IGBT. SK75GD12T4ETE2 Datasheet

SK75GD12T4ETE2 IGBT. Datasheet pdf. Equivalent

SK75GD12T4ETE2 Datasheet
Recommendation SK75GD12T4ETE2 Datasheet
Part SK75GD12T4ETE2
Description IGBT
Feature SK75GD12T4ETE2; SK75GD12T4ETE2 SEMITOP®E2 IGBT module SK75GD12T4ETE2 Features* • Low inductive design • Press-Fit c.
Manufacture Semikron
Datasheet
Download SK75GD12T4ETE2 Datasheet




Semikron SK75GD12T4ETE2
SK75GD12T4ETE2
SEMITOP®E2
IGBT module
SK75GD12T4ETE2
Features*
• Low inductive design
• Press-Fit contact technology
• Rugged mounting due to integrated
mounting clamps
• Heat transfer and insulation through
direct copper bonded aluminium oxide
ceramic (DBC)
• Trench4 IGBT technology
• Robust and soft switching CAL4F
diode technology
• Integrated NTC temperature sensor
• UL recognized file no. E 63 532
Typical Applications
• Motor drives
• Servo drives
• Air conditioning
• Auxiliary Inverters
• UPS
Absolute Maximum Ratings
Symbol Conditions
IGBT 1
VCES
IC
IC
ICnom
ICRM
VGES
tpsc
Tj
Tj = 25 °C
λpaste=0.8 W/(mK)
Tj = 175 °C
λpaste=2.5 W/(mK)
Tj = 175 °C
Ts = 25 °C
Ts = 70 °C
Ts = 25 °C
Ts = 70 °C
ICRM = 3 x ICnom
VCC = 800 V
VGE 15 V
VCES 1200 V
Tj = 150 °C
Absolute Maximum Ratings
Symbol Conditions
Diode 1
VRRM
IF
IF
IFnom
IFRM
IFSM
Tj
Tj = 25 °C
λpaste=0.8 W/(mK)
Tj = 175 °C
λpaste=2.5 W/(mK)
Tj = 175 °C
Ts = 25 °C
Ts = 70 °C
Ts = 25 °C
Ts = 70 °C
IFRM = 2 x IFnom
10 ms
sin 180°
Tj = 25 °C
Tj = 150 °C
Absolute Maximum Ratings
Symbol Conditions
Module
It(RMS)
Tstg
Visol
Tterminal at PCB joint = 30 K, per pin
AC, sinusoidal, t = 1 min
Values
1200
88
71
113
92
75
225
-20 ... 20
10
-40 ... 175
Values
1200
79
62
101
81
75
150
430
430
-40 ... 175
Values
30
-40 ... 125
2500
Unit
V
A
A
A
A
A
A
V
µs
°C
Unit
V
A
A
A
A
A
A
A
A
°C
Unit
A
°C
V
GD-ET
© by SEMIKRON
Rev. 1.0 – 08.01.2020
1



Semikron SK75GD12T4ETE2
SK75GD12T4ETE2
SEMITOP®E2
IGBT module
SK75GD12T4ETE2
Features*
• Low inductive design
• Press-Fit contact technology
• Rugged mounting due to integrated
mounting clamps
• Heat transfer and insulation through
direct copper bonded aluminium oxide
ceramic (DBC)
• Trench4 IGBT technology
• Robust and soft switching CAL4F
diode technology
• Integrated NTC temperature sensor
• UL recognized file no. E 63 532
Typical Applications
• Motor drives
• Servo drives
• Air conditioning
• Auxiliary Inverters
• UPS
Characteristics
Symbol Conditions
IGBT 1
VCE(sat)
VCE0
rCE
VGE(th)
ICES
Cies
Coes
Cres
QG
RGint
td(on)
tr
Eon
td(off)
tf
Eoff
IC = 75 A
VGE = 15 V
chiplevel
Tj = 25 °C
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
VGE = 15 V
chiplevel
Tj = 25 °C
Tj = 150 °C
VGE = VCE, IC = 3 mA
VGE = 0 V, VCE = 1200 V, Tj = 25 °C
VCE = 25 V
VGE = 0 V
f = 1 MHz
f = 1 MHz
f = 1 MHz
VGE = -15V ... +15V
Tj = 25 °C
VCC = 600 V
Tj = 150 °C
IC = 75 A
VGE = +15/-15 V
RG on = 1.1 Ω
RG off = 1.1 Ω
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
di/dton = 2410 A/µs Tj = 150 °C
di/dtoff = 593 A/µs
dv/dt = 4035 V/µs Tj = 150 °C
Rth(j-s)
Rth(j-s)
per IGBT, λpaste=0.8 W/(mK)
per IGBT, λpaste=2.5 W/(mK)
Characteristics
Symbol Conditions
Diode 1
VF
VF0
rF
IRRM
Qrr
Err
Rth(j-s)
Rth(j-s)
IF = 75 A
Tj = 25 °C
chiplevel
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
IF = 75 A
Tj = 150 °C
di/dtoff = 2410 A/µs
VGE = -15 V
VCC = 600 V
Tj = 150 °C
Tj = 150 °C
per Diode, λpaste=0.8 W/(mK)
per Diode, λpaste=2.5 W/(mK)
min.
5
typ.
1.85
2.25
0.80
0.70
14
21
5.8
4.4
0.29
0.235
553
10
129
42
6.62
333
65
7.11
0.61
0.39
max. Unit
2.10
V
2.45
V
0.90
V
0.80
V
16
mΩ
22
mΩ
6.5
V
1
mA
nF
nF
nF
nC
Ω
ns
ns
mJ
ns
ns
mJ
K/W
K/W
min.
typ.
2.17
2.11
1.30
0.90
12
16
114
11.22
4.41
0.82
0.55
max. Unit
2.49
V
2.42
V
1.50
V
1.10
V
13
mΩ
18
mΩ
A
µC
mJ
K/W
K/W
GD-ET
2
Rev. 1.0 – 08.01.2020
© by SEMIKRON



Semikron SK75GD12T4ETE2
SK75GD12T4ETE2
SEMITOP®E2
IGBT module
Characteristics
Symbol Conditions
Module
Ms
w
to heatsink
weight
min.
typ.
max. Unit
1.6
2.3
Nm
35
g
Characteristics
Symbol Conditions
Temperature Sensor
R100
Tr = 100 °C
B100/125
R(T)=R100exp[B100/125(1/T-1/T100)]; T[K];
min.
typ.
493 ± 5%
3550
±2%
max.
Unit
Ω
K
SK75GD12T4ETE2
Features*
• Low inductive design
• Press-Fit contact technology
• Rugged mounting due to integrated
mounting clamps
• Heat transfer and insulation through
direct copper bonded aluminium oxide
ceramic (DBC)
• Trench4 IGBT technology
• Robust and soft switching CAL4F
diode technology
• Integrated NTC temperature sensor
• UL recognized file no. E 63 532
Typical Applications
• Motor drives
• Servo drives
• Air conditioning
• Auxiliary Inverters
• UPS
GD-ET
© by SEMIKRON
Rev. 1.0 – 08.01.2020
3







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