WVGA DMD. DLP3034-Q1 Datasheet

DLP3034-Q1 DMD. Datasheet pdf. Equivalent


Part DLP3034-Q1
Description 0.3-Inch WVGA DMD
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DLP3034-Q1
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
DLP3034-Q1
DLPS176A – APRIL 2019 – REVISED SEPTEMBER 2019
DLP3034-Q1 0.3-Inch WVGA 405-nm DMD for Automotive Display
1 Features
1 Automotive qualified
– –40°C to 105°C operating temperature range
for DMD array
• Supports 405-nm illumination sources
• 0.3-inch diagonal micromirror array
– 7.6-µm micromirror pitch
– ±12° micromirror tilt angle (relative to flat state)
– Side illumination for optimized efficiency
• WVGA (864 × 480) resolution
• Polarization independent spatial light modulator
– Compatible with LED or laser light sources
• Low-power consumption: 105-mW (typical)
• Operating temperature range: –40°C to 105°C
• Hermetic package with 2.5°C/W thermal efficiency
• JTAG boundary scan to allow in-system validation
• Compatible with the DLPC120-Q1 automotive
DMD controller
• 78-MHz DDR DMD interface
2 Applications
• Transparent window display for front, side, and
rear vehicle windows
3 Description
The DLP3034-Q1 automotive DMD is primarily
targeted for transparent window display applications.
This chipset can be coupled with 405-nm illumination
sources (e.g. LEDs or lasers) in an optical projection
system to project onto windows embedded with
emissive phosphor films. When these transparent
emissive films are excited with 405-nm light from a
DLP3034-Q1 projector, the window becomes a
display emitting light in the visible spectrum. In
addition, this chipset enables high power optical
systems with a wide dynamic range and fast
switching speeds that do not vary with temperature.
PART NUMBER
DLP3034-Q1
Device Information(1)
PACKAGE
BODY SIZE (NOM)
FYJ (149)
22.30 mm × 32.20 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
DLP® DLP3034-Q1 Block System Diagram
Host
SPI
24-bit RGB
& Syncs
Reset
Power Good
Color & Dimming control
SPI
Flash
DLPC120-Q1
Video
Processing &
DMD
Formatting
I2C
Illumination
Control
& Feedback
TMS320
F28023
Color Controller &
Driver
LED(s)
Illumination
Optics
Window with
Embedded
Phosphor
Film(s)
LED Enable
Timing Control
Data &
Address
Data & Control
I2C
TMP411
-Q1
DLP3034-Q1
.3" WLP(H) s450
405nm DMD
DMD Power
Projection
Optics
DDR-2 DRAM
frame buffer
Power Enable
TPS65100
-Q1
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DLP3034-Q1
DLP3034-Q1
DLPS176A – APRIL 2019 – REVISED SEPTEMBER 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 Storage Conditions.................................................... 6
6.3 ESD Ratings.............................................................. 6
6.4 Recommended Operating Conditions....................... 7
6.5 Thermal Information .................................................. 9
6.6 Electrical Characteristics........................................... 9
6.7 Timing Requirements .............................................. 11
6.8 Switching Characteristics ........................................ 15
6.9 System Mounting Interface Loads .......................... 15
6.10 Physical Characteristics of the Micromirror Array. 16
6.11 Micromirror Array Optical Characteristics ............. 17
6.12 Window Characteristics......................................... 18
6.13 Chipset Component Usage Specification ............. 18
7 Detailed Description ............................................ 19
7.1 Overview ................................................................. 19
7.2 Functional Block Diagram ....................................... 19
7.3 Feature Description................................................. 19
7.4 System Optical Considerations............................... 25
7.5 Micromirror Array Temperature Calculation............ 25
7.6 Micromirror Landed-On/Landed-Off Duty Cycle ..... 26
8 Application and Implementation ........................ 28
8.1 Application Information............................................ 28
8.2 Typical Application .................................................. 28
8.3 Application Mission Profile Consideration............... 29
8.4 Illumination Mission Profile Considerations ............ 29
9 Power Supply Recommendations...................... 30
9.1 Power Supply Sequencing Requirements .............. 30
10 Layout................................................................... 32
10.1 Layout Guidelines ................................................. 32
10.2 Temperature Diode Pins ....................................... 32
10.3 Layout Example .................................................... 32
11 Device and Documentation Support ................. 33
11.1 Device Support...................................................... 33
11.2 Documentation Support ........................................ 34
11.3 Receiving Notification of Documentation Updates 34
11.4 Community Resources.......................................... 34
11.5 Trademarks ........................................................... 34
11.6 Electrostatic Discharge Caution ............................ 34
11.7 Device Handling .................................................... 34
11.8 Glossary ................................................................ 34
12 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2019) to Revision A
Page
• Changed the device status from Advance Information to Production Data............................................................................ 1
• Changed illumination power density specifications between 395-nm and 420-nm in the Recommended Operating
Conditions............................................................................................................................................................................... 7
• Added Illumination Mission Profile Considerations section to mention TI's testing at 405-nm wavelengths to be
considered in final implementation ....................................................................................................................................... 29
2
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