ C1- C2+ C2- VOUT
VDD
D1
D2
SCL
SDA
D3
EN
D4
CLK
LP55231
D5
INT
D6
TRIG
D7
ASEL0
ASEL1
D8
GND
D9
COUT1 µF
B
RGB LED
APPLICATION
WLED APPLICATION
NOTE: D7, D8 and D9 powered
directly from VIN
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



LP55231
LP55231
SNOSCR5D – MARCH 2013 – REVISED DECEMBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Charge Pump Electrical Characteristics ................... 5
6.7 LED Driver Electrical Characteristics ........................ 6
6.8 LED Test Electrical Characteristics........................... 6
6.9 Logic Interface Characteristics.................................. 6
6.10 Recommended External Clock Source Conditions . 7
6.11 Serial Bus Timing Parameters (SDA, SCL) ............ 7
6.12 Typical Characteristics ............................................ 8
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 17
7.5 Programming........................................................... 18
7.6 Register Maps ......................................................... 20
8 Application and Implementation ........................ 46
8.1 Application Information............................................ 46
8.2 Typical Applications ................................................ 46
9 Power Supply Recommendations...................... 50
10 Layout................................................................... 50
10.1 Layout Guidelines ................................................. 50
10.2 Layout Example .................................................... 50
11 Device and Documentation Support ................. 51
11.1 Device Support...................................................... 51
11.2 Trademarks ........................................................... 51
11.3 Receiving Notification of Documentation Updates 51
11.4 Community Resources.......................................... 51
11.5 Electrostatic Discharge Caution ............................ 51
11.6 Glossary ................................................................ 51
12 Mechanical, Packaging, and Orderable
Information ........................................................... 51
4 Revision History
Changes from Revision C (November 2016) to Revision D
Page
• Added top nav icon for TI Designs ........................................................................................................................................ 1
• Changed variable 1 spanning to go from Bit [3] to Bit [2] and variable 2 span from Bit [1] to Bit [0] in table 7 .................. 39
Changes from Revision B (May 2016) to Revision C
Page
• Changed wording of data sheet title....................................................................................................................................... 1
Changes from Revision A (October 2014) to Revision B
Page
• Added several new Applications ............................................................................................................................................ 1
• Changed Handling Ratings to ESD Ratings; moved storage temperature to Abs Max table ............................................... 4
• Changed RθJA value from 36.6C/W to 33.3C/W; add additional thermal information ............................................................. 4
• Added Community Resources section ................................................................................................................................ 51
Changes from Original (March 2013) to Revision A
Page
• Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1
2
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Copyright © 2013–2016, Texas Instruments Incorporated





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