LINEAR REGULATOR. TPS79633QDCQRQ1 Datasheet

TPS79633QDCQRQ1 REGULATOR. Datasheet pdf. Equivalent

TPS79633QDCQRQ1 Datasheet
Recommendation TPS79633QDCQRQ1 Datasheet
Part TPS79633QDCQRQ1
Description LOW-DROPOUT LINEAR REGULATOR
Feature TPS79633QDCQRQ1; TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 Ultralow-Noise, High-PSRR, Fast, RF, 1-A LOW-DROPOUT .
Manufacture etcTI
Datasheet
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etcTI TPS79633QDCQRQ1
TPS796xx-Q1
www.ti.com
SBVS154 – MARCH 2012
Ultralow-Noise, High-PSRR, Fast, RF, 1-A
LOW-DROPOUT LINEAR REGULATORS
Check for Samples: TPS796xx-Q1
FEATURES
1
23 Qualified for Automotive Applications
• AEC-Q100 Test Guidance With the Following
Results:
– Device Temperature Grade 1: –40°C to
125°C Ambient Operating Temperature
Range
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C3A
• 1-A Low-Dropout Regulator With Enable
• Available in Fixed and Adjustable (1.2 V to
5.5 V) Versions
• High PSRR (53 dB at 10 kHz)
• Ultralow-Noise (40 μVRMS, TPS79630-Q1)
• Fast Start-Up Time (50 μs)
• Stable With a 1-μF Ceramic Capacitor
• Excellent Load/Line Transient Response
• Very Low Dropout Voltage (250 mV at Full
Load, TPS79630-Q1)
• SOT223-6 Package
APPLICATIONS
• RF: VCOs, Receivers, ADCs
• Audio
• Bluetooth™, Wireless LAN
DESCRIPTION
The TPS796xx-Q1 family of low-dropout (LDO), low-
power, linear voltage regulators features high power-
supply rejection ratio (PSRR), ultralow-noise, fast
start-up, and excellent line and load transient
responses in a small-outline SOT223-6 package.
Each device in the family is stable with a small 1-μF
ceramic capacitor on the output. The family uses an
advanced, proprietary BiCMOS fabrication process to
yield extremely low dropout voltages (for example,
250 mV at 1 A). Each device achieves fast start-up
times (approximately 50 μs with a 0.001-μF bypass
capacitor) while consuming very low quiescent
current (265 μA typical). Moreover, when the device
is placed in standby mode, the supply current is
reduced to less than 1 μA. The TPS79630-Q1
exhibits approximately 40 μVRMS of output voltage
noise at 3-V output, with a 0.1-μF bypass capacitor.
Applications with analog components that are noise-
sensitive, such as portable RF electronics, benefit
from the high-PSRR, low-noise features and the fast
response time.
DQC PACKAGE
SOT223-6
(TOP VIEW)
EN
1
IN
2
GND
3
OUT
4
NR/FB
5
6
GND
TPS79630-Q1
RIPPLE REJECTION
vs
FREQUENCY
80
70
VIN = 4 V
COUT = 10 mF
60
IOUT = 1 mA
CNR = 0.01 mF
50
IOUT = 1 A
40
30
20
10
0
1 10 100 1 k 10 k 100 k 1 M 10 M
Frequency (Hz)
TPS79630-Q1
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
0.7
VIN = 5.5 V
0.6 COUT = 2.2 mF
CNR = 0.1 mF
0.5
0.4
0.3
IOUT = 1 mA
0.2
0.1
0.0
100
IOUT = 1.5 A
1k
10 k
Frequency (Hz)
100 k
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
2
All other trademarks are the property of their respective owners.
3
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated



etcTI TPS79633QDCQRQ1
TPS796xx-Q1
SBVS154 – MARCH 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TPS79633-Q1
TPS79630-Q1
TPS79625-Q1
TPS79628-Q1
SPECIFIED
TEMPERATURE
RANGE, TA
–40°C to +125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
ORDERING INFORMATION(1)
PACKAGE TYPE,
PACKAGE
DESIGNATOR (2)
PACKAGE
MARKING
ORDERING NUMBER
SOT223-6, DCQ
79633Q
TPS79633QDCQRQ1
SOT223-6, DCQ
PREVIEW
TPS79630QDCQRQ1
SOT223-6, DCQ
PREVIEW
TPS79625QDCQRQ1
SOT223-6, DCQ
PREVIEW
TPS79628QDCQRQ1
TRANSPORT
MEDIA,
QUANTITY
Reel, 2500
Reel, 2500
Reel, 2500
Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating temperature range (unless otherwise noted).
VIN range
VEN range
VOUT range
Peak output current
Continuous total power dissipation
ESD ratings
Human Body Model (HBM) AEC-Q100 Classification Level H2
Charged Device Model (CDM) AEC-Q100 Classification Level C3A
UNIT
–0.3 V to 6 V
–0.3 V to VIN + 0.3 V
6V
Internally limited
See Thermal Information
table
2 kV
500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
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Copyright © 2012, Texas Instruments Incorporated



etcTI TPS79633QDCQRQ1
TPS796xx-Q1
www.ti.com
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
Ambient temperature, TA
THERMAL INFORMATION
THERMAL METRIC(1)(2)
θJA
θJCtop
θJB
ψJT
ψJB
θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
SBVS154 – MARCH 2012
MIN
–40°
NOM
MAX
125
UNIT
°C
TPS796xx-Q1
DCQ
6 PINS
70.4
70
N/A
6.8
30.1
6.3
UNIT
°C/W
°C/W
°C/W
°C/W°
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953A.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
Copyright © 2012, Texas Instruments Incorporated
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