PWM Switcher. TPS54353 Datasheet

TPS54353 Switcher. Datasheet pdf. Equivalent

TPS54353 Datasheet
Recommendation TPS54353 Datasheet
Part TPS54353
Description 3-A Output Synchronous PWM Switcher
Feature TPS54353; www.ti.com 6,4 mm y 5,0 mm TPS54352, TPS54353 TPS54354, TPS54355 TPS54356, TPS54357 SLVS519A − MAY.
Manufacture etcTI
Datasheet
Download TPS54353 Datasheet




etcTI TPS54353
www.ti.com
6,4 mm y 5,0 mm
TPS54352, TPS54353
TPS54354, TPS54355
TPS54356, TPS54357
SLVS519A − MAY 2004 − REVISED OCTOBER 2004
4.5ĆV TO 20ĆV INPUT, 3ĆA OUTPUT SYNCHRONOUS PWM
SWITCHER WITH INTEGRATED FET (SWIFT)
FEATURES
D 100 m, 4.5-A Peak MOSFET Switch for High
Efficiency at 3-A Continuous Output Current
D Uses External Lowside MOSFET or Diode
D Fixed Output Versions −
1.2V/1.5V/1.8V/2.5V/3.3V/5.0V
D Internally Compensated for Low Parts Count
D Synchronizes to External Clock
D 1805 Out of Phase Synchronization
D Wide PWM Frequency − Fixed 250 kHz,
500 kHz or Adjustable 250 kHz to 700 kHz
D Internal Slow Start
D Load Protected by Peak Current Limit and
Thermal Shutdown
D Adjustable Undervoltage Lockout
D 16-Pin TSSOP PowerPADE Package
APPLICATIONS
D Industrial & Commercial Low Power Systems
D LCD Monitors and TVs
D Computer Peripherals
D Point of Load Regulation for High
Performance DSPs, FPGAs, ASICs and
Microprocessors
SIMPLIFIED SCHEMATIC
TPS54356
SYNC
VIN
PWRGD
ENA
BIAS
BOOT
PH
LSG
PGND
VSENSE
PWRPAD
Input
Voltage
Output
Voltage
DESCRIPTION
The TPS5435x is a medium output current synchronous
buck PWM converter with an integrated high side
MOSFET and a gate driver for an optional low side
external MOSFET. Features include a high performance
voltage error amplifier that enables maximum
performance under transient conditions. The TPS5435x
has an under-voltage-lockout circuit to prevent start-up
until the input voltage reaches a preset value; an internal
slow-start circuit to limit in-rush currents; and a power good
output to indicate valid output conditions. The
synchronization feature is configurable as either an input
or an output for easy 180° out of phase synchronization.
The TPS5435x devices are available in a thermally
enhanced 16-pin TSSOP (PWP) PowerPADpackage.
TI provides evaluation modules and the SWIFTDesigner
software tool to aid in quickly achieving high-performance
power supply designs to meet aggressive equipment
development cycles.
100
95
90
85
80
75
70
65
60
55
50
0
EFFICIENCY
vs
OUTPUT CURRENT
VI = 6 V
VI = 12 V
VI= 12 V
VO= 3.3 V
fs = 500 kHz
1
2
3
4
IO − Output Current − A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD and SWIFT are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2004, Texas Instruments Incorporated



etcTI TPS54353
TPS54352, TPS54353
TPS54354, TPS54355
TPS54356, TPS54357
SLVS519A − MAY 2004 − REVISED OCTOBER 2004
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
OUTPUT VOLTAGE
PACKAGE
PART NUMBER
1.2 V
Plastic HTSSOP (PWP)
TPS54352PWP
1.5 V
Plastic HTSSOP (PWP)
TPS54353PWP
−40°C to 85°C
1.8 V
2.5 V
Plastic HTSSOP (PWP)
Plastic HTSSOP (PWP)
TPS54354PWP
TPS54355PWP
3.3 V
Plastic HTSSOP (PWP)
TPS54356PWP
5.0 V
Plastic HTSSOP (PWP)
TPS54357PWP
(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e. TPS5435xPWPR).
PACKAGE DISSIPATION RATINGS(1)
PACKAGE
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
TA = 25°C
POWER RATING
16-Pin PWP with solder(2)
42.1°C/W
2.36
16-Pin PWP without solder
151.9°C/W
0.66
(1) See Figure 47 for power dissipation curves.
(2) Test Board Conditions
1. Thickness: 0.062”
2. 3” x 3”
3. 2 oz. Copper traces located on the top and bottom of the PCB for soldering
4. Copper areas located on the top and bottom of the PCB for soldering
5. Power and ground planes, 1 oz. copper (0.036 mm thick)
6. Thermal vias, 0.33 mm diameter, 1.5 mm pitch
7. Thermal isolation of power plane
For more information, refer to TI technical brief SLMA002.
TA = 70°C
POWER RATING
1.31
0.36
TA = 85°C
POWER RATING
0.95
0.26
2



etcTI TPS54353
www.ti.com
TPS54352, TPS54353
TPS54354, TPS54355
TPS54356, TPS54357
SLVS519A − MAY 2004 − REVISED OCTOBER 2004
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
VIN
VSENSE
Input voltage range, VI
UVLO
SYNC
ENA
BOOT
VBIAS
LSG
SYNC
Output voltage range, VO
RT
PWRGD
COMP
PH
PH
Source current, IO
LSG (Steady State Current)
COMP, VBIAS
SYNC
LSG (Steady State Current)
Sink current, IS
PH (Steady State Current)
COMP
ENA, PWRGD
Voltage differential
AGND to PGND
Operating virtual junction temperature range, TJ
Storage temperature, Tstg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
UNIT
−0.3 V to 21.5 V
−0.3 V to 8.0 V
−0.3 V to 8.0 V
−0.3 V to 4.0 V
−0.3 V to 4.0 V
VI(PH) + 8.0 V
−0.3 to 8.5 V
−0.3 to 8.5 V
−0.3 to 4.0 V
−0.3 to 4.0 V
−0.3 to 6.0 V
−0.3 to 4.0 V
−1.5 V to 22 V
Internally Limited (A)
10 mA
3 mA
5 mA
100 mA
500 mA
3 mA
10 mA
±0.3 V
−40°C to +150°C
−65°C to +150°C
260°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
Human body model
CDM
RECOMMENDED OPERATING CONDITIONS
Input voltage range, VI
Operating junction temperature, TJ
MIN MAX UNIT
600 V
1.5 kV
TPS54352−6
TPS54357
MIN NOM MAX UNIT
4.5
20
V
6.65
20
−40
125 °C
3







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